ECSS-E-ST-20-07C Rev. 1
7 February 2012
Space engineering
Electromagnetic compatibility
ECSS Secretariat
ESA-ESTEC
Requirements & Standards Division
Noordwijk, The Netherlands
ECSSEST2007CRev.1
7February2012
2
Foreword
This Standard is one of the series of ECSS Standards intended to be applied together for the
management, engineering and product assurance in space projects and applications. ECSS is a
cooperative effort of the European Space Agency, national space agencies and European industry
associationsforthepurposeofdevelopingandmaintainingcomm
onstandards.Requirementsinthis
Standardaredefinedintermsofwhatshallbeaccomplished,ratherthanintermsofhowtoorganize
and perform the necessary work. This allows existing organizational structures and methods to be
appliedwheretheyareeffective,andforthestructuresandmethodstoevolveasnecessarywithout
rewrit
ingthestandards.
This Standard has been prepared by the ECSSEST2007 Working Group, reviewed by the ECSS
ExecutiveSecretariatandapprovedbytheECSSTechnicalAuthority.
Disclaimer
ECSSdoesnotprovideanywarrantywhatsoever,whetherexpressed,implied,orstatutory,including,
butnotlimitedto,anywa
rrantyofmerchantabilityorfitnessforaparticularpurposeoranywarranty
that the contents of the item are errorfree. In no respect shall ECSS incur any liability for any
damages,including,butnotlimitedto,direct,indirect,special,orconsequentialdamagesarisingout
of,resultingfrom,orin an
ywayconnectedto theuseof thisStandard,whether ornotbasedupon
warranty,businessagreement,tort,orotherwise;whetherornotinjurywassustainedbypersonsor
propertyorotherwise;andwhetherornotlosswassustainedfrom,oraroseoutof,theresultsof,the
item,oranyservi
cesthatmaybeprovidedbyECSS.
Publishedby: ESARequirementsandStandardsDivision
ESTEC,P.O.Box299,
2200AGNoordwijk
TheNetherlands
Copyright: 2012©bytheEuropeanSpaceAgencyforthemembersofECSS
ECSSEST2007CRev.1
7February2012
3
Change log
ECSSEST2007A Neverissued
ECSSEST2007B Neverissued
ECSSEST2007C
31July2008
Firstissue
ECSSEST2007C
Rev.1
7February2012
FirstissueRevision1
ChangeswithrespecttoECSSEST02007C(31July2008)areidentifiedwith
revisiontracking.
Requirementsmodified:
4.2.5.1a.:correctedcrossreferenceinNoteto5.4.5.
4.2.11.2e.:Notewithexampledeleted
4.2.11.2g:modified
5.
2.1a.1.and5.modified
5.3.3a.tod.modified
5.3.4a.:Note2deletedandquotesignintextcorrected
5.4.3.3a.3.(a):addedtorequirementʺfordifferentialmodetestingand
Figure59forcommonmodetestingʺ
5.4.4.4a.3.(b):correctedinrequirementreferencetoEUTswitchtoread
ʺFigure511
.bʺ
5.4.9.2a.2ʺ.:changedbandwidthfromʺ10MHzʺtoʺ50MHzʺ
5.4.11.3e.2.:correctedreferencetoFiguretoreadʺFigure527ʺ
Editorialcorrectionsinrequirements:
Thepossessivecaselikenotation‘susedtomeanpluralafter
acronymshavebeencorrected,e.g.“EEDʹs“and“LISNʹs“ha
sbeen
changedinto“EEDs“respectively“LISNs“whenitmeanspluralin
4.2.2.2c,5.2.4a,5.2.4b,5.2.4c,5.2.6.3a,5.2.6.5a,5.2.6.6.3.c,5.2.6.6.3.d,
5.2.6.6.3.f,5.3.2b,5.4.3.2.a.9
Correctedin5.3.4atheincorrect“unquote“sign.
5.4.4.5bNOTE:CorrectedtypoinwordʺTypicalʺ
Modificationsininformativeparts:
4.2.11.1:addedreferencetoclause4.2.11.2andFig
ure41(Figurewas
movedfrom4.2.11.3),correctedstyleofparagraphfromʺrequirementʺto
ʺinformativetextʺ.TextofNotemodified.
ECSSEST2007CRev.1
7February2012
4
Figure41modifiedandmovedtoclause4.2.11.1.
5.4.1:correctedreferencefromʺ5.4.11.4ʺtoreadʺ5.4.12ʺ
Table53:cross‐referencesinlastcolumncorrected.
AnnexA.2:correctedin3rdbulletʺICEʺtoreadʺI
CEʺ,ʺmeasurementʺto
readʺmeasurementsʺʺandreferencetoreadʺFigureA1ʺ
FigureA1:CaptionofFiguremodified
FigureA2movedfromA.2toA.4
A.4:correctedin2ndbulletreferencetoreadʺFigureA2ʺ
FigureA3movedtoA.9
A.6.2:Formulacorr
ected
A.9:correctedin2ndand4thbulletreferencetoreadʺFigureA3ʺ
FigureA4movedtoA.10
A.10:correctedinfirstparagraphreferencetoreadʺ5.4.7ʺ
A.10:correctedin1stbulletreferencetoreadʺFigureA4ʺ
A.11:correctedinfirstparagraphre
ferencetoreadʺ5.4.8ʺ
A.13:correctedinfirstparagraphreferencetoreadʺ5.4.10ʺ
A.14:correctedinfirstparagraphreferencetoreadʺ5.4.11ʺ
A.15:correctedinfirstparagraphreferencetoreadʺ5.4.12ʺ
ECSSEST2007CRev.1
7February2012
5
Table of contents
Change log.................................................................................................................3
Introduction................................................................................................................9
1 Scope.....................................................................................................................10
2 Normative references...........................................................................................11
3 Terms, definitions and abbreviated terms..........................................................12
3.1 Terms from
other standards .....................................................................................12
3.2 Terms specific to the pre
sent standard ....................................................................13
3.3 Abbreviated terms
....................................................................................................15
4 Requirements........................................................................................................17
4.1 General system requirements
..................................................................................17
4.2 Detailed system requirements
..................................................................................17
4.2.1 Overview
.....................................................................................................17
4.2.2 EMC
with the launch system ......................................................................17
4.2.3 Lightning en
vironment ................................................................................18
4.2.4 Spacecraft charging and
effects.................................................................18
4.2.5 Spacecraft
DC magnetic emission .............................................................19
4.2.6 Radiofrequency compatibility
......................................................................20
4.2.7 Hazards of
electromagnetic radiation.........................................................20
4.2.8 Intrasystem EMC
........................................................................................20
4.2.9 EMC
with ground equipment ......................................................................21
4.2.10 Grounding
...................................................................................................21
4.2.11 Electrical bo
nding requirements .................................................................22
4.2.12 Shielding (e
xcepted wires and cables).......................................................23
4.2.13 Wiring (inclu
ding wires and cables shielding).............................................23
5 Verification............................................................................................................25
5.1 Overview
..................................................................................................................25
5.1.1 Introduction
.................................................................................................25
5.1.2 Electromagnetic effect
s verification plan ....................................................25
ECSSEST2007CRev.1
7February2012
6
5.1.3 Electromagnetic effects verification report..................................................25
5.2 Test condit
ions .........................................................................................................25
5.2.1 Measureme
nt tolerances............................................................................25
5.2.2 Test site
......................................................................................................26
5.2.3 Ground plane
..............................................................................................28
5.2.4 Power source impedance
...........................................................................28
5.2.5 General test precautions
............................................................................30
5.2.6 EUT test configurations
..............................................................................30
5.2.7 Operation of EUT
........................................................................................33
5.2.8 Use of measurement equipment
................................................................34
5.2.9 Emission testing
.........................................................................................35
5.2.10 Susceptibilit
y testing...................................................................................37
5.2.11 Calibration
of measuring equipment...........................................................38
5.3 System leve
l .............................................................................................................39
5.3.1 General
.......................................................................................................39
5.3.2 Safety marg
in demonstration for critical or EED circuits ............................39
5.3.3 EMC
with the launch system ......................................................................39
5.3.4 Lightning
.....................................................................................................40
5.3.5 Spacecraft and
static charging ...................................................................40
5.3.6 Spacecraft
DC magnetic field emission......................................................40
5.3.7 Intra–system electroma
gnetic compatibility................................................40
5.3.8 Radiofrequency compatibility
......................................................................40
5.3.9 Grounding
...................................................................................................41
5.3.10 Electrical bo
nding .......................................................................................41
5.3.11 Wiring and shielding
...................................................................................41
5.4 Equipment and subsyst
em level test procedures.....................................................41
5.4.1 Overview
.....................................................................................................41
5.4.2 CE, power l
eads, differential mode, 30 Hz to 100 kHz...............................42
5.4.3 CE, power a
nd signal leads, 100 kHz to 100 MHz .....................................44
5.4.4 CE, power l
eads, inrush current .................................................................47
5.4.5 DC Magneti
c field emission, magnetic moment .........................................49
5.4.6 RE, electric
field, 30 MHz to 18 GHz..........................................................52
5.4.7 CS, power l
eads, 30 Hz to 100 kHz............................................................56
5.4.8 CS, bulk ca
ble injection, 50 kHz to 100 MHz..............................................58
5.4.9 CS, power l
eads, transients........................................................................62
5.4.10 RS, magneti
c field, 30 Hz to 100 kHz.........................................................65
5.4.11 RS, electric
field, 30 MHz to 18 GHz..........................................................68
ECSSEST2007CRev.1
7February2012
7
5.4.12 Susceptibility to electrostatic discharges....................................................74
Annex A (informative) Subsystem and equipment limits.....................................79
A.1 Overview
..................................................................................................................79
A.2 CE on powe
r leads, differential mode, 30 Hz to 100 MHz........................................79
A.3 CE on powe
r leads, in-rush currents........................................................................81
A.4 CE on powe
r and signal leads, common mode, 100 kHz to 100 MHz .....................81
A.5 CE on antenna ports
................................................................................................82
A.6 DC magneti
c field emission......................................................................................82
A.6.1 General
.......................................................................................................82
A.6.2 Characterization
.........................................................................................83
A.6.3 Limit
............................................................................................................84
A.7 RE, low-freq
uency magnetic field.............................................................................84
A.8 RE, low-freq
uency electric field................................................................................84
A.9 RE, electric
field, 30 MHz to 18 GHz........................................................................85
A.10 CS, power l
eads, differential mode, 30 Hz to 100 kHz.............................................86
A.11 CS, power a
nd signal leads, common mode, 50 kHz to 100 MHz ...........................87
A.12 CS, power l
eads, short spike transients...................................................................87
A.13 RS, magneti
c field, 30 Hz to 100 kHz.......................................................................88
A.14 RS, electric
field, 30 MHz to 18 GHz........................................................................89
A.15 Susceptibilit
y to electrostatic discharge....................................................................90
Figures
Figure 4-1: Bonding requirements..........................................................................................22
Figure 5-1: RF absorber loading diagram ..............................................................................27
Figure 5-2: Line impedance stabilization network schematic.................................................29
Figure 5-3: General test setup................................................................................................31
Figure 5-4: Typical calibration fixture .....................................................................................35
Figure 5-5: Conducted emission, 30 Hz to 100 kHz, measurement system check................44
Figure 5-6: Conducted emission, 30 Hz to 100 kHz, measurement setup.............................44
Figure 5-7: Conducted emission, measurement system check..............................................45
Figure 5-8: Conducted emission, measurement setup in differential mode ...........................45
Figure 5-9: Conducted emission, measurement setup in common mode..............................46
Figure 5-10: Inrush current: measurement system check setup ............................................48
Figure 5-11: Inrush current: measurement setup...................................................................48
Figure 5-12: Smooth deperm procedure ................................................................................52
Figure 5-13: Electric field radiated emission. Basic test setup...............................................54
Figure 5-14: Electric field radiated emission. Antenna positioning.........................................54
ECSSEST2007CRev.1
7February2012
8
Figure 5-15: Electric field radiated emission. Multiple antenna positions...............................55
Figure 5-16: CS, power leads, measurement system check set-up.......................................57
Figure 5-17: CS, power leads, signal injection.......................................................................57
Figure 5-18: Bulk cable injection, measurement system check set-up ..................................61
Figure 5-19: Signal test waveform..........................................................................................61
Figure 5-20: CS of power and signal leads, bulk cable injection............................................61
Figure 5-21: CS of power leads, transients, calibration set-up...............................................63
Figure 5-22: CS of power leads, spike series injection test setup..........................................63
Figure 5-23: CS of power leads, spike parallel injection test setup........................................64
Figure 5-24: Measurement system check configuration of the radiating system ...................66
Figure 5-25: Basic test set-up ................................................................................................66
Figure 5-26: Test equipment configuration.............................................................................70
Figure 5-27: RS Electric field. Multiple test antenna positions ...............................................71
Figure 5-28: Receive antenna procedure...............................................................................71
Figure 5-29: Spacecraft charging ESD susceptibility test ......................................................76
Figure 5-30: Susceptibility to ESD: calibration configuration..................................................77
Figure 5-31: Susceptibility to ESD: test equipment configuration ..........................................77
Figure A-1 : Power leads, differential mode conducted emission limit...................................80
Figure A-2 : Common mode conducted emission limit...........................................................82
Figure A-3 : Radiated electric field limit..................................................................................85
Figure A-4 : Conducted susceptibility limit, frequency domain...............................................86
Figure A-5 : CS, voltage spike in percentage of test bus voltage...........................................88
Figure A-6 : Radiated susceptibility limit ................................................................................89
Tables
Table 5-1: Absorption at normal incidence.............................................................................27
Table 5-2: Bandwidth and measurement time........................................................................36
Table 5-3: Correspondence between test procedures and limits...........................................42
Table A-1 : Equipment: susceptibility to conducted interference, test signal .........................87
ECSSEST2007CRev.1
7February2012
9
Introduction
Electromagnetic compatibility (EMC) of a space system or equipment is the
ability to function satisfactorily in its electromagnetic environment without
introducing intolerable electromagnetic disturbances to anything in that
environment.
The space system is designed to be compatible with its external natural,
induced,ormanmade electromagneticenvironment. Natural components are
lightning for la
unchers, the terrestrial magnetic field for space vehicles.
Spacecraft charging is defined as voltage buildingup of a space vehicle or
spacecraftunitswhenimmergedinplasma.Electrostaticdischargesresultfrom
spacecraft charging with possible detrimental effects. External manmade
interference, intentional or not, are caused by radar or telecommunication
bea
msduringgroundoperationsandthelaunchingsequence.IntersystemEMC
alsoappliesbetweenthelauncheranditspayloadorbetweenspacevehicles.
Intrasystem EMC is defined betweenall electrical,electronic, electromagnetic,
andelectromechanicalequipmentwithinthespacevehicleandbythepresence
of its selfinduced electromagnetic environment. It comprises the int
entional
radiated electromagnetic fields and parasitic emission from onboard
equipment. Both conducted and radiated emissions are concerned. An
electromagnetic interference safety margin is defined at system critical points
bycomparisonofnoiselevelandsusceptibilityatthesepoints.
ECSSEST2007CRev.1
7February2012
10
1
Scope
EMCpolicyandgeneralsystemrequirementsarespecifiedinECSSEST20.
This ECSSEST2007 Standard addresses detailed system requirements
(Clause4), ge
neral test conditions, verification requirements at system level,
and test methods at subsystem and equipment level (Clause 5) as well as
inform
ativelimits(AnnexA).
Assoc
iated to this standard is ECSSEST2006 “Spacecraft charging”, which
addressescharging controland risksarising fromenvironmentaland vehicle
inducedspacecraftchargingwhen ECSSEST2007addresseselectromagnetic
effectsofelectrostaticdischarges.
Annexes A to C of ECSSEST20 document EMC a
ctivities related to
ECSSEST2007: the EMC Control Plan (AnnexA) defines the approach,
methods,procedures, resources,and organization, the ElectromagneticEffects
Verification Plan (AnnexB) defines and specifies the verification processes,
analyses and tests, and the Electromagnetic Effects Verification Report
(AnnexC)documentverification results.The EMEVPandtheEME
VRare the
vehiclesfortailoringthisstandard.
Thisstandardmaybetailoredforthespecificcharacteristicandconstrainsofa
spaceprojectinconformancewithECSSSST00.
ECSSEST2007CRev.1
7February2012
11
2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references,subsequentamendmentsto,orrevisionofanyofthesepublications
donotapply,However,partiestoagreementsbasedonthisECSSStandardare
encouragedtoinvestigatethepossibilityofapplyingthemorere
centeditionsof
the normative documents indicated below. For undated references, the latest
editionofthepublicationreferredtoapplies.
