ECSS-E-ST-20-07C Rev. 1

7 February 2012

Space engineering

Electromagnetic compatibility



ECSS Secretariat

ESA-ESTEC

Requirements & Standards Division

Noordwijk, The Netherlands

ECSS‐E‐ST‐20‐07CRev.1

7February2012

2

Foreword

This Standard is one of the series of ECSS Standards intended to be applied together for the

management, engineering and product assurance in space projects and applications. ECSS is a

cooperative effort of the European Space Agency, national space agencies and European industry

associationsforthepurposeofdevelopingandmaintainingcomm

onstandards.Requirementsinthis

Standardaredefinedintermsofwhatshallbeaccomplished,ratherthanintermsofhowtoorganize

and perform the necessary work. This allows existing organizational structures and methods to be

appliedwheretheyareeffective,andforthestructuresandmethodstoevolveasnecessarywithout

rewrit

ingthestandards.

This Standard has been prepared by the ECSS‐E‐ST‐20‐07 Working Group, reviewed by the ECSS

ExecutiveSecretariatandapprovedbytheECSSTechnicalAuthority.

Disclaimer

ECSSdoesnotprovideanywarrantywhatsoever,whetherexpressed,implied,orstatutory,including,

butnotlimitedto,anywa

rrantyofmerchantabilityorfitnessforaparticularpurposeoranywarranty

that the contents of the item are error‐free. In no respect shall ECSS incur any liability for any

damages,including,butnotlimitedto,direct,indirect,special,orconsequentialdamagesarisingout

of,resultingfrom,orin an

ywayconnectedto theuseof thisStandard,whether ornotbasedupon

warranty,businessagreement,tort,orotherwise;whetherornotinjurywassustainedbypersonsor

propertyorotherwise;andwhetherornotlosswassustainedfrom,oraroseoutof,theresultsof,the

item,oranyservi

cesthatmaybeprovidedbyECSS.

Publishedby: ESARequirementsandStandardsDivision

 ESTEC,P.O.Box299,

 2200AGNoordwijk

 TheNetherlands

ECSS‐E‐ST‐20‐07CRev.1

7February2012

3

Change log

ECSS‐E‐ST‐20‐07A Neverissued

ECSS‐E‐ST‐20‐07B Neverissued

ECSS‐E‐ST‐20‐07C

31July2008

Firstissue

ECSS‐E‐ST‐20‐07C

Rev.1

7February2012

FirstissueRevision1

ChangeswithrespecttoECSS‐E‐ST‐020‐07C(31July2008)areidentifiedwith

revisiontracking.

Requirementsmodified:

• 4.2.5.1a.:correctedcross‐referenceinNoteto5.4.5.

• 4.2.11.2e.:Notewithexampledeleted

• 4.2.11.2g:modified

• 5.

2.1a.1.and5.modified

• 5.3.3a.tod.modified

• 5.3.4a.:Note2deletedandquotesignintextcorrected

• 5.4.3.3a.3.(a):addedtorequirementʺfordifferentialmodetestingand

Figure5‐9forcommonmodetestingʺ

• 5.4.4.4a.3.(b):correctedinrequirementreferencetoEUTswitchtoread

ʺFigure5‐11

.bʺ

• 5.4.9.2a.2ʺ.:changedbandwidthfromʺ10MHzʺtoʺ50MHzʺ

• 5.4.11.3e.2.:correctedreferencetoFiguretoreadʺFigure5‐27ʺ



Editorialcorrectionsinrequirements:

• Thepossessivecase‐likenotation”‘s”usedtomeanpluralafter

acronymshavebeencorrected,e.g.“EEDʹs“and“LISNʹs“ha

sbeen

changedinto“EEDs“respectively“LISNs“whenitmeanspluralin

4.2.2.2c,5.2.4a,5.2.4b,5.2.4c,5.2.6.3a,5.2.6.5a,5.2.6.6.3.c,5.2.6.6.3.d,

5.2.6.6.3.f,5.3.2b,5.4.3.2.a.9

• Correctedin5.3.4atheincorrect“unquote“sign.

• 5.4.4.5bNOTE:CorrectedtypoinwordʺTypicalʺ



Modificationsininformativeparts:

• 4.2.11.1:addedreferencetoclause4.2.11.2andFig

ure4‐1(Figurewas

movedfrom4.2.11.3),correctedstyleofparagraphfromʺrequirementʺto

ʺinformativetextʺ.TextofNotemodified.