ECSSSST0001 ECSSsystem‐Glossaryofterms
ECSSEST20 Spaceengineering‐Electricalandelectronic
ECSSEST2006 Spaceengineering‐Spacecraftcharging
ECSSEST3311 Spaceeng
ineering‐Explosivesystemsanddevices
ECSSEST5014 SpaceengineeringSpacecraftdiscreteinterfaces
IEC6100042
(Edition1.2)
Electromagneticcompatibility(EMC)‐Part42:
Testingandmeasurementtechniques‐Electrostatic
dischargeimmunitytest
ECSSEST2007CRev.1
7February2012
12
3
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from
ECSSSST0001apply,inparticularforthefollowingterms:
criticalitem
customer
equipment
item
launcher,launchvehicle
mission
requirement
safetycriticalfunction
supplier
spacecraft,spacevehicle
subsystem
system
test
verification
ForthepurposesofthisStandard,thef
ollowingtermshaveaspecificdefinition
containedinECSSEST20:
conductedemission
electromagneticcompatibility
electromagneticcompatibilitycontrol
electromagneticinterference
electromagneticinterferencesafetymargin
emission
highvoltage
lightningindirecteffects
ECSSEST2007CRev.1
7February2012
13
radiatedemission
radiofrequency
susceptibility
susceptibilitythreshold
For the purposes of this document, the following terms have a specific
definitioncontainedinECSSEST2006:
electrostaticdischarge(ESD)
secondaryarc
Forthepurposesofthisdocument,thefollowingtermhasaspecificdefinition
containedinECSSEST3311
:
electroexplosivedevice(EED)
3.2 Terms specific to the present standard
3.2.1 ambient level
levelofradiatedandconductedsignal,andnoisethatexistatthespecifiedtest
locationandtimewhentheequipmentundertestisnotoperating
NOTE E.g.atmospherics,interferencefromothersources,
and circuit noise or other interference generated
within the measuring set compose the “ambient
level”.
3.2.2 antenna factor
factorthat,whenproperlyappliedtothevoltageattheinputterminals of the
measuringinstrument,yieldstheelectricormagneticfieldstrength
NOTE1 Thisfactorincludestheeffectsofantennaeffective
length,mismatch,andtransmissionlosses.
NOTE2 Theelectricfieldstrengthisnormallyexpressedin
V/mandthema
gneticfieldstrengthinA/morT.
3.2.3 common mode voltage
voltagedifferencebetweensourceandreceivergroundreferences
3.2.4 contact discharge method
method of testing in which theelectrode of the highvoltage test generator is
held in contact with the discharge circuit, and the discharge actuated by a
dischargeswitch
ECSSEST2007CRev.1
7February2012
14
3.2.5 electromagnetic environmental effects
impact of the electromagnetic environment upon equipment, systems, and
platforms
NOTE It encompasses all electromagnetic disciplines,
including electromagnetic compatibility;
electromagnetic interference, electromagnetic
vulnerability,hazardsofelectromagneticradiation
to personnel, electroexplosive devices, volatile
materials,andnaturalphenomenaeffects.
3.2.6 field strength
resultantoftheradiation,inductionandquasistaticcomponentsoftheelectric
ormagneticfield
NOTE The term “electric field strength” or “magnetic
field strength” is used, according to whether the
resultant,electricormagneticfield,respectively,is
measured.
3.2.7 ground plane
metalsheet or plateusedas acommon reference pointforcircuit returnsand
electricalorsignalpotentials
3.2.8 improper response
subsystem or equipment response which can be either inadvertent or
unacceptable
3.2.9 inadvertent response
propersubsystemfunctionalresponse(withinnormalrangeoflimits)actuated
by electromagnetic interference, but occurring at other than the normal
operational cycle, which in turn causes improper response to the total space
system
3.2.10 line impedance stabilization network (LISN)
network inserted in the supply leads of an apparatus to be tested which
provides, in a given frequency range, a specified source impedance for the
measurement of disturbance currents and voltages and which can isolate the
apparatusfromthesupplymainsinthatfrequencyrange
3.2.11 not operating
conditionwhereinnopowerisappliedtotheequipment
3.2.12 overshield
shieldsurroundingabundleorashieldedcable
3.2.13 passive intermodulation product
generation of a signal at frequency f = n*f1 + m*f2 from two signals at
frequencies f
1 and f2, where n and m are positive or negative integers, by a
passivedevice,usuallyanelectricalcontact
ECSSEST2007CRev.1
7February2012
15
3.2.14 port
place of access to a device or network where energy can be supplied or
withdrawn, or where the device or network variables can be observed or
measured
3.2.15 power quality requirements
requirements which define the conducted voltage noise or impedance the
powerusercanexpect
NOTE Noisee.g.fromloadregulation,spikes,andsags.
3.2.16 soft magnetic material
ferromagneticmaterialwithacoercivitysmallerthan100A/m
3.2.17 spurious emission
electromagnetic emission from the intended output terminal of an electronic
device,butoutsideofthedesignedemissionbandwidth
3.2.18 test antenna
antenna of specified characteristics designated for use under specified
conditionsinconductingtests
3.2.19 unit
equipmentthatisviewedasanentityforpurposesofanalysis,manufacturing,
maintenance,orrecordkeeping
NOTE E.g. hydraulic actuators, valves, batteries, and
individual electronic boxes such as onboard
computer, inertial measurement unit, reaction
wheel, star tracker, power conditioning unit,
transmitters,receivers,ormultiplexers.
3.3 Abbreviated terms
Forthepurposeofthisstandard,theabbreviatedtermsofECSSSST0001and
thefollowingapply:
Abbreviation Meaning
AC
alternatingcurrent
ACS
attitudecontrolsystem
AM
amplitudemodulation
AWG
Americanwiregauge
BCI
bulkcableinjection
CE
conductedemission
CS
conductedsusceptibility
CW
continuouswave
DC
directcurrent
ECSSEST2007CRev.1
7February2012
16
EED
electroexplosivedevice
EGSE
electricalgroundsupportequipment
EHF
extremelyhighfrequency(30GHz300GHz)
EMC
electromagneticcompatibility
EMCAB
electromagneticcompatibilityadvisoryboard
EMCCP
electromagneticcompatibilitycontrolplan
EMEVP
electromagneticeffectsverificationplan
EMEVR
electromagneticeffectsverificationreport
EMI
electromagneticinterference
EMISM
electromagneticinterferencesafetymargin
ESD
electrostaticdischarge
EUT
equipmentundertest
HV
highvolta
ge
ICD
interfacecontroldocument
LEO
lowEarthorbit
LF
lowfrequency
LISN
lineimpedancestabilizationnetwork
MGSE
mechanicalgroundsupportequipment
PAM
pulseamplitudemodulation
PCM
pulsecodedmodulation
RE
radiatedemission
RF
radiofrequency
r.m.s.
rootmeansquare
RS
radiatedsusceptibility
SHF
superhighfr
equency(3GHz30GHz)
ECSSEST2007CRev.1
7February2012
17
4
Requirements
4.1 General system requirements
EMC policy and general system requirements, and the spacecraft charging
protectionprogramarespecifiedinECSSEST20Electromagnetic
CompatibilityclauseandEMCPlanDRD.
4.2 Detailed system requirements
4.2.1 Overview
This clause 4.2 defines the requirements for design and realization at system
level.They arethe basisfor definitionof activitiesof theEMC programmeto
ensurespacesystemlevelcompatibilitywithminimumimpacttoprogramme,
cost,schedule,andoperationalcapabilities.
4.2.2 EMC with the launch system
4.2.2.1 Overview
Generalsystemrequirementsfor“EMCwiththelaunchsystem”aredefinedin
ECSSEST20.
4.2.2.2 Detailed system requirements
a. OverloadcapabilityofthespacecraftRFreceiversduringtheprelaunch
andlaunchphaseswithorwithoutfairing,shallbedemonstratedbythe
spacecraftsupplier.
NOTE1 It is expected the electromagnetic environment
generated by companion payloads is assessed by
the launching company and addressed in the
User’sManual.
NOTE2 A conductivefai
ring is likely to causeresonances
andcavityeffects.
b. Spacecraft equipment shall not exhibitany malfunction, degradationof
performanceordeviationbeyondthetoleranceindicatedinitsindividual
ECSSEST2007CRev.1
7February2012
18
specification after being exposed, even not operating, to the
electromagneticenvironmentfromthelauncherandlaunchsite.
NOTE Most of spacecraft equipment is not operating
during launch. During the launching sequence
spacecrafttransmittersandreceivers(platformand
payload) can be either in OFF‐ or ONstate
dependingonthelaunchvehicle.
c. Theelectrom
agneticinterferencesafetymargin(EMISM)ofsafetycritical
equipmentshall beapplied toequipment in ON stateduring prelaunch
andlaunchphaseandtoEEDs
.
4.2.3 Lightning environment
4.2.3.1 Overview
Protection of the space system against both direct and indirect effects of
lightning can be a combination of operational avoidance of the lightning
environmentandelectricaloverstressdesigntechniques.
4.2.3.2 Requirements to the space system
a. Assessmentofrisk, onthelaunchpadinsidethe protectedarea,forthe
space system and its equipment against direct and indirect effects of
lightningbeforeliftoff,shallbeperformed.
b. The spacecraft supplier shall obtain from the launching company the
electromagneticenvironmentimposedonthelauncherpayloadsin case
oflightnin
g.
4.2.4 Spacecraft charging and effects
4.2.4.1 Overview
Mitigation of risks related to spacecraft charging results of a combination of
rules and methods preventing voltage buildup and so minimizing the
occurrenceofESD,andtechniquesforcontrollingEMIfromresidualESD.
ECSSEST20 addresses management of spacecraft charging protection and
systemlevelperformanceundereffectsofspacecr
aftchargingandrelatedESD
orsecondaryarcs.
ECSSEST2006 addresses charging control and risks arising fromspacecraft
charging and other environmental effects on the spacecraft’s electrical
behaviour.
ECSSEST2007CRev.1
7February2012
19
4.2.4.2 EMI control requirements to system and equipment
in relation with ESD
a. Analysis or tests at system level shall be performed for assessing the
threatatsubsystemorequipmentlevel.
NOTE Analysis or tests can be defined in the time or
frequency domain. They are expected to evaluate
the couplinglevel fromthe ESDsource to critical
points.
b. EMIcontrol fromresid
ualESDshallbe performedby a combinationof
shieldingandpassiveoractivefilteringtechniques,implementedonthe
mainstructure,atsubsystemlevelorinsideequipment.
c. EMIcontrolefficiencyshallbeverifiedbytestatsubsystemorequipment
level.
4.2.5 Spacecraft DC magnetic emission
4.2.5.1 Spacecraft with susceptible payload
a. As part of the EMCCP, a magnetic cleanliness control plan shall
document:
1. magneticcontrolguidelines
2. emissionlimitstomagneticsources
3. amagneticbudget
4. specific test methods applied to equipments for emission
measurementandcharacterization
NOTE The test method described in 5.4.5
providing a
dipolemodelcanbeinadequateandreplacedbya
multiple dipole model or a spherical harmonics
model.
4.2.5.2 Attitude control system (ACS)
a. AspartoftheEMCCP,amagneticbudgetshallbemaintainedproviding:
1. Threeaxes components of the space vehicle magnetic dipole
(componentdecreasingwiththeinversecubelawwithdistance).
NOTE Typical values lie in the range 1Am
2
or less for
small spacecraft to much more than 10Am
2
for
largespacecraft.
2. If the solar array is rotating in the space vehicle axes, separate
evaluationforthemainbodyandthesolararray.
3. Whenthe space vehicle isusing amagnetic sensoras partof the
ACS,evaluationofthemagneticinductionatitslocation.
NOTE The ang
ular deviation is the basic requirement;
however,therequirementisgenerallyexpressedin
ECSSEST2007CRev.1
7February2012
20
termsofmodificationof thenatural fieldstrength
at the sensor location. For LEO spacecraft if the
error on each axis is less than 1μT, the
modification of the direction is kept less than
20milliradians.
b. The specified maximum magnetic field value shall comprise the
remanent magnetization (magnets, electrom
agnets in offstate, or
residual permup due to hysteresis of soft materials), the induced
magnetization of soft materials by the geomagnetic field, and the
momentumofcurrentloops.
4.2.6 Radiofrequency compatibility
a. Spuriousemissionsrequirements atantenna portsshall bespecifiedfor
RFcompatibilitypurposebythespacecraftsupplier.
b. Whenspecifyinglimitsandfrequencyranges,thefollowingissuesshall
beincluded:
1. sensitivityofpossiblevictimreceiversubsystemsincludingoutof
bandresponse,
2. no limits apply to transmit frequencies and in
formation carrying
modulationbandwidths,
3. highest and lowest intentional frequency used by space system
receivers,
4. antennaportattachments,gain/losscharacteristics.
4.2.7 Hazards of electromagnetic radiation
Assessment of hazards to electromagnetic radiation is a part of the process
specified in ECSSQST4002 “Hazard analysis”, clause “Hazard analysis
requirements”.
4.2.8 Intrasystem EMC
a. IntrasystemEMCshallbeachievedby:
1. allocation of equipmentlevel EMI requirements documented in
theEMCCP,including:
(a) limitsonconductedandradiatedemission,
(b) susceptibilitythresholds.
NOTE Recommended data is defined in Annex A fo
r
equipmentandsubsystems.
b. controlofconductedandradiatedpropagationpathsmethodsdefinedby
clauses4.2.10to4.2.13.
ECSSEST2007CRev.1
7February2012
21
4.2.9 EMC with ground equipment
a. TheEGSEandMGSEusedforspacecraftintegrationandgroundtesting
shall:
1. NotdegradetheEMCperformanceofthespacecraft;
2. Havenoimpactongroundingorisolation.
b. The EGSEshall be immune to signals usedfor spacecraftsusceptibility
tests.
4.2.10 Grounding
4.2.10.1 Overview
AsspecifiedinECSSEST20,acontrolledgroundreferenceconceptisdefined
for thespace system. Structuralelements, antenna andRF reference grounds,
power and signal returns, shields and cable shields, safety grounds, EGSE
groundsareconsidered.
4.2.10.2 Requirements
a. A systemlevel grounding diagram shall be established including the
EGSE.
b. A ground reference shall be identified for each power, signal, or RF
sourceorreceiver.
c. Anuppervalueofcommonmodevoltageshallbespecifiedconsidering:
1. power quality requirements defined in ECSSEST20 for
“Sp
acecraftbus”,
2. typeofdetectorsandsensitivity,
3. characteristics of analogue signal monitor receiver circuit, in
accordancewithECSSEST5014,Table52d,
4. characteristics of bilevel signal monitor receiver circuit, in
accordancewithECSSEST5014,clauseTable62e,
5. hazards du
e to fault currents internal to the space vehicle or
betweenthespacevehicleanditsEGSE.
d. When power and signal share common paths (wire or structure), the
magnitudeofgroundimpedanceshallbelimitedovertheaffectedsignal
spectrum.
NOTE Nonexclusive techniques forreducingthe
impedance are decre
ase of common path length,
decreaseofwireandgroundimpedance,filterson
commonpaths.
ECSSEST2007CRev.1
7February2012
22
4.2.11 Electrical bonding requirements
4.2.11.1 Overview
Bondingrequirementsareameanforfulfillinggroundingrequirements.
Normativeprovisionsarespecifiedinclause
4.2.11.2andillustratedinFigure41.
NOTE Bonding requirements for charging control are
specified in ECSSEST2006 “Electrical
continuity”,including surfacesandstructural and
mechanicalparts.
Mainframe
Vehiclestructure
Nearbystructure
grounding
Bondingstrap
<20m
Vehiclebonding
attachmentpoi nt
Groundreferencepoint
atsystemlevel
<2,5m
Equipment
housing
Connector
Equipment
bondin
g
stud
<10m
Figure41:Bondingrequirements
4.2.11.2 Normative provisions
a. A vehicle bonding attachment point connected to the vehicle structure
shallbeprovidedasagroundreferencepointatsystemlevel.
b. An equipment bonding stud connected to the unit housing shall be
providedasagroundreferenceatequipmentlevel.
c. Each unit housing shall be bonded to the nearby spacecr
aft structure
fromtheequipmentbondingstud.
d. TheDCresistancebetweentheequipmentbondingstudandthenearby
spacecraftstructureshallbelessthan2,5m.
e. The inductance between the equipment bonding stud and the nearby
spacecraftstructureshallbelessthan30nH.
f. The DC resistance between the unit housing and the vehicle bonding
attachmentpointshallbelessthan20m
g. The DC resistance between the equipment bonding stud and each
connectorhousingshallbelessthan10mΩ.
h. Bondsshallbecapabletocarrythefaultcurrentsdeterminedbyanalysis
atsystemlevel,withoutfusing,burning,orarcing.
ECSSEST2007CRev.1
7February2012
23
i. If the structure is used as the return current path, bonding provisions
shallbesuchthatDCandACvoltagedropsalongpowerpathscomply
withclause4.2.10.2c.
4.2.11.3 External grounds
a. Thefunctionalityofconnectinggroundingcablesforchargeequalization
shallbeprovidedonspacesystems.
NOTE Charge equalization is needed prior to
implementingother procedures ortheapplication
ofpoweracrosstheinterface.
4.2.12 Shielding (excepted wires and cables)
4.2.12.1 Overview
When shielding is used to control EMC with the environment, it can be
providedbythebasicspacevehiclestructuredesignedasa“Faradaycage”,by
enclosuresofelectronicsboxes,orbycableorbundleovershields.
4.2.12.2 Requirement
a. Electronicsunitsandcablesexternaltothebasicspacevehiclestructure
shallhaveindividualshieldsprovidingattenuationtoEMI.
NOTE It is important to consider apertures used for
pressuredropduringascentandforoutgassing.
4.2.13 Wiring (including wires and cables
shielding)
4.2.13.1 Classification of cables
a. Categorisation of harness and separate routings for wires of different
categoriesshallbedefinedasfollows:
1. applicable to critical lines as defined in ECSSEST20, Clause
“Electromagneticinterferencesafetymargin”.
2. madeonthebasisofthecharacteristicsofthesignalsonthewire
(andhencetheint
erferencegenerated),andonthesusceptibilityof
thecircuittoEMI.
b. Wiresfallingintoonecategoryshallbeassembledintoasamebundle.
c. Bundlesofdifferentcategoriesshallbeseparated eitherbya separation
distance of 5cm from the outer circumference or by a metallic screen
whentheyar
eroutedonparallelpaths.
NOTE Overshields or spacecraft walls can be used to
fulfiltherequirement.
ECSSEST2007CRev.1
7February2012
24
d. Wires andcables shall bemarked insuch amanner that personnelcan
visuallyidentifytheEMCcategoryforeachwireorcable.
4.2.13.2 Cable shields
a. Cable shields shall not be used as an intentional current carrying
conductor, except coaxial cables in radiofrequency circuits and high
speeddatalinksusingcoaxialcables.
b. Cable shields,other than overshields,shall have an insulated sheathto
preventuncontrolledgrounding.
c. Connectorsusedtocarryshieldedwiresshall
1. notuseanon
conductivefinish,
2. provide contact to the equipment housing with a resistance less
than10mthroughtheequipmentconnectorbodyasshown.
d. Bondingofcableshieldsshallbeasfollowing:
1. Bondingtochassisgroundisperformedatbothends:
(a) throughtheequipmentconnectorbody,
(b) usin
ga backshell thatprovidesforcircumferentialbonding
ofshields,orusingahaloring.
NOTE No grounding inside the equipment through a
connector ground pin in order to prevent any
perturbationinsidetheequipment.
2. Connectiontoelectricalreferenceisperformedthroughdedicated
pins.
NOTE This case typi
cally appears in the design of
detectionchains.
e. Overshieldsshallbebondedtochassisground:
1. atbothends,
2. usinga36directcontactorabondstrapoflessthan30nH
NOTE SeeNOTEofclause4.2.11.2e.
f. Overshie
ldsshouldbebondedtochassisgroundatintermediarypoints
withaseparationdistancelessthan1mbetweentwogroundingpoints.
ECSSEST2007CRev.1
7February2012
25
5
Verification
5.1 Overview
5.1.1 Introduction
This Clause specifies general conditions for EMC testing, requirements for
verification at system level and detailed procedures for unit and subsystem
leveltesting.
5.1.2 Electromagnetic effects verification plan
Theelectromagneticeffectsverificationplan(EMEVP)providestheinstruction
for conducting all activities needed to verify electromagnetic effects
requirements.Thisdocumentdefinesthe approach,methods,procedures,and
specific test conditions. The content is specified in the EMEVP DRD of
ECSSEST20. The EMEVP is the vehicle for tailoring procedures and test
condit
ions.
5.1.3 Electromagnetic effects verification report
The electromagnetic effects verification report (EMEVR) documents activities
and report analysis or test results in relation with the verification of the
electromagnetic effects. It is established based on the electromagnetic effects
verificationplan(EMEVP).ThecontentoftheEMEVRisdefinedintheEMEVR
DRDofECSSEST20supplementedbyspecificre
quirementsdefinedhereafter
in5.3and5.4.
5.2 Test conditions
5.2.1 Measurement tolerances
a. ThetoleranceforEMCtestingshallbeasfollows:
1. Distance:±5
%
2. Frequency:±2%
3. Amplitude,measurementreceiver:±2dB
ECSSEST2007CRev.1
7February2012
26
4. Amplitude, measurement system (includes measurement
receivers,transducers,cables,connectors):±3dB
5. Time(waveforms):±5
%
6. Resistors:±5%
7. Capacitors:±20%
5.2.2 Test site
5.2.2.1 Overview
Shieldedenclosuresorunshieldedsitesareusedfortesting.
Shieldedenclosurespreventexternal environment signalsfrom contaminating
emission measurements and susceptibility test signals from interfering with
electricalandelectronicitemsnearthetestfacility.
Inunshieldedsites,thetestsareperformedduringtimesandconditionswhen
theelectromagneticambientisatit
slowestlevel.
5.2.2.2 Shielded enclosures
a. The enclosures shall be large such that the EUT arrangement
requirementsof5.2.6andantennaposit
ioningrequirementsdescribedin
theindividualtestproceduresaresatisfied.
b. RF absorber material shall be used when performing electric field
radiatedemissionsorradiatedsusceptibilitytestingtoreducereflections
ofelectromagneticenergyandtoimproveaccuracyandrepeatability.
NOTE Example of RF absorber material are carbon
impregnatedfoampy
ramids,andferritetiles.
c. TheRFabsorbershallbeplacedabove,behind,andonbothsidesofthe
EUT,andbehindtheradiatingorreceivingantennaasshowninFigure
51.
d. Minim
umperformanceofthematerialshallbeasspecifiedinTable51.
NOTE The ma
nufacturer’s specification of their RF
absorber material (basic material only, not
installed)canbeused.
ECSSEST2007CRev.1
7February2012
27
> 1m
>30cm
>30cm
> 50 cm>30cm
RFabsorberplaced
behindthetestantenna
fromceilingtofloor
Testantenna
EUT
RFabsorberplacedabove,
behindandonbothsidesof
EUTfromceilin
g
to
g
round
Figure51:RFabsorberloadingdiagram
Table51:Absorptionatnormalincidence
Frequency Minimumabsorption
80MHz250MHz 6dB
above250MHz 10dB
5.2.2.3 Ambient electromagnetic level
a. The ambientelectromagnetic level shallbe measured withthe EUTnot
operatingandallauxiliaryequipmentturnedon.
b. Duringtesting,atleastoneofthefollowingconditionsshallbemet:
1. theambientisatleast6dBbelowtheindividualtestlimits,
2. theEUTcomplieswiththeind
ividualtestlimits,
3. it is shown that recorded data exceeding the limits cannot be
generatedbytheEUT(emissiontests)orcannotsensitizetheEUT
(susceptibilitytests).
c. Backgroundplotsshallbereportedforeachtestconfigurationunlessall
recordeddataisatleast6dBbelowtheindividualtestlimit
s.
5.2.2.4 Ambient conducted level
a. Ambient conducted levels on power leads shall be measured with the
leadsdisconnectedfrom theEUTand connected toaresistive loadthat
drawsthesameratedcurrentastheEUT.
ECSSEST2007CRev.1
7February2012
28
5.2.3 Ground plane
5.2.3.1 General
a. Iftheactualinstallationisknown,theEUTshallbeinstalledonaground
planethatsimulatestheactualinstallation.
b. If the actual installation is unknown or multiple installations are
expected,thentheEUTshallbeinstalledonametallicgroundplane.
c. Groundplanesshallbe2orlar
gerinareawiththesmallersidenoless
than75cm.
d. When a ground plane is not present in the actual EUT installation, the
EUTshallbeplacedonanonconductivetable.
NOTE In such a case, test methods are specific and are
likely to differ from the ones in the present
stand
ard.
5.2.3.2 Metallic ground plane
a. WhentheEUTisinstalledonametallicgroundplane,thegroundplane
shallhaveaDCsurfaceresistancenotlargerthan0,1mpersquare.
b. The DC resistance between metallic ground planes and the shielded
enclosureshallbe2,5morless.
c. The metallic ground planes shall be electrically bonded to the floor or
wallofthebasicshie
ldedroomstructureatleastonceevery1m.
d. Themetallicbondstrapsshallbesolidandmaintainafivetooneratioor
lessinlengthtowidth.
e. Metallicgroundplanesusedoutsideashieldedenclosuresh
allextendat
least1,5mbeyondthetestsetupboundaryineachdirection.
5.2.3.3 Composite ground plane
a. WhentheEUTisinstalledonaconductivecompositegroundplane,the
surfaceresistivityoftheactualinstallationshallbeused.
b. Composite ground planes shall be electrically bonded to the enclosure
withmeanssuitabletothematerial.
5.2.4 Power source impedance
a. TheimpedanceofpowersourcesprovidinginputpowertotheEUTshall
be controlled byLine ImpedanceStabilizationNetworks (LISNs
)for all
measurement.
b. LISNs
shallnotbeusedonoutputpowerleads.
c. TheLISNsshallbelocatedatthepowersourceendoftheexposedlength
ofpowerleadsspecifiedin5.2.6.6.
d. TheLISNcircuitshowninFigure52sh
allbeused.
ECSSEST2007CRev.1
7February2012
29
NOTE1 The LISN can be split in several cases, one per
powerlead.
NOTE2 Theseriesinductancesrepresenttheinductancesof
the wiring; the series resistances represent the
resistances of the wiring and of the central
protections.
NOTE3 The 50resistors result in 100 at high
frequency, simi
lar to the characteristic impedance
oftheline.
NOTE4 Thefeedthroughcapacitorsprovideashortcircuit
athighfrequencyandmaketheLISNsymmetrical
NOTE5 Connecting theregulation wires ofthe laboratory
supply at the LISN input in order to provide
sufficientlylowimpedanceatlowfrequencyisan
a
ppropriatemethod.Thesourceimpedanceisthen
dominated by the series resistances in the LISN.
Alternatively,alargecapacitor(between1mFand
10mF)willbeused.
+
x H
x H
50
To EUT
To Power
Source
+
y m
50
y m
Bonding stud
470nF
to 10µF
470nF
to 10µF
Metal
enclosure
100 k
100 k
Optional
1 to 10mF
Regulation wires
+
x H
x H
50
To EUT
To Power
Source
+
y m
50
y m
Bonding stud
470nF
to 10µF
470nF
to 10µF
Metal
enclosure
100 k
100 k
Optional
1 to 10mF
Regulation wires
Figure52:Lineimpedancestabilizationnetworkschematic
e. Ifnovalueisspecifiedx=2μHandy=0,1shallbeused.
NOTE The x and y values, respectively the inductance
and the resistance inserted in each lead are
expectedintheEMEVP.
f. Magneticcouplingbetweeninductorsshallbeavoided.
g. If the return line is gr
ounded at the power source in the actual
installation (star distribution), the return line of the LISN shall be
groundedonthepowersourceside.
h. Ifthereturnline(s)oftheactualinstallationislocallygrounded(chassis
return),the return lineofthe LISNneed notbepro
vided,andthetests
shallbeperformedwiththereturn(s)tiedtocase.
ECSSEST2007CRev.1
7February2012
30
i. The LISN impedance shall be measured at least annually under the
followingconditions:
1. the impedance,measured between the power output lead onthe
EUTsideoftheLISNandthemetalenclosureoftheLISN,
2. anunterminatedpowerinputterminalonthepowersourcesideof
theLISN.
5.2.5 General test precautions
5.2.5.1 Safety
a. Clause4.2.7shallapplyfortestsinvolvinghighelectromagneticpoweror
highvoltagetestequipment.
5.2.5.2 Excess personnel and equipment
a. Onlytheequipmentandthepersonnelusedtoperformthetestshallbe
presentinthetestareaorenclosure.
5.2.5.3 Overload precautions
a. Checksshallbeperformedtoassurethatanoverloadconditiondoesnot
exist.
NOTE Measurementreceiversandtransducersaresubject
to overload, especially receivers without
preselectorsandactivetransducers.
b. Overloadconditionshallbecorrected.
NOTE Thiscanbedonebyinstrumentationchanges.
5.2.6 EUT test configurations
5.2.6.1 General
a. TheEUTshallbeconfiguredasshowninthegeneraltestsetupofFigure
53andmaintainedduringalltesting.
NOTE Forradiatedtests, itmaybedesirable tohave the
LISNoutsideoftheshieldedroom.
ECSSEST2007CRev.1
7February2012
31
1
1
2
3
4
5
6
7
7
7
7
2m
5cm
10cm
8
9
7
1: EUT
2: LISN
3: Power source
4: Access panel
5: Interconnecting cable
6: Power lead
7: Bonding strap
8: Non conductive standof
f
9: Grounding plane
1
1
2
3
4
5
6
7
7
7
7
2m
5cm
10cm
8
9
7
1: EUT
2: LISN
3: Power source
4: Access panel
5: Interconnecting cable
6: Power lead
7: Bonding strap
8: Non conductive standof
f
9: Grounding plane
-
Figure53:Generaltestsetup
5.2.6.2 Bonding of EUT
a. Onlythe provisionsincluded inthe designof theEUTshall beusedto
bondunits.
5.2.6.3 Shock and vibration isolators
a. EUTs shall be secured to mounting bases having shock or vibration
isolatorsifsuchmountingbasesareusedintheactualinstallation
b. Thebondingstrapsfurnishedwiththemountingbaseshallbeconnected
tothegroundplane.
c. Whenmountingbasesdonothavebondingstraps,bondingstrapsshall
notbeusedinthetestsetup.
5.2.6.4 Safety grounds
a. When external terminals, connector pins, or equipment grounding
conductors areavailablefor safety ground connectionsand areused in
theactualinstallation,theyshallbeconnectedtothegroundplane.
NOTE Arrangementandlengtharespecifiedin5.2.6.6.
5.2.6.5 Orientation of EUTs
a. EUTs shall be oriented such that surfaces that produce maximum
radiatedemissionsandrespondmostreadilytoradiatedsignalsfacethe
measurementantennas.
b. BenchmountedEUTscomprisinginterconnectingcablesshallbelocated
(10±2)cmfromthefrontedgeofthegroundplane.
ECSSEST2007CRev.1
7February2012
32
5.2.6.6 Construction and arrangement of EUT cables
5.2.6.6.1 General
a. Electricalcableassembliesshallsimulateactualinstallationandusage.
NOTE1 Proper construction techniques such as use of
twisted pairs, shielding, and shield terminations
aredeterminantfeatures.
NOTE2 Details on the cable construction used for testing
are defined inthe EMEVP DRDof ECSSEST20,
and maintained in the EME
VR DRD of
ECSSEST20.
b. Shielded cables or shielded leads (including power leads and wire
grounds)withincablesshallbeusedonlyiftheyhavebeenspecifiedin
installationrequirements.
5.2.6.6.2 Interconnecting leads and cables
a. Individual leadsshall begroupedinto cablesinthe samemanner as in
theactualinstallation.
b. Upto10m,interconnectingcablelengthsinthesetupshallbethesame
asintheactualinstallation.
c. Ifacableislongerthan10mintheactualinstallation,theca
blelengthin
thesetupshallbebetween10mandtheactuallength.
d. The cable arrangement shall be such that it satisfies the following
conditions:
1. Atleastthefirst2m(exceptforcablesthatareshorterintheactual
installation) of each interconnecting cable associated with eac
h
enclosureoftheEUTarerunparalleltothefrontboundaryofthe
setup.
2. Remaining cable lengths are routed to the back of the setup and
placedinazigzaggedarrangement.
e. Whenthesetupincludesmorethanonecable,individualcablesshallbe
separatedby2cmmea
suredfromtheiroutercircumference.
f. Forbenchtopsetupsusinggroundplanes,thecableclosesttothefront
boundaryshallbeplaced10cmfromthefrontedgeofthegroundplane.
g. All cables shall be supported 5cm above the ground plane (except for
interconnectingcablesbetweenenclosuresoftheEUTtha
tarehigherin
theactualinstallation).
5.2.6.6.3 Input power leads
a. Twometres ofinput powerleads (includingneutrals andreturns)shall
berouted parallel tothe frontedge ofthesetup in thesame manner as
theinterconnectingleads.
b. Each input power lead, including neutrals and returns, shall be
connectedtoaLISN.
ECSSEST2007CRev.1
7February2012
33
c. Powerleadsthatarebundled,aspartofaninterconnectingcableinthe
actual installation, shall be configured in the same fashion for the 2m
exposedlengthandthenshallbeseparatedfromthebundleandrouted
totheLISNs
.
d. Afterthe2mexposedlength,thepowerleadsshallbeterminatedatthe
LISNs
insuchamannerthatthetotallengthofpowerleadfromtheEUT
electricalconnectortotheLISNsshallnotexceed2,5m.
e. Allpowerleadsshallbesupported5cmabovethegroundplane.
f. If the power leads are twisted in the actual installation, they shall be
twisteduptotheLISNs
.
5.2.6.7 Electrical and mechanical interfaces
a. Eitherthe actual equipmentfrom theplatforminstallationorloadsthat
simulate the electrical properties present in the actual installation shall
terminateelectricalinputoroutputinterfaces.
NOTE Example of these electrical properties are
impedance,groundingandbalance.
b. SignalinputsshallbeappliedtotheelectricalinterfacestoexerciseEU
T
circuitry.
c. EUTwithmechanicaloutputsshallbeloadedunderexpectedconditions.
d. When variable electrical or mechanical loading is present in the actual
installation, testing shall be performed under expected worstcase
conditions.
e. Whenactiveelectricalloadingisused,itshallbeensuredthattheactive
load meet
s the ambient requirements of 5.2.2 when connected to the
setup,andthattheactiveloaddoesnotrespondtosusceptibilitysignals.
NOTE Exampleofactiveelectricalloadingisthetestset.
f. Antenna ports on the EUT shall be terminated with shielded, matched
loadsiftheRFlinkisnotusedduringthetest.
5.2.7 Operation of EUT
5.2.7.1 General
a. Duringemissionmeasurements,theEUTshallbeplacedintheoperating
mode,whichproducesmaximumemissions.
b. During susceptibility testing, the EUT shall be placed in its most
susceptibleoperatingmode.
c. When the EUT has several available modes (including software
controlled operational modes), the number of modes to be te
sted for
emissionandsusceptibilityshallbesuchthatallcircuitryisevaluated.
NOTE It is expected that the customer defines or agrees
operatingmodes.