ECSS‐E‐ST‐20‐07CRev.1

7February2012

4

• Figure4‐1modifiedandmovedtoclause4.2.11.1.

• 5.4.1:correctedreferencefromʺ5.4.11.4ʺtoreadʺ5.4.12ʺ

• Table5‐3:cross‐referencesinlastcolumncorrected.

• AnnexA.2:correctedin3rdbulletʺICEʺtoreadʺI

CEʺ,ʺmeasurementʺto

readʺmeasurementsʺʺandreferencetoreadʺFigureA‐1ʺ

• FigureA‐1:CaptionofFiguremodified

• FigureA‐2movedfromA.2toA.4

• A.4:correctedin2ndbulletreferencetoreadʺFigureA‐2ʺ

• FigureA‐3movedtoA.9

• A.6.2:Formulacorr

ected

• A.9:correctedin2ndand4thbulletreferencetoreadʺFigureA‐3ʺ

• FigureA‐4movedtoA.10

• A.10:correctedinfirstparagraphreferencetoreadʺ5.4.7ʺ

• A.10:correctedin1stbulletreferencetoreadʺFigureA‐4ʺ

• A.11:correctedinfirstparagraphre

ferencetoreadʺ5.4.8ʺ

• A.13:correctedinfirstparagraphreferencetoreadʺ5.4.10ʺ

• A.14:correctedinfirstparagraphreferencetoreadʺ5.4.11ʺ

• A.15:correctedinfirstparagraphreferencetoreadʺ5.4.12ʺ



ECSS‐E‐ST‐20‐07CRev.1

7February2012

5

Table of contents

Change log.................................................................................................................3

Introduction................................................................................................................9

1 Scope.....................................................................................................................10

2 Normative references...........................................................................................11

3 Terms, definitions and abbreviated terms..........................................................12

3.1 Terms from

other standards .....................................................................................12

3.2 Terms specific to the pre

sent standard ....................................................................13

3.3 Abbreviated terms

....................................................................................................15

4 Requirements........................................................................................................17

4.1 General system requirements

..................................................................................17

4.2 Detailed system requirements

..................................................................................17

4.2.1 Overview

.....................................................................................................17

4.2.2 EMC

with the launch system ......................................................................17

4.2.3 Lightning en

vironment ................................................................................18

4.2.4 Spacecraft charging and

effects.................................................................18

4.2.5 Spacecraft

DC magnetic emission .............................................................19

4.2.6 Radiofrequency compatibility

......................................................................20

4.2.7 Hazards of

electromagnetic radiation.........................................................20

4.2.8 Intrasystem EMC

........................................................................................20

4.2.9 EMC

with ground equipment ......................................................................21

4.2.10 Grounding

...................................................................................................21

4.2.11 Electrical bo

nding requirements .................................................................22

4.2.12 Shielding (e

xcepted wires and cables).......................................................23

4.2.13 Wiring (inclu

ding wires and cables shielding).............................................23

5 Verification............................................................................................................25

5.1 Overview

..................................................................................................................25

5.1.1 Introduction

.................................................................................................25

5.1.2 Electromagnetic effect

s verification plan ....................................................25

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5.1.3 Electromagnetic effects verification report..................................................25

5.2 Test condit

ions .........................................................................................................25

5.2.1 Measureme

nt tolerances............................................................................25

5.2.2 Test site

......................................................................................................26

5.2.3 Ground plane

..............................................................................................28

5.2.4 Power source impedance

...........................................................................28

5.2.5 General test precautions

............................................................................30

5.2.6 EUT test configurations

..............................................................................30

5.2.7 Operation of EUT

........................................................................................33

5.2.8 Use of measurement equipment

................................................................34

5.2.9 Emission testing

.........................................................................................35

5.2.10 Susceptibilit

y testing...................................................................................37

5.2.11 Calibration

of measuring equipment...........................................................38

5.3 System leve

l .............................................................................................................39

5.3.1 General

.......................................................................................................39

5.3.2 Safety marg

in demonstration for critical or EED circuits ............................39

5.3.3 EMC

with the launch system ......................................................................39

5.3.4 Lightning

.....................................................................................................40

5.3.5 Spacecraft and

static charging ...................................................................40