ECSSEST2007CRev.1
7February2012
34
5.2.7.2 Operating frequencies for tuneable RF equipment
a. Measurements shall be performedwith the EUT tuned to not less than
threefrequencieswithineachtuningband,tuningunit,orrangeoffixed
channels,consistingofonemidbandfrequencyandafrequencywithin
±5%fromeachendofeachbandorrangeofchannels.
5.2.7.3 Operating frequencies for spread spectrum
equipment
a. Operating frequency requirements for two major types of spread
spectrumequipmentshallbeasfollows:
1. frequency hopping: measurements are performed with the EUT
utilizingahopsetwhichcontainsaminimumof30%ofthetotal
possiblefrequencies,andthehopsetisdividedequallyintothree
segments at the low, mi
d, and high end of the EUT operational
frequencyrange,
2. direct sequence: measurements are performed with the EUT
processingdataatthehighestpossibledatatransferrate.
5.2.7.4 Susceptibility monitoring
a. TheEUTshallbemonitoredduringsusceptibilitytestingforindications
ofdegradationormalfunction.
NOTE This monitoring is normally accomplished using
builtintest, visual displays, aural outputs, and
other measurements of signal outputs and
interfaces.
b. IfEUTperformanceismonitoredthroughinstallationofspecialcircuitry
intheEUT,th
emodificationsshallnotinfluencetestresults.
5.2.8 Use of measurement equipment
5.2.8.1 Overview
Anyfrequencyselectivemeasurementreceivercanbeusedforperformingthe
testing described in this standard if the receiver characteristics (that is
sensitivity, selection of bandwidths, detector functions, dynamic range, and
frequencyofoperation)meettheconstraintsspecifiedinthisstandardandare
sufficienttodemonstratecompliancewiththeapplicablelimits.
5.2.8.2 Detector
a. A peak detector shall be used for all frequency domain emission and
susceptibilitymeasurements.
NOTE This device detects the peak value of the
modulation envelope in the receiver pass band.
Measurement receivers are calibrated in terms of
ECSSEST2007CRev.1
7February2012
35
an equivalent root mean square value of a sine
wavethatproducesthesamepeakvalue.
b. When measurement devices other than peak detector are used for
susceptibilitytesting,correctionfactorsshallbedeterminedandapplied
fortestsignalstoadjustthereadingtoequivalentr.m.s.valuesunderthe
peakofthemo
dulationenvelope.
NOTE Example of such measurement devices are
oscilloscopes, nonselective voltmeters, and field
strengthsensors.
5.2.8.3 Calibration fixture (jig)
a. When current measurements are performed on the central line of a
coaxial transmission line a transmission line with 50 characteristic
impedance,coaxialconnectionsonbothends,andspaceforaninjection
probearoundthecentreconductorshallbeusedforcalibration.
NOTE Figure54re
presentsanarrangementdescribedin
MILSTD461E.
Figure54:Typicalcalibrationfixture
5.2.9 Emission testing
5.2.9.1 Bandwidths
a. Themeasurementreceiver bandwidthslistedin Table52shallbe used
foremissiontesting.
NOTE These bandwidthsare specifiedat the6dB down
points for the overall selectivity curve of the
receivers.
b. Videofilteringshallnotbeusedtobandwidthlimitthereceiverresponse.
ECSSEST2007CRev.1
7February2012
36
c. Ifacontrolledvideobandwidthisavailableonthemeasurementreceiver,
itshallbesettoitsgreatestvalue.
d. If receiver bandwidths larger that those in Table 5 2 are used, no
ba
ndwidthcorrectionfactorsshallbeappliedtotestdataduetotheuse
oflargerbandwidths.
NOTE Larger bandwidths canresultin highermeasured
emissionlevels.
Table52:Bandwidthandmeasurementtime
FrequencyRange 6dB
bandwidth
Dwelltime Minimummeasurementtime
(analoguemeasurementreceiver)
30Hz‐1kHz 10Hz 0,15s 0,015s/Hz
1kHz‐10kHz 100Hz 0,015s 0,15s/kHz
10kHz‐150kHz 1kHz 0,015s 0,015s/kHz
150kHz‐30MHz 10kHz 0,015s 1,5s/MHz
30MHz‐1GHz 100kHz 0,015s 0,15s/MHz
Above1GHz 1MHz 0,015s 15s/GHz
5.2.9.2 Emission identification
a. All emissions regardless of characteristics shall be measured with the
measurementreceiverbandwidthsspecifiedinTable52.
5.2.9.3 Frequency scanning
a. Foremissionmeasurements,theentirefrequencyrangeforeachtestshall
bescanned.
b. Minimum measurement time for analogue measurement receivers
duringemissiontestingshallbeasspecifiedinTable52.
c. Synthesized measurement receivers sh
all step in onehalf bandwidth
incrementsorless,andthemeasurementdwelltimeshallbeasspecified
inTable52.
d. Forequipme
ntthatoperates,suchthatpotentialemissionsareproduced
at only infrequent intervals, times for frequency scanning shall be
increasedsuchthananyemissioniscaptured.
5.2.9.4 Emission data presentation
a. Amplitude versus frequency profiles of emission data shall be
automaticallygeneratedanddisplayedatthetimeofthetest.
b. Except for verification of the validity of the output, data shall not be
gatheredmanually.
c. Theinformationshallbedisplayedafterapplicationofcorrectionfactors,
includingtransducers,attenuators,andcablelos
s.
ECSSEST2007CRev.1
7February2012
37
d. DataoutputoftheEUTtestresultshallbeintheformofamplitudeover
time (for the time domain plots) and amplitude over frequency (for
frequencydomainplots),superimposedwiththeEMItestlimit.
e. Units of measurement for frequency domain emissions measurements
shall bereported inunits ofdB refer
encedto 1μV, 1μA, 1μV/m, 1pT
dependingontheunitdefinedinthetestlimit.
f. For time domain measurements, oscilloscope plots shall include the
amplitudephysicalunit(VorA)conversionfactorsVintoAifnotdone
automatically by the oscilloscope, and the oscilloscope sensit
ivity, time
basesettingsandmeasurementbandwidth.
g. For frequencydomain plots, emissiondatashall be reported ingraphic
formwithfrequencyresolutionof1%,ortwicethemeasurementreceiver
bandwidth,whicheverislessstringent.
h. Intheeventofanyemissionstestresultovertheemissiontestlimitab
ove
100MHz, greater accuracy of its frequency shall be reported with
resolutionbetterthanorequaltotwicethemeasurementbandwidth.
i. Eachplotofemissiondatashallbereportedwithaminimumamplitude
resolutionof1dB.
5.2.10 Susceptibility testing
5.2.10.1 Frequency stepping
a. For susceptibility measurements, the entire frequency range for each
applicabletestshallbescanned.
NOTE Stepped scans refer to signal sources that are
sequentiallytunedtodiscretefrequencies.
b. Stepped scans shall dwell at each tuned frequency for the greatest of
threesecondsortheEUTresponsetime.
NOTE Ten fre
quency steps per decade can be used as a
basis.
c. Stepsizesshallbedecreasedsuchtopermitobservationofaresponse.
NOTE For receivers, it can make use of the frequency
plantoadjustthenumberofpoints.
5.2.10.2 Modulation of susceptibility signals
a. Susceptibilitytestsignalsshallbepulsemodulated(on/offratioof40dB
minimum)ata1kHzratewitha50%dutycycleforsusceptibilitysignals
atafrequencylargerthan100kHz.
b. CW test signals shall be used for susceptibility signals at a frequency
smallerthan100kH
z.
ECSSEST2007CRev.1
7February2012
38
5.2.10.3 Thresholds of susceptibility
a. WhensusceptibilityindicationsarenotedinEUToperation,athreshold
levelshallbedeterminedasfollowswherethesusceptibleconditionisno
longerpresent:
1. Whenasusceptibilityconditionisdetected,reducetheinterference
signaluntiltheEUTrecovers.
2. Reducetheinterferencesignalbyanadditional6dB.
3. G
radually increase the interference signal until the susceptibility
condition reoccurs; the resulting level is the threshold of
susceptibility.
4. Record this level, frequency range of occurrence, frequency and
levelofgreatestsusceptibility,andtheothertestparameters.
5.2.10.4 Susceptibility data presentation
a. The susceptibility criteria defined in the EMI test procedure shall be
repeatedinthetestreport,orthe“asrun”EMItestprocedureshallbean
annextotheEMItestreport.
b. Data showing the frequencies and amplitudes at which the test was
conductedshallbeprovidedingraphicalorta
bularform.
c. Indicationsofcompliancewiththerequirementsshallbeprovided.
NOTE Such indications can be provision of oscilloscope
plotsofinjectedwaveformswithtestdata.
d. Information shall be displayed after application of correction factors,
includingtransducers,attenuators,andcableloss.
e. Datashallbereportedwithfre
quencyresolutionof1%.
f. Datashallbeprovidedwithaminimumamplituderesolutionof1dBfor
eachplot.
g. Ifsusceptibility is observed, determined levels of susceptibility shallbe
recordedinthetestreport.
5.2.11 Calibration of measuring equipment
5.2.11.1 General
a. Measurementantennas,current probes,fieldsensors, and otherdevices
usedinthemeasurementloopshallbecalibratedatleasteverytwoyears
orwhendamaged.
5.2.11.2 Measurement system test
a. At the start of each emission test, the complete test system (including
measurementreceivers,cables, attenuators,couplers,andsoforth)shall
be verifiedbyinjecting aknown signal (asstated inthe individualtest
procedure),whilemonitoringsystemoutputfortheproperindication.
ECSSEST2007CRev.1
7February2012
39
b. When the emission test involves an uninterrupted set of repeated
measurementsusingthesamemeasurementequipment,the
measurementsystemtestmaybeaccomplishedonlyonetime.
NOTE Example of such repeated measurements is the
evaluation of different operating modes of the
EUT.
5.3 System level
5.3.1 General
a. Each item of equipment and subsystem shall have successfully passed
functionalacceptancetestprocedures asinstalledontheplatform, prior
tosystemlevelEMCtest.
5.3.2 Safety margin demonstration for critical or
EED circuits
a. A test performed to demonstrate compliance with the safety margin
requirementshalluseoneormoreofthefollowingtestapproaches:
1. InjectinterferenceatcriticalsystempointsatxdBhigherlevelthan
exists, while monitoring other system points for improper
responses,wherex=EMISM.
2. Measure the susceptibility of crit
ical system circuits for
comparison to existing interference levels, to determine the
margin.
3. Sensitize the system to render it xdB more susceptible to
interference, while monitoring for improper response, where x =
EMISM.
b. Safetymargindemonstrationforsomethingthatissusceptibletoatime
domaincircuit(inc
ludingEEDs)shallusetimedomainmethods.
5.3.3 EMC with the launch system
a. If the spacecraft is not powered during launch, EMC testing with the
launchsystemneednotbeperformed.
b. If the spacecraft is powered during launch, the electric field radiated
emission requirements specified in the Launcher User’s manual,
includingintentionaltransmission,shallbeverified.
c. In case a spacecraft RF transmitter is operating under fairing, the
followingEMISMsshallbeverified:
1. EMISMwithrespecttothesusceptibilitythresholdoftheEEDs.
2. EMISM withrespect to the spacecraft RFreceivers’ susceptibility
threshold(ifoperational)ordamagethreshold(otherwise).
ECSSEST2007CRev.1
7February2012
40
NOTE This requirement c. applies also to transmitters
which are switched off during launch and ascent
but can,for example, beswitched on temporarily
onthelaunchpad,forafinalhealthcheck.
d. TheEMISMbetweenthelaunchsystemRFemissionsandthespacecraft
RFreceivers’damagethresholdshallbeverified.
5.3.4 Lightning
a. Lightning protection specifiedin ECSSEST20 (in clause “Intersystem
EMC and EMC with environment
), shall be verified by analysis from
equipmentdemonstration.
NOTE1 Testatsystemlevelneednotbeperformed.
NOTE2 deleted
.
5.3.5 Spacecraft and static charging
a. Material use, bonding of discharge elements, thermal blankets, or
metallic items using a bond for static potential equalization shall be
verifiedbyinspectionormeasurementatassemblyintostructure.
b. Ifthebondisonlyusedforchargingcontrol,thebondingresistanceshall
bemeasuredwitha dccurrentintherang
e10to100μA,underonlyone
polarity,witha2wiresohmmeter.
NOTE If the bond is only used for charging control the
clauses5.3.10aand5.3.10bdonota
pply.
5.3.6 Spacecraft DC magnetic field emission
a. SpacecraftDCmagneticfieldemissionrequirementsshallbeverifiedbya
combinationofanalysisandtests.
5.3.7 Intra–system electromagnetic compatibility
a. For intrasystem EMC tests, the support equipment shall provide the
functionalityofexercisingculpritsandvictims,andinclude thesupport
equipmentinstructions.
b. Wherever 0dB EMISM is a requirement, functional tests at spacecraft
levelmaybeacceptedasaverificationofEMC.
5.3.8 Radiofrequency compatibility
a. Except for passive intermodulation products, radiofrequency
compatibilityshallbeverifiedbyatestatsystemlevel.
b. Absence of passive intermodulation products shall be verified in
accordance with the requirements for “Passive intermodulation”
specifiedinECSSEST20.
ECSSEST2007CRev.1
7February2012
41
5.3.9 Grounding
a. The systemlevel electrical grounding andisolation shall be verified by
isolationandcontinuitytestsatsystemassembly.
NOTE Thegroundingandisolationdesignisdocumented
by thesystemlevel grounding diagramincluding
EGSE.
5.3.10 Electrical bonding
a. Except for bonding used only for charging control, the bonding
resistancesshallbemeasuredusinga4wiresmethod,underapulsedDC
currentof1A.
b. Except for bonding used only for charging control, the probes shall be
reversed and remeasured to detect possible non linearities across the
bondedjunction.
NOTE Seecl
ause5.3.5b.
5.3.11 Wiring and shielding
a. Wiringcategory andcable shieldsshall beverified byreviewof design
andinspection.
5.4 Equipment and subsystem level test procedures
5.4.1 Overview
Test procedures are specified in clauses 5.4.2 through 5.4.12 for verifying
emission and susceptibility requirements at subsystem or equipment level.
Table 53 give
s the correspondence between procedures and recommended
limitsdefinedinAnnexA.
ECSSEST2007CRev.1
7February2012
42
Table53:Correspondencebetweentestproceduresandlimits
Informativelimit
AnnexA
Titleoftestprocedure
Verification
Clause5
A.2 CEonpowerleads,differentialmode,30Hzto100kHz(1stpart) 5.4.2
A.2 CEonpowerleads,differentialmode,100kHzto100MHz(2ndpart) 5.4.3
A.3 CEonpowerleads,inrushcurrents 5.4.4
A.4 CEonpowerandsignalleads,commonmode,100kHzto100MHz 5.4.3
A.5 CEonantennaports Specific
A.6 DCmagneticfieldemission 5.4.5
A.7 RE,lowfrequencymagneticfield Specific
A.8 RE,lowfrequencyelectricfield Specific
A.9 RE,electricfield,30MHzto18GHz 5.4.6
A.10 CS,powerleads,differentialmode,30Hzto100kHz 5.4.7
A.11 CS,powerandsignalleads,commonmode,50kHzto100MHz 5.4.8
A.12 CS,powerleads,shortspiketransients 5.4.9
A.13 RS,magneticfield,30Hzto100kHz 5.4.10
A.14 RS,electricfield,30MHzto18GHz 5.4.11
A.15 Susceptibilitytoelectrostaticdischarge 5.4.12
5.4.2 CE, power leads, differential mode, 30 Hz to
100 kHz
5.4.2.1 Purpose
Thismethodisusedformeasuringconductedemissionsinthefrequencyrange
30Hzto100kHzonallinputpowerleadsincludingreturns.
5.4.2.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Measurementreceiver,
2. Currentprobe,
3. Signalgeneratorwithamplifier,
4. DCcurrentsupply,
5. Datarecordingdevice,
6. Oscilloscope,
7. Coaxial“T”connectorandcoaxialtobifilartransition,
8. 1 and 10 power metal film resistors with inductance lower
tha
n100nH,
9. LISNdefinedin5.2.4.
ECSSEST2007CRev.1
7February2012
43
5.4.2.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintain a basic test setup for the EUT as specified in 5.2.6 an
d
Figure53.
2. Formeasure
mentsystemcheck,configurethetestsetupasshown
inFigure55.
3. For equipme
nt testing, configure the test setup as shown Figure
56.
5.4.2.4 Procedure
a. Thetestproceduresshallbeasfollows:
1. Turnonthemeasurementequipmentandwaituntilitisstabilized.
2. IftheEMEVPspecifiestocheckthemeasurementsystem,checkit
by evaluating the overall measurement system from the current
probetothedataoutputdevice,asfollows:
(a) Applyaca
libratedsignallevel,at1kHzand100kHz,which
isatleast6dBbelowtheemissionlimittothecurrentprobe.
NOTE Apoweramplifiercanbenecessaryat1kHz.
(b) ApplythroughthecurrentprobeaDCcurrentequivalentto
theEUTsupplycurrent.
NOTE1 A DC curren
t is applied for verifying that the
currentprobewillnotbesaturatedbytheEUT
DCsupplycurrent.
NOTE2 This DC current is applied through the LISN
for applying the same impedance through the
probeaswiththeEUT.
(c) VerifytheACcurrentlevelasmeasuredwiththeprobeby
comparisonwithvolta
geacrossthe1resistorat1kHzand
the 10 resistor at 100kHz; also, verify that the current
waveformissinusoidal.
(d) Scan the measurement receiver for each frequency in the
same manner as a normal data scan. Verify tha
t the data
recording device indicates a level within ±3dB of the
injectedlevel.
(e) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,
locatethesourceoftheerrorandcorrectthedeficiencyprior
toproceedingwiththetesting.
3. Test the EUT by determining the conducted emissions from the
EUT input po
wer leads, hot line and return, and measure the
conductedemissionseparatelyoneachpowerlead,asfollows:
(a) TurnontheEUTandwaitforitsstabilization.
(b) Select a lead for testing and clamp the current probe into
position.
ECSSEST2007CRev.1
7February2012
44
(c) Scan the measurement receiver over the frequency range,
using the bandwidths and minimum measurement times
specifiedinTable52,cl
ause5.2.9.1.
(d) Repeat5.4.2.4a.3(b)an
d5.4.2.4a.3(c)foreachpowerlead.
Signal
generator
with
amplifier
Data
recorder
Measurement
receiver
Current
probe
LISN
To power source
Oscilloscope
Coax “T” and
bifilar
transition
Resistor
Signal
generator
with
amplifier
Data
recorder
Measurement
receiver
Current
probe
LISN
To power source
Oscilloscope
Coax “T” and
bifilar
transition
Resistor
Figure55:Conductedemission,30Hzto100kHz,measurementsystemcheck
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power source
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power source
Figure56:Conductedemission,30Hzto100kHz,measurementsetup
5.4.3 CE, power and signal leads, 100 kHz to
100 MHz
5.4.3.1 Purpose
This test procedure is used to verify that electromagnetic emissions from the
EUTdonotexceedthespecifiedrequirementsforpowerinputleadsincluding
returns,andforcommonmodeemission.
5.4.3.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Measurementreceiver,
2. Currentprobe,
3. Signalgenerator,
ECSSEST2007CRev.1
7February2012
45
4. Datarecordingdevice,
5. Oscilloscopewith50input,
6. 50powerdivider(6dB“T”connector),
7. 50coaxialload,
8. Calibrationfixturedefinedin5.2.8.3,
9. LISNs
definedin5.2.4.
5.4.3.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintain a basic test setup for the EUT as specified in 5.2.6 an
d
Figure53.
2. Configure the test setup for the measurement syst
em check as
showninFigure57.
3. Forcomplian
cetestingoftheEUT:
(a) Configure the test setup as shown in Figure 58 fo
r
differentialmode testingand Figure 59for common mode
testing.
(b) Positionthecurrentprobe10cmfromtheLISN.
Signal
generator
Oscilloscope
50 input
6dB
T-connector
Data
recorder
Measurement
receiver
Current probe
inside jig
LISN
To power source
50 coaxial
load
Signal
generator
Oscilloscope
50 input
6dB
T-connector
Data
recorder
Measurement
receiver
Current probe
inside jig
LISN
To power source
50 coaxial
load
Figure57:Conductedemission,measurementsystemcheck
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power source
EUT
Data recorder
Measurement
receiver
Current
probe
LISN
To power source
Figure58:Conductedemission,measurementsetupindifferentialmode
ECSSEST2007CRev.1
7February2012
46
EUT
Data recorder
Measurement
receiver
Current probe
LISN
or EGSE
To power source
EGSE
Power lines
Signal lines
OR
EUT
Data recorder
Measurement
receiver
Current probe
LISN
or EGSE
To power source
EGSE
Power lines
Signal lines
OR
Figure59:Conductedemission,measurementsetupincommonmode
5.4.3.4 Procedures
a. Thetestproceduresshallbeasfollows:
1. Turnonthemeasurementequipmentandwaituntilitisstabilized.
2. IftheEMEVPspecifiestocheckthemeasurementsystem,checkit
by evaluating the overall measurement system from the current
probetothedataoutputdevice,asfollows:
(a) Applyaca
libratedsignallevelthatisatleast6dBbelowthe
applicablelimitat1MHzand10MHzoratalevelallowing
out of the noise reading on the oscilloscope, whatever is
greater,tothecurrentprobeinthejig.
(b) Applythroughthecurrentprobeusingasecond wi
re,aDC
currentequivalenttotheEUTnominalsupplycurrent.
NOTE1 A DC current is applied for verifying that the
currentprobewillnotbesaturatedbytheEUT
DCsupplycurrent.
NOTE2 This DC current is applied through the LISN
for applying the same impedance through the
probeaswiththeEUT.
(c) Veri
fytheACcurrentlevel,asmeasuredwiththeprobeby
comparisonwiththevoltageontheTderivation.
(d) Scan the measurement receiver for each frequency in the
samemannerasanormaldatascan,andverifythatthedata
recording device ind
icates a level within ±3dB of the
injectedlevel.
(e) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,
locatethesourceoftheerrorandcorrectthedeficiencyprior
toproceedingwiththetesting.
3. Test the EUT by determining the conducted emission from the
inputpowerlea
ds,hotlinesandreturnsseparately,andfromeach
interconnecting bundle(common mode), includingthe ones with
powerleads,asfollows:
ECSSEST2007CRev.1
7February2012
47
(a) TurnontheEUTandwaituntilitisstabilized.
(b) Selecta leador abundle fortesting and clamp thecurrent
probeintoposition.
(c) Scan the measurement receiver over the frequency range,
using the bandwidths and minimum measurement times
specifiedinTable52,cl
ause5.2.9.1.
(d) Repeat5.4.3.4a.3(b)and5.4.3.4a.3(c)foreach power lea
dor
foreachbundle.
5.4.4 CE, power leads, inrush current
5.4.4.1 Purpose
ThistestprocedureisusedtoverifythattheinrushcurrentoftheEUTdoesnot
exceedthespecifiedrequirementsforpowerinputleads.
5.4.4.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Twochannelsoscilloscope,
2. Currentprobe,
3. Spikegenerator,
4. Datarecordingdevice,
5. Coaxial“T”connector,
6. Coaxialtobifilartransition,
7. 1 power metal film resistor with inductance lower 30nH and
peakpowercapability,
8. LISNdefinedin5.2.4,
9. Swit
ching device, fast bouncefree power switch, or an actual
powercontrollerexcept ifthe ON/OFFcommandis implemented
intheEUT.
5.4.4.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintain a basic test setup for the EUT as specified in 5.2.6 an
d
Figure53.
2. Configure the test setup for the measurement syst
em check as
showninFigure510
.
3. Configure the test setup for compliance testing of the EUT as
showninFigure511
.
ECSSEST2007CRev.1
7February2012
48
Spike
generator
Data
recorder
Current
probe
LISN
To power source
Oscilloscope
Coax “T”
and bifilar
transition
Resistor
Spike
generator
Data
recorder
Current
probe
LISN
To power source
Oscilloscope
Coax “T”
and bifilar
transition
Resistor
Figure510:Inrushcurrent:measurementsystemchecksetup
EUT
Data recorder
Current probe
LISN
To power source
Oscilloscope
Power
controller
ON/OFF command
Fast bounce-free
power switch
a
c
b
EUT
Data recorder
Current probe
LISN
To power source
Oscilloscope
Power
controller
ON/OFF command
Fast bounce-free
power switch
a
c
b
Figure511:Inrushcurrent:measurementsetup
5.4.4.4 Procedures
a. Thetestproceduresshallbeasfollows:
1. Turn on the measurementequipment and allow asufficient time
forstabilization.
2. If specified by the EMEVP, check the measurement system by
evaluatingtheoverallmeasurementsystemfromthecurrentprobe
tothedataoutputdevice:
(a) Apply a calibrated spike tha
t is at least 6dB below the
applicablelimittothecurrentprobe.
(b) ApplythroughthecurrentprobeaDCcurrentequivalentto
theEUTsupplycurrent.
NOTE1 A DC current is applied for verifying that the
currentprobewillnotbesaturatedbytheEUT
DCsupplycurrent.
NOTE2 This DC c
urrent is applied through the LISN
for applying the same impedance through the
probeaswiththeEUT.
ECSSEST2007CRev.1
7February2012
49
(c) Check the spike current as measured with the probe by
comparisonwiththevoltageacrosstheresistor.
(d) Perform the measurement with the current probe on an
oscilloscope in the same manner as for EUT testing and
verifythatthedatarecordingdeviceindicatesalevelwithin
±3dBoftheinjectedleve
l.
(e) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,
locatethesourceoftheerrorandcorrectthedeficiencyprior
toproceedingwiththetesting.
3. Test the EUT by determining the conducted emission from the
EUTinputpowerleads,asfollows:
(a) Select the positive le
ad for testing and clamp the current
probeintoposition.
(b) Performmeasurementby applicationof poweron theEUT
using a mercury relay (Figure 511
.a), the internal EUT
switch (Figure 511
.b), or the power controller (Figure
511.c).
NOTE Themethodforapplicationofpowerisdefined
intheEMEVR
5.4.4.5 Data presentation
a. In addition to 5.2.9.4, data presentation shall be a graphic output of
current versus time displaying the transient characteristics with
followingconditions:
1. amplituderesolutionwithin3%oftheapplicablelimit,
2. timebase resolutionwithin 10%ofrise timefor measurement of
riseandfallslopes.
NOTE Risetimeisthedurat
ionbetween10%and90%of
peaktopeakamplitude
b. Twoseparatedisplaysshallbeprovidedshowingrespectivelytheinitial
risetimeandthefullinrushresponse.
NOTE Typical
timebasesare10μsfullscalefortheinitial
rise time and 1ms full scale for the full inrush
response.
5.4.5 DC Magnetic field emission, magnetic
moment
5.4.5.1 Overview
The described test method allows obtaininga rough estimateof themagnetic
momentofthe EUT (centreddipoleapproximation).Itinvolvesthe constraint
ofmeasuringthemagneticfieldatdistancestypicallymorethanthreetimesthe
sizeoftheEUT.
ECSSEST2007CRev.1
7February2012
50
If a better model is needed, making it possible to predict the field at closer
distancesormorepreciselythanthecentreddipoleapproximationallows,then
eithermultipledipolemodellingtechniquesorsphericalharmonicstechniques
canbeused.
NOTE ItistheroleoftheEMCAB to assessthe need for
usin
g such techniques, based on mission
requirements.
5.4.5.2 Set-Up
a. The EUT should be set in an earth field compensated area providing
zerofieldconditionsfortheintrinsicmomentdetermination.
NOTE1 This is necessary in case the EUT contains a
significant amount of soft magnetic material, as
without earth field compensation an induced
magneticmomentwouldappear.
NOTE2 Earth field co
mpensation is usually ensured by
2or3setsofHelmholtzcoils.
b. A righthanded orthogonalcoordinate systemXYZ shall beassignedto
theEUTgeometriccentre.
c. The magnetic sensor (singleaxis magnetometer) shall be installed
successivelyonthe6semiaxesattwodifferentreferencedistancesr
1and
r
2 from the geometric centre of the EUT and shall measure the field
projectionalongtheselines.
NOTE The reference distances are typically more than
threetimesthesizeoftheEUT
d. Alternatively the EUT may be installed on a turntable and rotated in
front of a fixed magnetometer, presenting ea
ch XYZ axis (positive and
negative)successivelyalignedwiththesensoraxis.
e. Themagnetic fieldshall bepositive whenorientated fromthecentre of
theEUTtowardsthemagnetometer.
5.4.5.3 Test sequence
a. Thetestsequenceshallbeasfollows:
1. EUT not operating, initial measurements on the six semiaxes at
thereferencedistances.
2. Deperm:
(a) EUT not operating, application of a deperming field in
accordance with Figure 512 fre
quency 3Hz, maximum
amplitude between 4000μT and 5000μT, successively on
eachXYZaxisoftheEUT.
NOTE1 ThisisusuallydoneusingHelmholtzcoils.
NOTE2 A sequence of symmetrical sine periods of
increasing and decreasing amplitude gives
better results than a sine wave modula
ted by
exponentialsorrampfunctions.
ECSSEST2007CRev.1
7February2012
51
(b) Measurement after deperm on the six semiaxes at the
referencedistances.
3. Perm:
(a) EUTnotoperating,applicationofapermfieldof300μTon
eachXYZaxis.
(b) Measurement after perm on the six semiaxes at the
referencedistances.
4. Stray field: EUT operating, measurement on the six semiaxes at
thereferen
cedistances.
5. Finaldeperm:repeat5.4.5.3a.2.
5.4.5.4 Data presentation
a. For DC magnetic field emission, data shall be presented as follows,
supersedingclauses5.2.9.4athrough5.2.9.4i:
1. For ea
ch measurement distance, for each of the 6 semiaxes, the
following induction measurements inμT are plotted in tabular
form:
B(+X),B(X),B(+Y),B(Y),B(+Z),B(Z)
2. Foreachmeasurementdistance,meaninductions,foreachaxis,are
computed in units ofμT and plotted in tabular form, using
followingequations:
 
2
XX
X
BB
B
,

2
YY
Y
BB
B
,
 
2
ZZ
Z
BB
B
3. For each measurement distance r, 3axes magnetic moment
components in units of Am² are calculated using the following
equationsandreported:
Mx=5r3BX MinunitsofAm²,rinmeters,BinμT
My=5r3BY
Mz=5r3BZ
4. Usingva
luesofMx,MyandMzatbothdistancesr1andr2,values
M
1 and M2 of the magnetic moment are calculated using the
followingequationsandreported:
M
1
= M
x
(r
1
)
2
+ M
y
(r
1
)
2
+ M
z
(r
1
)
2
M
2
= M
x
(r
2
)
2
+ M
y
(r
2
)
2
+ M
z
(r
2
)
2
NOTE If the EUT is a centred dipolar source, then
M
1=M2.
ECSSEST2007CRev.1
7February2012
52
deperm field
time
B (µT)
Increase : t > 200 s Decrease : t > 400 s
5000
µ
T
- 5000
µ
T
< 0.03 µT
at switch off
Increase : 2 %
Decrease : 1 %
Figure512:Smoothdepermprocedure
5.4.6 RE, electric field, 30 MHz to 18 GHz
5.4.6.1 Purpose
ThistestprocedureisusedtoverifythatelectricfieldemissionsfromtheEUT
anditsassociatedcablingdonotexceedspecifiedrequirements.
5.4.6.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Measurementreceiver,
2. Datarecordingdevice,
3. Linearlypolarizedantennas,
NOTE Thefollowingantennasarecommonlyused:
30MHzto200MHz,biconical,137cmtiptotip,
200MHzto1GHz,doubleridgehorn,69,0cmby
94,5cmopening,orlogperiodic,
1GHzto18GHz
,doubleridgehorn,24,2cmby
13,6cmopening.
4. Signalgenerators,
5. Stubradiator,
6. LISNdefinedin5.2.4,optional.
ECSSEST2007CRev.1
7February2012
53
5.4.6.3 Test setup
a. AbasictestsetupfortheEUTasshownanddescribedinFigure53and
5.2.6sh
allbemaintainedtoensurethattheEUTisorientedsuchthatthe
surface that produces the maximum radiated emissions is toward the
frontedgeofthetestsetupboundary.
NOTE TheLISNshouldbeused.
b. The measurement system shall be checked by configuring the test
equipmentasshowninFigure513
.
c. TotesttheEUTantennapositioning,thetestsetupboundaryoftheEUT
and associated cabling for use in positioning of antennas shall be
determined.
d. TotesttheEUTantennapositioning,thephysicalreferencepointsonthe
antennasshowninFigure514formea
suringheightsoftheantennasand
distancesoftheantennasfromthetestsetupboundaryshallbeusedas
follows:
1. Position antennas 1m from the front edge of the test setup
boundaryforallsetups.
2. Positionantennasabovethefloorgroundplane.
3. Ensure tha
t no part of any antenna is closer than 1m from the
wallsand0,5mfromtheceilingoftheshieldedenclosure.
e. Theantennapositionsshallbedeterminedasfollows:
1. Fortestingbelow200MHz:
(a) Forsetupswiththesideedgesoftheboundary3morle
ss,
one position, with the antenna centred with respect to the
sideedgesoftheboundary.
(b) Forsetupswiththesideedgesoftheboundarygreaterthan
3m,NantennapositionsatspacingasshowninFigure515,
whereNis theedgetoed
geboundarydistance (inmetres)
dividedby3androundinguptoaninteger.
2. Fortestingfrom200MHzupto1GHz,placetheantennainsucha
number of positions that the entire width of eachEUT enclosure
and the fi
rst 35cm of cables and leads interfacing with the EUT
enclosurearewithinthe3dBbeamwidthoftheantenna.
3. For testing at 1GHz and above, place the antenna in such a
number of positions that the entire width of eachEUT enclosure
and the first 7cm of ca
bles and leads interfacing with the EUT
enclosurearewithinthe3dBbeamwidthoftheantenna.
ECSSEST2007CRev.1
7February2012
54
Testsetupboundary
Shielded
enclosure
Antenna
Signal
generator
Measurement
receiver
Datarecording
device
Connectedfor
measurement
Connectedfor
systemcheck
Figure513:Electricfieldradiatedemission.Basictestsetup
Floor
Groundplane
Testsetup
boundary
Antenna
0,9m
1 m
1
,
2 m
Figure514:Electricfieldradiatedemission.Antennapositioning
ECSSEST2007CRev.1
7February2012
55
Testsetupboundary
Lengthx(m);Npositions=x/3(roundedupnearest
integer)
Shieldedenclosure
Antenna
Antenna
Antenna
x/N(m)
x/N(m)
x/2N (m) x/2N (m)
1m
Figure515:Electricfieldradiatedemission.Multipleantennapositions
5.4.6.4 Test procedures
a. The measurement equipment shall be turned on and waited until it is
stabilized.
b. It shall be verify that the ambient requirements specified in 5.2.2.3 ar
e
metandplotsoftheambienttaken.
c. Themeasurementsystemshallbecheckedasfollows:
1. UsingthesystemcheckpathofFigure513
,performthefollowing
evaluationoftheoverall measurementsystemfromeach antenna
tothedataoutputdeviceatthehighestmeasurementfrequencyof
theantenna:
(a) Applyacalibratedsignallevelthatisatleast6dBbelowthe
limit(limitminusantennafactor)tothecoaxialcableatthe
antennaconn
ectionpoint.
(b) Scan the measurement receiver in the same manner as a
normaldatascan,andverifythatthedatarecordingdevice
indicatesalevelwithin±3dBoftheinjectedsignallevel.
(c) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,
locatetheso
urceoftheerrorandcorrectthedeficiencyprior
toproceedingwiththetesting.
2. UsingthemeasurementpathofFigure513
,performthefollowing
evaluationforeachantennatodemonstratethatthereiselectrical
continuitythroughtheantenna:
(a) Radiate a signal using an antenna or stub radiator at the
highestmeasurementfrequencyofeachantenna.
(b) Tune the measurement receiver to the frequency of the
applied signal and verify tha
t a received signal of
appropriateamplitudeispresent.
NOTE This evaluation is intended to provide a coarse
indicationthattheantennaisfunctioningproperly.
ECSSEST2007CRev.1
7February2012
56
Thereisnorequirementtomeasureaccuratelythe
signallevel.
d. The EUTshall betested byusing themeasurement pathof Figure 5 13
and by det
ermining the radiated emissions from the EUT and its
associatedcablingasfollows:
1. TurnontheEUTandwaituntilitisstabilized.
2. Scan the measurement receiver for each applicable frequency
range,usingthebandwidthsandminimummeasurementtimesin
5.2.9.1
3. Orienttheantennasforbothhorizontallyandvert
icallypolarized
fields.
4. Repeat steps 5.4.6.4d.2 and 5.4.6.4d.3 for each an
tenna position
determinedunder5.4.6.3c,5.4.6.3d,and5.4.6.3e.
5.4.6.5 Data Presentation
a. In addition to 5.2.9.4, data presentation shall provide a statement
verifying the electrical continuity of the measurement antennas as
determinedin5.4.6.4c.1(c).
5.4.7 CS, power leads, 30 Hz to 100 kHz
5.4.7.1 Purpose
ThistestprocedureisusedtoverifytheabilityoftheEUTtowithstandsignals
coupledoninputpowerleads.
5.4.7.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Signalgenerator,
2. Poweramplifier,
3. 1,5 to 2,7 power metal film resistor with inductance lower
1000nHandpeakpowercapability,
4. Oscilloscopes,
5. Currentprobe,
6. Differentialhighvoltageprobe,
7. injectiontransformer,
8. LISNdefinedin5.2.4optio
nal.
5.4.7.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintain a basic test setup for the EUT as specified in 5.2.6 an
d
Figure53.
ECSSEST2007CRev.1
7February2012
57
2. Checkmeasurement systemby configuringthe testequipment in
accordance with Figure 516
, and setting up the oscilloscope to
monitorthevoltageacrosstheresistor.
3. TesttheEUTbyconfiguringthetestequipmentasshowninFigure
517
.
Oscilloscope
differentialprobe
Signal
generator
Power
amplifier
Current
probe
In jection
tran sform e r
Data
record er
Oscilloscope
Resistor
1,5to 2,7
Figure516:CS,powerleads,measurementsystemchecksetup
EUT
Stimu latio nand
monitoringof
EUT
LISN
Current
probe
Power
in p uts
In jection
tran sfo rm er
Data
rec ord er
Oscilloscope
O s cillosc op e
differentialprobe
Signal
generator
Power
amp lifier
1,5to2,7
Figure517:CS,powerleads,signalinjection
ECSSEST2007CRev.1
7February2012
58
5.4.7.4 Procedures
a. The measurement equipment shall be turned on and waited until it is
stabilized.
b. The measurement system shall be checked using the measurement
systemchecksetupforwaveformverificationasfollows:
1. Setthesignalgeneratortothelowesttestfrequency.
2. Increase the applied signal until the oscilloscope indicates the
volta
gelevelspecifiedbyapplicationofclause4.2.8,ve
rifythatthe
outputwaveformissinusoidal,andverifythattheindicationgiven
by thecurrentprobe iswithin 3dBof theexpected levelderived
fromthe1resistorvoltage.
3. Repeat5.4.7.4b.2bysetti
ngthesignalgeneratortothehighesttest
frequency.
c. TheEUTshallbetestedasfollows:
1. TurnontheEUTandwaituntilitisstabilized.
2. Setthesignalgeneratortothelowesttestfrequency,andincrease
thesignal leveluntil thetesting voltageor currentli
mit specified
byapplicationofclause4.2.8,isre
achedonthepowerlead.
3. Repeat 5.4.7.4c.2 at al
l frequency steps through the testing
frequencyrange.
4. Evaluatethesusceptibilityasfollows.
(a) MonitortheEUTfordegradationofperformance.
(b) If susceptibility is noted, determine the threshold level in
accordancewith5.2.10.3.
5. Repe
at5.4.7.4c.2to5.4.7.4c.4forea
chpowerlead.
5.4.8 CS, bulk cable injection, 50 kHz to 100 MHz
5.4.8.1 Purpose
This test procedure is used to verify the ability of the EUT to withstand
sinusoidalwavescoupledontheEUTassociatedcablesandpowerleads.
5.4.8.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Signalgeneratorwithamplitudeorpulsemodulationcapability,
2. pulsegenerator,1kHz100kHz,adjustabledutycycle,
3. poweramplifier,50kHz100MHz,
4. currentinjectionprobe,50kHz100MHz,
5. currentmeasurementprobe,50kHz100MH
z,
6. oneortwocalibrationfixture(s)(jigs)definedin5.2.8.3,
ECSSEST2007CRev.1
7February2012
59
7. onetwochannelsoscilloscope,50inputimpedance,
8. waveformrecordingdevice,
9. 50coaxialload,
10. LISNdefinedin5.2.4,
11
. spectrumanalyzer(optional).
5.4.8.3 Setup
a. Thetestsetupshallbeasfollows:
1. MaintainabasictestsetupfortheEUTasshownanddescribedin
5.2.6andFigure53.
2. Forca
libration:
(a) Configure the test equipment in accordance with Figure
518
.
(b) Placetheinjectionprobeandthemonitorprobearoundthe
centralconductoroftheirrespectivejigs.
NOTE The monitor probe and associated jig are
optional.
(c) Terminate one end of the jig with a 50coaxial load and
connecttheotherendtoa50inputoscilloscope.
(d) Ifacur
rentmonitorprobeisused,connectittoanother50
oscilloscopeinput.
3. FortestingtheEUT:
(a) ConfigurethetestequipmentasshownFigure520
.
(b) Place the injection and monitor probes around a cable
bundleinterfacinganEUTconnector.
(c) Positionthemonitorprobe:
5cmfromtheconnectoriftheoveralllengthofthe
connectorandbackshelldoesnotexceed5cm,
attheoveralllengthoftheconnectoran
dbackshell,
otherwise.
(d) Positiontheinjectionprobe5cmfromthemonitorprobe.
5.4.8.4 Test procedures
a. The measurement equipment shall be turned on and waited until it is
stabilized.
b. Themeasurementsystemshallbecalibratedbyperformingthefollowing
proceduresusingthecalibrationsetup:
1. Setthefrequency ofthegenerator to50kHz andapply thepulse
modulation,Figure519
.
ECSSEST2007CRev.1
7February2012
60
2. Increase the applied signal until the oscilloscope indicates the
voltagespecifiedbyapplicationofclause4.2.8.
3. Veri
fy that both inputs of the oscilloscope, voltagemonitored on
50 and current monitored by the current probe, are consistent
within 3dB. This is applicable only if a current probe is used
duringcalibration
4. Recordthegeneratorsettings.
5. Repeat 5.4.8.4b.2 through 5.4.8.4b.4 for each measurement
freq
uency.
c. The EUT shall be tested by performing the following procedures and
usingtheEUTtestsetup:
1. TurnontheEUTandwaituntilitisstabilized.
2. Select a bundle for testing and clamp the current probes into
position.
(a) Setthemodulatedsinegene
ratortoatestfrequency,atlow
outputlevel.
(b) Adjustthemodulationindutycycleandfrequency.
(c) Increasethegeneratoroutputtotheleveldeterminedduring
calibration,withoutexceedingthecurrentlimitspecifiedby
application of clause 4.2.8 and recor
d the peak current
obtained.
(d) MonitortheEUTfordegradationofperformance.
(e) If susceptibility is noted, determine the threshold level as
measuredbythecurrentmonitorprobeinaccordancewith
5.2.10.3.
(f
) Repeat 5.4.8.4c.2(a) through 5.4.8.4c.2(e) for ea
ch test
frequency.
3. Repeat 5.4.8.4c.2. a
pplying the test signals to each bundle
interfacingwitheachconnectororallbundlestakentogether.
d. The calibration need not be reperformed before testing each EUT
bundle.
ECSSEST2007CRev.1
7February2012
61
Signal
generator
50
Power
amplifier
50coaxial load
Oscilloscope 50 input
or spectrum analyser
Injection probeMonitor probe
External
modulation
source
Ext mod
IN
Jig
Jig
Signal
generator
50
Power
amplifier
50coaxial load
Oscilloscope 50 input
or spectrum analyser
Injection probeMonitor probe
External
modulation
source
Ext mod
IN
Jig
Jig
Figure518:Bulkcableinjection,measurementsystemchecksetup
Time
Volt
Burst length
Period
Time
Volt
Burst length
Period
Figure519:Signaltestwaveform
EUT
LISN
(o rEUT,or
EGSE)
Monitor
probe
Data
reco rde r
Inje ction probe
Osc illo s co pe/
Spectrumanalyser
Signal
generator
50
Power
a mp lif ier
External
modulation
sou rce
Extmod
IN
Figure520:CSofpowerandsignalleads,bulkcableinjection
ECSSEST2007CRev.1
7February2012
62
5.4.9 CS, power leads, transients
5.4.9.1 Purpose
Thistestprocedureisusedtoverifythe abilityof theEUTtowithstandshort
spikescoupledonEUTpowerleads,includinggroundsandreturnsthatarenot
groundedinternallytotheequipmentorsubsystem.
5.4.9.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Spikegeneratorwithfollowingcharacteristics:
(a) Pulsewidthof10μsand0,15μs,
(b) Pulserepetitionratecapabilityupto10pulsespersecond,
(c) Voltageoutputasrequired,positivethennegative,
(d) Outputcontrol,
(e) Adequatetransformer currentcapacity commensuratewith
linebeingtested,
(f
) Outputimpedance5orlessfor0,15μsand1orlessfor
10μstransient,
(g) Externalsynchronizationandtriggeringcapability.
2. Oscilloscopewith50
MHzbandwidthorgreater.
3. Differentialhighvoltageprobe.
4. Isolationtransformer.
5. 5 resistor power metal film resistor with inductance lower
100nHandpeakpowercapability.
6. LISNdefinedin5.2.4,wit
hadded inductor for atotal inductance
notlessthan20μHforparallelinjection.
5.4.9.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintain a basic test setup for the EUT as specified in 5.2.6 an
d
Figure53.
2. Forca
libration:
(a) ConfigurethetestequipmentinaccordancewithFigure521
forverifica
tionofthewaveform.
(b) Set up the oscilloscope to monitor the voltage across the
5resistor.
(c) For EUT testing configure the test equipment as shown in
Figure522 (serie
stestmethod)orFigure523(paralleltest
method).
ECSSEST2007CRev.1
7February2012
63
NOTE1 Withseriesinjection,theinternalLISNcapacitorat
theinputpowersideisprotectingthesource.
NOTE2 With parallel injection, the internal inductance is
protecting the source, so a minimum value is
neededasspecifiedin5.4.9.2a.6.
5 re s istor
Data
recor der
Oscilloscope
Differentialprobe
Spikegenera tor
Seriesorparallel
output
Figure521:CSofpowerleads,transients,calibrationsetup
EUT
Oscillosco pe
Differentialprobe
Stimulationand
monitoringof
EUT
LISN
Spikegenerator
Seriesoutput
Power
inputs
Data
recorder
Figure522:CSofpowerleads,spikeseriesinjectiontestsetup
ECSSEST2007CRev.1
7February2012
64
EUT
Osc illo s c o p e
Differentialprobe
S timulation and
monitoringofEUT
LISN
Spikegenerator
P a ra lleloutput
Power
in p u ts
Datarecorder
Ind u cto rs
Figure523:CSofpowerleads,spikeparallelinjectiontestsetup
5.4.9.4 Procedures
a. Thetestproceduresshallbeasfollows:
1. Turnonthemeasurementequipmentandwaituntilitisstabilized.
2. Performthefollowingprocedureusingthecalibrationsetup:
(a) Adjust the pulse generator for the pulse width, and pulse
repetitionrate.
(b) Adjust theamplitude ofthe signal to the leve
l specifiedin
associatedlimit.
(c) Verifythatthewaveformcomplieswiththerequirements,if
not,correctaccordingly.
(d) Recordthepulsegeneratoramplitudesetting.
3. TesttheEUTbyperformingthefollowingprocedureusingthetest
setup:
(a) TurnontheEUTandwaituntilitisstabilized.
(b) Adjustthesp
ikegeneratortoapulseduration.
(c) Apply the test signal to each power lead and increase the
generator output level to provide the specified voltage
without exceeding the pulsed amplitude setting recorded
duringcalibration.
(d) Applyrepetitive(6to10pulsespersecond)positivespikes
totheEUTun
groundedinputlinesforaperiodnotlessthan
2 minutes induration, andif the equipment employ gated
circuitry,triggerthespiketooccurwithinthetimeframeof
thegate.
(e) Repeat5.4.9.4a.3(d)wi
thnegativespikes.
(f) MonitortheEUTfordegradationofperformance.
ECSSEST2007CRev.1
7February2012
65
(g) If susceptibility is noted, determine the threshold level in
accordance with 5.2.10.3 and verify tha
t it is above the
specifiedrequirements.
(h) Recordthepeakcurrentasindicatedontheoscilloscope.
(i) Repeat 5.4.9.4a.3(b) through 5.4.9.4a.3(h) on each power
lea
d.
5.4.10 RS, magnetic field, 30 Hz to 100 kHz
5.4.10.1 Purpose
ThistestprocedureisusedtoverifytheabilityoftheEUTtowithstandradiated
magneticfields.
5.4.10.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Signalsource,
2. Poweramplifier,
3. Radiatingloophavingthefollowingspecifications:
(a) Diameter: 12cm
(b) Numberofturns: 20
(c) Wire: N°12AWG,insulatedcopper
(d) Magneticfluxdensity: 9,510
7
pT/A of applied current at a
distanceof5cmfromtheplaneoftheloop.
4. Loopsensorhavingthefollowingspecifications:
(a) Diameter: 4cm
(b) Numberofturns: 51
(c) Wire: 741Litzwire(7strands,N°41AWG)
(d) Shielding: electrostatic
(e) CorrectionFactor: manufacturer’s data for fact
ors to
convert measurement receiver readings to decibels above
onepicotesla(dBpT)
5. Measurementreceiver,
6. Calibration fixture: coaxial transmission line with 50
characteristic impedance, coaxial connections on both ends, and
spaceforacurrentprobearoundthecentre,
7. Currentprobe,
8. LISN.
ECSSEST2007CRev.1
7February2012
66
5.4.10.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintaina basictestsetup forthe EUTas specifiedin Figure53
and5.2.6.
2. Check the measurement sy
stem by configuring the measurement
equipment, the radiating loop, and the loop sensor as shown in
Figure524
.
3. TesttheEUTbyconfiguringthetestsetupasshowninFigure525
.
Measurement
receiverA
Signal source
and power
amplifier
Measurement
receiverB
5cm
Radiatingloop
Fieldmonitoringloop
Currentprobe
insidejig
Figure524:Measurementsystemcheckconfigurationoftheradiatingsystem
Signalsourceand
poweramplifier
5cm
Radiating
loop
EUT
Figure525:Basictestsetup
ECSSEST2007CRev.1
7February2012
67
5.4.10.4 Test procedures
a. The measurement equipment shall be turned on and waited until it is
stabilized.
b. Thefollowingprocedureshallbe performed usingthecalibrationsetup
forverificationoflevels.
1. Setthesignalsourcetoafrequencyof1kHzandadjusttheoutput
toprovideamagneticfluxdensityof11
0dBpTasdeterminedby
the reading obtained on measurement receiver A and the
relationshipgivenin5.4.10.2a.3(d).
2. Measure the volta
ge output from the loop sensor using
measurementreceiverB.
3. Verifythat theoutputonmeasurementreceiverBiswithin±3dB
oftheexpectedvaluebasedontheantennafactorandrecordthis
value.
c. The EUT shall be tested by performing the following procedures for
det
erminationoflocationandlevelofsusceptibility.
1. TurnontheEUTandwaituntilitisstabilized.
2. Selecttestfrequenciesasfollows:
(a) Locatetheloopsensor 5cmfromtheEUTfaceorelectrical
interfaceconnectorbeingprobedandorienttheplaneofthe
loopsensorparalleltotheEUTface
sandparalleltotheaxis
ofconnectors.
(b) Supply the loop with such a current to produce magnetic
fieldstrengthsatleast10dBgreaterthanthelimitspecified
by application of clause 4.2.8 but not to exceed 15A
(
183dBpT).
(c) Scanthefrequencyrange.
(d) If susceptibility is noted, select no less than three test
frequencies per octave at those frequencies where the
maximumindicationsofsusceptibilityarepresent.
(e) Repositiontheloopsuccessivelytoalocationineach30by
30cm are
a on each face of the EUT and at each electrical
interface connector, and repeat 5.4.10.4c.2(c) and
5.4.10.4c.2(d)to determine locat
ions and frequencies of
susceptibility.
(f) From the total frequency data where susceptibility was
noted in 5.4.10.4c.2(c) through 5.4.10.4c.2(e), selec
t three
frequenciesperoctaveoverthefrequencyrange.
3. At each frequency determined in 5.4.10.4c.2(f) a
pply a current to
theradiatingloopthatcorrespondstothespecifiedlimit,movethe
loop to search for possible locations of susceptibility without
omitting the locations determined in 5.4.10.4c.2(e) wh
ile
maintainingtheloop5cmfromtheEUTsurfaceorconnector,and
verifythatsusceptibilityisnotpresent.
ECSSEST2007CRev.1
7February2012
68
5.4.10.5 Data Presentation
a. Inadditionto5.2.10.4,datapresentationshallprovide:
1. Tabulardatashowingverificationoftheradiatingloopin.5.4.10.4b.
2. Tabularda
ta,diagrams,orphotographsshowingthelocationsand
testfrequenciesdeterminedin.5.4.10.4c.2(e)and5.4.10.4c.2(f).
5.4.11 RS, electric field, 30 MHz to 18 GHz
5.4.11.1 Purpose
This test procedure is used to verify the ability of the EUT and associated
cablingtowithstandelectricfields.
NOTE Additional requirements can apply beyond
18GHzifSHForEHFpayloadsarepresent.These
arebeyondthescopeofthepresentstandard.
5.4.11.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. Signalgenerators,
2. Poweramplifiers,
3. Receiveantennas,
(a) under1GHz,notapplicable.
(b) 1GHz to 18GHz, double ridge horn, 24.2 by 13.6cm
opening.
NOTE Above 1GHz receive antennas may be not used,
see5.4.11.3b.2.
4. Line
arlypolarizedtransmitantennas
NOTE Thefollowingantennasarecommonlyused:
30MHzto200MHz,biconical,137cmtiptotip,
200MHzto1GHz,doubleridgehorn,69,0cmby
94,5cmopening,orlogperiodic,
1GHzto18GHz,doubleridgehorn,24
,2cmby
13,6cmopening.
5. Electricfieldsensors(physicallysmall‐electricallyshort),
6. Measurementreceiver,
7. Powermeter,
8. Directionalcoupler,
9. Attenuator,
10. Datarecordingdevice,
11. LISNdefinedin5.2.4,optional.
ECSSEST2007CRev.1
7February2012
69
5.4.11.3 Test setup
a. A basic test setup shall be maintained for the EUT as shown and
specifiedin5.2.6.andFigure53.
NOTE TheLISNcanbeused.
b. Forme
asurementsystemcheck,followingsensorsshallbeused:
1. electricfieldsensorsfrom30MHzto1GHz.
2. eitherreceiveantennasorelectricfieldsensorsabove1GHz.
NOTE For the electric sensors and receiving antennas to
beuse
d,see5.4.11.2a.3and5.4.11.2a.5.
c. TestequipmentshallbeconfiguredasspecifiedinFigure526
.
d. Themeasurementsystemshallbecheckedasfollows:
1. Placetheelectricfieldsensors1mfrom,anddirectlyopposite,the
transmit antennaas shownFigure 527and aminimum of30cm
ab
ovethegroundplane,notdirectlyatcornersoredgesofEUT.
2. PlacethereceiveantennaspriortoplacementoftheEUT,asshown
Figure528
,onadielectricstandatthepositionandheightabove
thegroundplanewherethecentreoftheEUTwillbelocated.
e. FortestingEUT,thetransmitantennasshallbeplaced1mfromthetest
setupboundaryasfollows:
1. 30MHzto200MHz
(a) Fortestsetupbounda
ries3m(includingallenclosuresof
theEUTandthe2mofexposedinterconnectingandpower
leads specified in 5.2.6.6.), centre the antenna between the
edges of the test setup bounda
ry, ensuring that the
interconnecting leads represent the actual platform
installationandareshorterthan2m.
(b) For test setup boundaries >3m, use multiple antenna
positions(N)atspacingsas specifiedin Figure527,where
the number of antenna positions (N) is deter
mined by
dividingtheedgetoedgeboundarydistance(inmetres)by
3androundinguptoaninteger.
2. 200MHzandabove,usemultipleantennapositions(N)asshown
Figure 527,
where the number of antenna positions (N) is
determinedasfollows:
(a) Fortestingfrom200MHzupto1GHz,placetheantennain
anumberofpositionssuchthattheentirewidthofeachEUT
enclosureandthefirst35cmofcablesandleadsinterfacing
with the EUT enclosure are within the 3dB beamwidth of
theantenna
(b) For testi
ng at 1GHz and above, place the antenna in a
numberofpositionssuchthattheentirewidthofeachEUT
enclosureand thefirst 7cmof cablesand leadsinterfacing
with the EUT enclosure are within the 3dB beamwidth of
theantenna.
ECSSEST2007CRev.1
7February2012
70
f. For testing EUT, the placement of electric field sensors shall be
maintainedasspecifiedin5.4.11.3d.1.
Shieldeden closure
Antenna
Signal
generator
LISN
EUT
Electricfield
sen sor
display
Testsetu p boundary
Electricfi el d
sen sor
RFa mplif ier
3m
1,5m
EGSE
Figure526:Testequipmentconfiguration
ECSSEST2007CRev.1
7February2012
71
Shieldedenclosure
Antenna
Antenna
Anten na
x/N(m) x/N(m)
x/2N(m)
x/2N(m)
1m
Electric field
sensor
Electric field
sensor
Electric field
sensor
Testsetupboundary
Nele ctricfieldsensorpositions
Nantenna po sitions
x(m)=edgetoedgebo u ndarydistance
Electricfield
sensor
Electricfield
sensor
Electricfield
sensor
Figure527:RSElectricfield.Multipletestantennapositions
Signalso u rce
RFamp lifie r
Pow ermeter
Testsetupbounda ry
Directional
cou p ler
Signal
so u rce
Shieldedenc losure
Measurement
receiver
Connectedfo r
systemcheck
Connectedfo r
measurement
Transmit
antenna
Receive
antenna
Figure528:Receiveantennaprocedure
ECSSEST2007CRev.1
7February2012
72
5.4.11.4 Test procedures
a. The measurement equipment and EUT shall be turned on and waited
untiltheyarestabilized.
NOTE Itis importantat thispointto assessthe testarea
for potential RF hazards and take precautionary
steps to assure safety of test personnel and fire
avoidance.
b. Themeasurementsystemshallbecheck
edandcalibratedasfollows:
1. Procedurewhenusingelectricfieldsensors:
(a) Record the amplitude shown on the electric field sensor
displayunitduetoEUTambient.
(b) Repositionthesensoruntilthelevelmeasuredin(a)aboveis
<10%ofthefieldstrengthtobeusedfo
rtesting.
2. Procedurewhencalibratingwiththereceiveantenna:
(a) Connectasignalgeneratortothecoaxialcableatthereceive
antennaconnectionpoint(antenna removed),setthesignal
sourcetoanoutputlevelof0dBmatthehighestfrequency
to be used in the present test setup and tune the
measurementreceive
rtothefrequencyofthesignalsource.
(b) Verify that the output indication is within ±3dB of the
applied signal, considering alllosses from the generator to
themeasurementreceiverand,ifdeviationslargerthan3dB
are found, locate the source of the error and co
rrect the
deficiencybeforeproceeding.
(c) Connectthereceiveantennatothecoaxialcableasspecified
in Figure 528
, set the signal source to 1kHz pulse
modulation,50%dutycycle,establishanelectricfieldatthe
test frequency by using a transmitting antenna and
amplifier,andgraduallyincreasetheelectricfieldleveluntil
itreachesthelimitspecifiedbyapplicationofclause4.2.8.
(d) Scan the test fre
quency range and record the input power
levelstothetransmitantennatomaintaintherequiredfield.
(e) Repeat procedures 5.4.11.4b.2(a) through 5.4.11.4b.2(d)
whenever the test setup is modified or an antenna is
changed
.
NOTE The ground plane tends to shortcircuit
horizontally polarized fields, so that more
powerisneededtoachievethesamefieldvalue
in horizontal polarization as in vertical
polarization.
c. TheEUTshallbetestedasfollows:
1. Procedurewh
enusingelectricfieldsensors:
(a) Establish an unmodulated electric field at the test start
frequencybyusinganamplifierandtransmit antenna,and
ECSSEST2007CRev.1
7February2012
73
graduallyincreasetheelectricfieldleveluntilitreachesthe
limitspecifiedbyapplicationofclause4.2.8.
(b) Setthesignalsourceto1kH
zpulsemodulation,50%duty
cycleandapplythemodulation.
(c) Repeatthetestatallfrequencytestswhilemaintainingfield
strengthlevels in accordancewiththe associated limit,and
monitorEUTperformanceforsusceptibilityeffects.
2. Procedurewhencalibratingwiththere
ceiveantenna:
(a) Remove the receive antenna and reposition the EUT in
conformancewith5.4.11.3e.
(b) Setthesignalsourceto1kH
zpulsemodulation,50%duty
cycle,establishanelectricfieldattheteststartfrequencyby
using an amplifier and transmit antenna, and gradually
increase the input power level until it corresponds to the
levelrecordedduringthecalibrationroutine.
(c) Repeat the test at al
l test frequencies while assuring the
transmitter inputpower isadjusted inaccordance withthe
calibration data collected, and constantly monitor the EUT
forsusceptibilityconditions.
3. If susceptibility is noted, determine the threshold level in
accordancewith5.2.10.3.
4. Perform test
ing over the frequency range with the transmit
antenna vertically polarized, and repeat the testing with the
transmitantennahorizontallypolarized.
NOTE The settings needed to achieve the specified
fieldlevelinverticalpolarizationarereusedas
isforthetestinhorizontalpolarization.
5. Repeat5.4.11.4c.4foreachtr
ansmitantennapositiondeterminedin
5.4.11.3e.
5.4.11.5 Data presentation
a. Inadditionto5.2.10.4,datapresentationshallprovide:
1. graphicalortabular data listing(receiveantennaprocedureonly)
allcalibrationdatacollectedtoincludeinputpowerrequirements
usedversusfrequency,andresultsofsystemcheckin5.4.11.4b.2(c)
and5.4.11.4b.2(d).
2. the correctio
n factors used to adjust sensor output readings for
equivalentpeakdetectionofmodulatedwaveforms.
3. diagramsorphotographsshowingactualequipmentsetupandthe
associateddimensions.
ECSSEST2007CRev.1
7February2012
74
5.4.12 Susceptibility to electrostatic discharges
5.4.12.1 Overview
The purpose of this test is to determine the existence of susceptibility to
electromagneticeffectsofelectrostaticdischarges.
5.4.12.2 Test equipment
a. Thetestequipmentshallbeasfollows:
1. DC high voltage supply or an ESD generator as specified in
IEC6100042(Edition1.2).
NOTE UseoftheESDgeneratorislesshazardousthan
use of the DC high voltage supply for test
operators.
2. Thedischargeprimarycircuitisconsti
tutedof:
(a) 6kVsparkgap,
NOTE1 Anairsparkgaporanovervoltagesuppressor
inasealedpressurizedenvelopcanbeused.
NOTE2 An air spark gap is less stable and has longer
risetime.
(b) 50pF capacitance, highvoltage capacitor with inductance
lesstha
n20nH,
(c) 47dampingresistor(highvoltagespecification),
NOTE The value can be adjusted at critical damping
dependingonvalue ofcapacitance Cand self
inductanceofthedischargecircuit;
(d) 10kresistors(highvoltagespecification).
NOTE Choke resistors prevent highfrequency
components of discharge from flo
wing in
uncontrolledpathssothedischargeparameters
are not dependent on length and position of
highvoltagesourcewires.
3. Monitoringdevices:
(a) Two current probes, 100A peak capability and more than
100MHzbandwidth,
(b) Onehighvoltageprobe,10kVrange,1MHzbandwidth,
NOTE If the probe input impe
dance is not high
enough,itcan preventgap arcingbylowering
theavailablevoltage.
(c) One twochannels digital oscilloscope with pretriggering
capability.
NOTE Typical values are 100ns pretrigger time,
displaywindowintherange1μsto10μsand
resolutionbetterthan4ns.
ECSSEST2007CRev.1
7February2012
75
5.4.12.3 Setup
a. Thetestsetupshallbeasfollows:
1. Maintaina basic testsetup for the EUT as specified in5.2.6. an
d
Figure53.
NOTE It is import
ant at this point to assess the test
area for potential highvoltage hazards and
take necessary precautionary steps to assure
safetyoftestpersonnel.
2. WhenusinganESDgeneratorasahighvoltagepowersupplyas
shownFigure530orFigure531
,itissetinthecontactdischarge
mode.
3. Connect thehighvoltageelectrode to the discharge circuitat the
nodebetweenthesparkgapandthecapacitor.
4. Thedischargecircuitlengthisnotlargerthanwhatisnecessaryto
placeinseriesthe20cmlongcoup
lingwire,thedampingresistor,
thedischargecapacitor,thesparkgapandthecurrentprobe.
NOTE Itisimportanttoensurethatthedischargeloop
is as small as possible for achieving the
transient pulse duration objective defined in
5.4.12.4a.2(d).
5. For ca
librationthe test equipmentis configured asshown Figure
530
,andmeetingfollowingprovisions:
(a) thedischargecircuitisnotcoupledtotheEUT,
(b) chokeresistorsarenearthecapacitor,
(c) the currentprobe monitoringthe primarycurrent fromthe
ESD source is near the damping resistor, at the capacitor
side,
(d) the high voltage probe is mea
suring the voltageacross the
capacitor,groundedatthedampingresistorside.
NOTE Thehighvoltageprobeisnotmeanttomeasure
thevoltageduringthedischargebutthevoltage
reachedbeforedischarge
6. Test the EUT by configuring the test equipment as specified in
Figure531andmeetingthefo
llowingprovisions:
(a) thehighvoltageprobeusedforcalibrationisremoved,
(b) theEUTismountedonaconductivegroundplaneusingthe
spacevehiclemount andattach points,and operatedusing
the actual electrical harness, or an EMC test harness of
identicalconstructiontotheact
ualharness.
NOTE It is preferable to use the actual electrical
harness.
ECSSEST2007CRev.1
7February2012
76
(c) the discharge circuit is supported 5 cm above the ground
plane by a nonconductive standoff with highvoltage
insulationcapability,
(d) fromcalibration,thedischargecircuitis kept unchanged in
size and shape, and tightly electromagnetically coupled
20cmalonganEUTbundle,heldbydielectricbonds
NOTE A ma
ximum separation distance of 1cm
between the injection wire and the outer
circumference of the bundle under test is a
conditionfor achievinga tightelectromagnetic
coupling.
(e) acurrentprobeismonitoringtheprimarycurrentfromthe
ESDsourcenearthedampingresistor,
(f) a current probe is monitoring the c
urrent in the EUT
harness,5cmfromtheEUTconnector.
1
3
3
4
5 cm
5
6
2
7
3
1:EUT
2:EUTorEGSE
3:Accesspan el
4:Interconnectingcable
5:Nonconductive
standoff
6:Groundingplane
7:HVsource
Figure529:SpacecraftchargingESDsusceptibilitytest
ECSSEST2007CRev.1
7February2012
77
Damping
resistor
Choke
resistor
Choke
resistor
ESDsparker
orhighvoltagedcpowersupply
Sparkgap
Current
probe
Highvoltage
capacitor
Highvoltage
p
robe
Injectionwire
Figure530:SusceptibilitytoESD:calibrationconfiguration
Damping
resistor
Choke
resistor
Choke
resistor
Current
probe
Highvoltage
capacitor
Bundleunder
test
20cm
coupling
Current
probe
Injectionwire
tightlycoupled
tothebundle
undertest
ESDsparker
orhighvoltagedcpowersupply
Sparkgap
Figure531:SusceptibilitytoESD:testequipmentconfiguration
ECSSEST2007CRev.1
7February2012
78
5.4.12.4 Procedure
a. Thetestproceduresshallbeasfollows:
1. Turnonthemeasurementequipmentandwaituntilitisstabilized.
2. Performacalibrationusingthecalibrationsetup:
(a) Selectthesparkgapdeviceoradjustthesparklengthatthe
voltagebreakdowntobeusedforthetest,
(b) Turnonthehi
ghvoltagegenerator,
(c) Usingthehighvoltageprobe,checkthebreakdownvoltage
valueisstableandwithin30%fromthevaluetobeused
forthetest.
(d) Monitorthetransientcurrentpulse.
NOTE A goal is 30A, 30ns duration at midheight,
rise ti
me as short as possible. Means for
minimizing the rise time are adjusting the
damping resistor, reducing the size loop,
checking that both choke resistors are as close
as possibletothe capacitor,and technology of
the spark gap (nature of gas and shape of
electrodes).
(e) Recordthelastcurrentan
dvoltagecouple,displayedwitha
commontimereference,
(f) Repeat 5.4.12.4a.2(d) an
d 5.4.12.4a.2(e) with opposite
polarity.
3. TesttheEUTasfollows:
(a) FullypowertheunitduringthecompleteESDtest,
(b) Turnonthehighvoltagegenerator,
(c) Establish a pulse discharge at a pulse rate of 1Hz, with a
pulsedirectionofatleast15positiveand15negative,
(d) Record the la
st primary and secondary current couple,
displayedwithacommontimereference,
(e) Repeat 5.4.12.4a.3(c) and 5.4.12.4a.3(d) on ea
ch bundle
interfacingwitheachelectricalconnector.
5.4.12.5 Data presentation
a. Supersedingclause5.2.10.4,datapresentationshallbeasfollows:
1. Provide tables showing statements of compliance with the
requirement and the induced current level for each interface
connector.
2. Provide oscilloscope records taken during calibration and EUT
testingprocedures.
3. Therequirementof5.2.10.3doesnotap
ply.
ECSSEST2007CRev.1
7February2012
79
Annex A (informative)
Subsystem and equipment limits
A.1 Overview
ThereisnosinglemethodforachievingEMC.
Lowsusceptibleequipmentisfortelecommunicationspacecraftflyingin
a severe EMI environment due to on board large power and possible
residualESD.
Low emissionequipment is for scientific spacecraft for preserving high
sensitivityofdetectors.
Therefore,itisnotpossibletodefineasamesetofli
mitsforallequipmentsof
allspacecraftandlaunchers.TheEMCCPisthevehiclefortailoringlimitsand
testmethods.
However,itisalegitimatedemandofequipmentsuppliertoaskforEMIlimits
outsidetheframeofa specificproject.Conductedandradiatedemissionlimit
s
andsusceptibilitylimitsdefinedhereafterarerecommendedforspaceprojects.
A.2 CE on power leads, differential mode,
30 Hz to 100 MHz
Indifferentialmode,oneachindependentpowerbus,conductedemissionson
powerleads,inducedbyloads,canbelimitedinthefrequencydomainunder
followingconditions:
limitsareintherangeextendingfrom30Hzto100MHz,
a maximum I
NB in units of dB referenced to 1μA is a function of
frequencydefinedinFigureA1,
inthelowfreq
uencyrangethelimitI
CEinunitsofdBreferencedto1μA
(dBμA)isfunctionoftheconsumptionIdc(inamperes)oftheequipment
ontheline,seeFigureA1:

Idc<1A ICE=80
1A<I
dc<100A I=80+20log10(Idc)
I
dc>100A I=120
The mode is called “differential” because measurements
are done
separatelyonhotandreturnwires,howeveritcomprisescommonmode
components.
“Independent”meansconnectedtoseparatepowersources.
ECSSEST2007CRev.1
7February2012
80
100 Adc
30 Adc
10 Adc
3 Adc
1 Adc
0
10
20
30
40
50
60
70
80
90
100
110
120
130
10 100 1 000 10 000 100 000 1 000 000 10 000 000 100 000 000
Frequency (Hz)
Current limit (dBµA)
FigureA1:Powerleads,differentialmodeconductedemissionlimit
ECSSEST2007CRev.1
7February2012
81
A.3 CE on power leads, in-rush currents
The inrushcurrent of anequipment on the powerlines can be limited inthe
time domain with following characteristics in order to limit the voltage
transientsonthepowerbus:
During any nominal change of configuration, the rate of change of
currentislimitedto5×10
4
A/s.
At switching ON the rateof change of current is lower than 2×10
6
A/s,
absolutevalueofriseandfallslopes.
Specific requirements are usually defined for pulsed radars, plasma
thrusterspowerunits.
Limitscanalsobespecifiedforthefollowingcharacteristicsinordertoachieve
compatibilitywiththeupstreamprotectionsofthespacecraftpowersubsystem.
inrushcurrentduration(inms);
totalch
arge(inmC);
inrushcurrentslope(inA/μs).
A.4 CE on power and signal leads, common mode,
100 kHz to 100 MHz
The conducted emissions on bundles in common mode can be limited with
followingcharacteristics:
limitsareintherangeextendingfrom100kHzto100MHz,
I
CEin unitsof dBreferencedto 1μA(dBμA) islowerthan thecurve of
FigureA2,
the same limit is defined for all cables taken together or bundle per
bundle.
ECSSEST2007CRev.1
7February2012
82
0
10
20
30
40
50
60
70
80
90
100,000 1,000,000 10,000,000 100,000,000
Frequency (Hz)
Current limit (dBµA)
FigureA2:Commonmodeconductedemissionlimit
A.5 CE on antenna ports
Spurious conducted emissions on antenna ports can be limited to following
values:
receivers34dBμV,
transmitters(standbymode):34dBμV,
transmitters(transmitmode):
harmonics, except the second and third, and all spurious
emissions:80dBdownthelevelatthefundamental,
thesecondandthirdharmonics50+10logP(wherePisthepeak
poweroutput)or80dBwhicheverisless.
Equipment with antennas permanently mounted are not in the
scopeofthisclause.
A.6 DC magnetic field emission
A.6.1 General
The DC magnetic field emission generated by subsystems, equipment and
elementarycomponentsislimitedorcharacterizedforfollowingpurposes:
forestablishingthemagneticmomentumofthewholespacevehicle,
forestablishingthecompositeDCmagneticfieldatcriticallocations.
The components of the magnetic emission are DC current loops,
soleno
ids,thepermanentfieldofhardmagneticmaterials(magnets)and
ECSSEST2007CRev.1
7February2012
83
the induced magnetic moment by the Earthfield on soft magnetic
materials,includinghysteresis.
A.6.2 Characterization
Following parameters of magnetic properties can be determined or
characterized:
permanent induction parameters of operatingEUT bydetermination of
magneticinductionBinunitsofμTundermagneticzerofieldcondition,
inducedparametersofnotoperatingEUTbydeterminationofmagnetic
inductionBinunitsofμTwhenimmergedinaun
iformcontrolledfield
of30μT(calibratedinabsenceofEUT)ineachof3rectangularsemiaxes,
inbothdirections,
determinationoftheDCmagneticfieldemissionisperformedbyeither
measurementorsimilarity,
determination by similarity is applied to equipment or subsystems
coming from other progra
ms, where reuse as it is or reuse with only
littlemodification.
assessmentofthedipolemodelbymeasurementofmagneticinductionB
at least at two different distances r and comparing respective products
r
3
(m)B(μT),
NOTE Distancesintherange0,5mto1,5mcanbeused.
magnitudeofthemagneticdipole,(whentheequipmentisassimilatedto
adipole)either:
byitsmagneticmoment,or
bythemagneticinductionatsomedistanceofreference.
When the unit is assimilated to a dipole, the inverse cube law
dependence with distance applies, the following relation (worst
case) is used for the equivalence between the magnetic moment
andtheinductionatthedistanced:


3
27
mdAmM102TB
characterizationofthemagneticsourcewhenthedipoleapproximationis
inadequate,eitherby:
amultiplemomentmodel,or
asphericalharmonicsmodel,or
themagneticinductionatthedistanceofmeasurement.
ThedistanceofreferenceisspecifiedbytheEMCABinfunctionof
the size of the space vehicle or of the actual distance between
magneticsourcesandsusceptibleequipment.
Themagneticinductionisaroughindicationthatcanbesufficient
forsomeapplications.
Themult
iplemomentmodelorthesphericalharmonicsmodelisa
precisedeterminationsometimesneededforsensitivepayloads.
ECSSEST2007CRev.1
7February2012
84
Specific characterization methods are implemented for the
multiplemomentmodelorthesphericalharmonicsidentification.
A.6.3 Limit
The DC magnetic emission of subsystems or equipments can be limited at a
levelof0,2μTatadistanceof1mfromanyfaceoftheequipment.
This limit corresponds to dipolelike equipment with a magnetic moment of
1Am
2
.
The limitation is achieved through a combination of techniques: current loop
areaminimizationandcoaxialortwistedcablesuse,nonmagneticmaterialuse,
magneticshieldsuse,compensationtechniqueswithmagnets.
A.7 RE, low-frequency magnetic field
From a few hertz to 50kHz, the magneticfield radiated emissions can be
measured.
Measurement can be performed at several distances for characterizing the
accuracyofadipolemodel.
If the EUT can be assimilated to a magnetic dipole, emission limits are
expressedbyitsmagneticdipolemomentum.
Nolimitisde
finedatequipmentlevel.
Themeasurementisonlyforcharacterizationandusefultoverifycomplianceat
systemlevelthroughanalysis.
Techniquesfor fulfillingEMC requirement atsystem levelarean appropriate
groundingnetwork,magneticshields,anoptimizedlocationofequipmentson
thespacevehicle.
A.8 RE, low-frequency electric field
From a few hertz to 30MHz frequency range the electricfield radiated
emissionsofunitscanbemeasured.
The frequency limits are determined by the EMCAB from payload
specifications.
TheelectricfieldemissionfromtheequipmentisexpressedinunitsofdBabove
1μV/matadistanceof1m.
Measurement
satseveraldistances areperformedforcharacterizingthe decay
law.
Nolimitisdefinedatequipmentlevel.
Themeasurementis onlyfor characterizationand usefultoverifycompliance
withsystemlevelrequirementsthroughanalysis.
ECSSEST2007CRev.1
7February2012
85
Techniques for fulfilling EMC requirement at system level are reduction of
common mode conducted emission from bundles, and electric shields or
appropriatelocationofequipmentsonthespacevehicle.
A.9 RE, electric field, 30 MHz to 18 GHz
In the 30MHz to 18GHz frequency range, electricfield radiatedemissions
fromequipmentandsubsystemincludinginterconnectingcablescanbelimited
underfollowingconditions:
thelimitappliesto:
nonRFequipment,
RF equipment connected to passive loads or EGSE, in nominal
mode,atnominalpower,
thelimitisdefinedbythecurveinFigureA3,
thelimitisforbothhorizontallyandverticallypolarizedfields,
the limit comprises notching lines for launchers or spacecraft receiving
bandsnotrepresentedinFigureA3
.
Additional requirements can apply beyond 18GHz if SHF or EHF
payloads are present. These are beyond the scope of the present
standard.
For equipment having all internal rise times longer than 35ns, the
specifiedupperfrequencylimitcanbereducedto1GHz.
For nonRF equipment if the emissio
n is lower than 20dB below the
requirementbetween500MHzand1GHzthespecifiedupperlimitcan
bereducedto1GHz,withtheexceptionofnotchesabove1GHz,stillto
betested.
40
50
60
70
80
90
100
1.E+07 1.E+08 1.E+09 1.E+10 1.E+11
Frequency (Hz)
E-field (dBµV/m)
FigureA3:Radiatedelectricfieldlimit
ECSSEST2007CRev.1
7February2012
86
A.10 CS, power leads, differential mode, 30 Hz to 100 kHz
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for the susceptibility test on
thepowerleadsspecifiedinclause5.4.7.

theinjectedvoltagelevelisequalorlargerthanthelevelshowninFigure
A4,
alimitationoftheinjectedcurrentbeforethespecifiedvoltageisreached
isapplied:
thelimitofcurrentis1Arms
thevoltagelevelwhenthecurrentlimitisreachedismeasuredand
reported.
Thecurrentappliedisreported.
Independentpowerlinesaretestedseparately.
NOTE Independentmeans“connectedtoseparatepower
sources”.
Exceptinthecaseofstructurereturn,foreachpowerline,hotandreturnwires
aretestedseparately.
NOTE Incaseofstructurereturn
,thetestisonlyapplied
tohotwires.
Thetestsignalcoversthe[30Hz100kHz]frequencyrange.
0
0,2
0,4
0,6
0,8
1
1,2
10 100 1 000 10 000 100 000 1 000 000
Frequency (Hz)
Voltage (Vrms)
FigureA4:Conductedsusceptibilitylimit,frequencydomain
ECSSEST2007CRev.1
7February2012
87
A.11 CS, power and signal leads, common mode, 50 kHz to
100 MHz
The following levels, known to be achievable and already specified in other
standards or project specifications, are proposed for the susceptibility test on
thepowerandsignalleadsspecifiedinclause5.4.8:
thecommonmodelevelof3voltspeaktopeakorlargerisapplied,
thelimitofthecurrentinducedonthebundleis3Apeaktopeak,
thetestsignalispulsemodulated,
NOTE Square wave modulation is a particular case of
pulsemodulation.
thedutycyc
leisdependingonthecarrierfrequency,accordingtoTable
A1.
Thesamelevelisappliedtoallcablestogetherortobundlestakenseparately.
Thecommonmodeinducedcurrentonthebundleisreported.
Thetestsignalcoversthe[50kHz100MHz]frequencyrange.
TableA1:Equipment:susceptibilitytoconductedinterference,testsignal
Frequencyrange Pulserepetitionfrequency Dutycycle
50kHz1MHz 1kHz 50%(squarewave)
1MHz10MHz 100kHz 20%
10MHz100MHz 100kHz 5%
A.12 CS, power leads, short spike transients
The following levels, known to be achievable and already specified in other
standardsorprojectspecifications,areproposedforthetransientsusceptibility
testonthepowerlinesspecifiedinclause5.4.9:
aser
iesofpositivespikes,thenaseriesofoppositespikessuperposedon
thepowervoltageshallbeapplied,
atanytimestep,thevoltagespikeamplitudeis:
+100% or‐100% of the actual line volta ge if the nominal bus
voltageislowerthan100V,FigureA5.
+50% or‐100% of the actual line voltage if the nominal bus
voltageisequalorlargerthan100V
Level0inFigureA5repr
esentstheDCbusvoltage.
OnlythepositivespikeisrepresentedinFigureA5.
When a negative spik
e is applied, the absolute instantaneous
transientvoltagegoesdownto0,nevernegative.
ECSSEST2007CRev.1
7February2012
88
testsareperformedwithtwospikedurations,thefirstzerocrossingisat
T=150nsandatT=10μs.
Independentpowerlinesaretestedseparately.
Independentmeans“connectedtoseparatepowersources”.
-60
-40
-20
0
20
40
60
80
100
120
0 0,5 1 1,5 2 2,5 3 3,5 4 4,5
Normalized time (in units of T=150ns or T=10µs)
Percentage of line voltage
FigureA5:CS,voltagespikeinpercentageoftestbusvoltage
A.13 RS, magnetic field, 30 Hz to 100 kHz
The following levels, known to be achievable and already specified in other
standardsorprojectspecifications,areproposedfortheradiatedsusceptibility
test,magneticfield,specifiedinclause5.4.10:
the amplitude of the test signal is equal to or larger than the level in
FigureA6,
thesourceisloca
tedat5cmofanyfaceoftheEUT.
Thesignaltestcoversthe[30Hz100kHz]frequencyrange.
ECSSEST2007CRev.1
7February2012
89
100
110
120
130
140
150
160
170
180
190
10 100 1 000 10 000 100 000
Frequency (Hz)
Limit level (dBpT)
FigureA6:Radiatedsusceptibilitylimit
A.14 RS, electric field, 30 MHz to 18 GHz
The following levels, known to be achievable and already specified in other
standardsorprojectspecifications,areproposedforradiatedsusceptibilitytest,
electricfield,specifiedinclause5.4.11:
theamplitudeofthetestsignalis:
equipment in the vicinity of beams, outside of the main frame
consideredasaFaradaycage:10V/m,
An electric field of more than 10V/m is applied if RF analysis
demonstrates thatthe expected electric fieldseen inflight by the
equipmentislarger,
equipmentfarfrommainlobesandsecondarylobes,outsideofthe
mainframe:1V/m,
equipmentinsidethemainframe:1V/m.
AtRFtransmitfrequencies,theRSlevelshouldbetailoredup;at
RF receive frequencies, the RS level should be tailored down for
receivers.
anAMorPAMtestsignalisused,
bothhorizontallyandverticallypolarizedfieldsareused,
circularpola
rizedfieldsarenotused.
Thesignaltestcoversthe[30MHz18GHz]frequencyrange.
Additionalrequirementscana pplybeyond18GHzifSHForEHFpayloadsare
present.Thesearebeyondthescopeofthepresentstandard.
ECSSEST2007CRev.1
7February2012
90
A.15 Susceptibility to electrostatic discharge
The following dispositions, known to be achievable and already specified in
otherstandardsorprojectspecifications,areproposedfortheESDtestspecified
inclause5.4.12.
Thetestisperformedonfollowingequipment,includingornotdigitalcircuits:
unitscomprisinghighvoltagepowersources,
unitsmanhandledduringnormaloperation,
Thisconditionappliestomannedflight,
For manhandled equipment, an ESD test by the contact discharge
methodasdefinedinIEC6100042,ismorea
ppropriated,
unitsoutsidethemainframeofthespacevehicledesignedasaFaraday
cage,
units connectedto sensors,actuators, orother units located outsidethe
main framedesigned asa Faraday cagewith the exception ofthe solar
arraypowerbus.
SpecifictestsdefinedinECSSEST3311area
ppliedtoEEDs.
Testofmodelsexpectedtobeortobecomeflightmodelsisnotperformed.
ESDtestingcancauselatentfailuresoftestarticle.
ECSSEST2007CRev.1
7February2012
91
Bibliography
ECSSSST00 ECSSsystemDescription,implementationandgeneral
requirements
MILSTD461E Requirementsforthecontrolofelectromagneticinterference,
characteristicsofsubsystemsandequipment,20August
1999;DepartmentofDefence,USA.