5.3.6 Spacecraft

DC magnetic field emission......................................................40

5.3.7 Intra–system electroma

gnetic compatibility................................................40

5.3.8 Radiofrequency compatibility

......................................................................40

5.3.9 Grounding

...................................................................................................41

5.3.10 Electrical bo

nding .......................................................................................41

5.3.11 Wiring and shielding

...................................................................................41

5.4 Equipment and subsyst

em level test procedures.....................................................41

5.4.1 Overview

.....................................................................................................41

5.4.2 CE, power l

eads, differential mode, 30 Hz to 100 kHz...............................42

5.4.3 CE, power a

nd signal leads, 100 kHz to 100 MHz .....................................44

5.4.4 CE, power l

eads, inrush current .................................................................47

5.4.5 DC Magneti

c field emission, magnetic moment .........................................49

5.4.6 RE, electric

field, 30 MHz to 18 GHz..........................................................52

5.4.7 CS, power l

eads, 30 Hz to 100 kHz............................................................56

5.4.8 CS, bulk ca

ble injection, 50 kHz to 100 MHz..............................................58

5.4.9 CS, power l

eads, transients........................................................................62

5.4.10 RS, magneti

c field, 30 Hz to 100 kHz.........................................................65

5.4.11 RS, electric

field, 30 MHz to 18 GHz..........................................................68

ECSS‐E‐ST‐20‐07CRev.1

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5.4.12 Susceptibility to electrostatic discharges....................................................74

Annex A (informative) Subsystem and equipment limits.....................................79

A.1 Overview

..................................................................................................................79

A.2 CE on powe

r leads, differential mode, 30 Hz to 100 MHz........................................79

A.3 CE on powe

r leads, in-rush currents........................................................................81

A.4 CE on powe

r and signal leads, common mode, 100 kHz to 100 MHz .....................81

A.5 CE on antenna ports

................................................................................................82

A.6 DC magneti

c field emission......................................................................................82

A.6.1 General

.......................................................................................................82

A.6.2 Characterization

.........................................................................................83

A.6.3 Limit

............................................................................................................84

A.7 RE, low-freq

uency magnetic field.............................................................................84

A.8 RE, low-freq

uency electric field................................................................................84

A.9 RE, electric

field, 30 MHz to 18 GHz........................................................................85

A.10 CS, power l

eads, differential mode, 30 Hz to 100 kHz.............................................86

A.11 CS, power a

nd signal leads, common mode, 50 kHz to 100 MHz ...........................87

A.12 CS, power l

eads, short spike transients...................................................................87

A.13 RS, magneti

c field, 30 Hz to 100 kHz.......................................................................88

A.14 RS, electric

field, 30 MHz to 18 GHz........................................................................89

A.15 Susceptibilit

y to electrostatic discharge....................................................................90

Figures

Figure 4-1: Bonding requirements..........................................................................................22

Figure 5-1: RF absorber loading diagram ..............................................................................27

Figure 5-2: Line impedance stabilization network schematic.................................................29

Figure 5-3: General test setup................................................................................................31

Figure 5-4: Typical calibration fixture .....................................................................................35

Figure 5-5: Conducted emission, 30 Hz to 100 kHz, measurement system check................44

Figure 5-6: Conducted emission, 30 Hz to 100 kHz, measurement setup.............................44

Figure 5-7: Conducted emission, measurement system check..............................................45

Figure 5-8: Conducted emission, measurement setup in differential mode ...........................45

Figure 5-9: Conducted emission, measurement setup in common mode..............................46

Figure 5-10: Inrush current: measurement system check setup ............................................48

Figure 5-11: Inrush current: measurement setup...................................................................48

Figure 5-12: Smooth deperm procedure ................................................................................52

Figure 5-13: Electric field radiated emission. Basic test setup...............................................54

Figure 5-14: Electric field radiated emission. Antenna positioning.........................................54

ECSS‐E‐ST‐20‐07CRev.1

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Figure 5-15: Electric field radiated emission. Multiple antenna positions...............................55

Figure 5-16: CS, power leads, measurement system check set-up.......................................57

Figure 5-17: CS, power leads, signal injection.......................................................................57

Figure 5-18: Bulk cable injection, measurement system check set-up ..................................61

Figure 5-19: Signal test waveform..........................................................................................61

Figure 5-20: CS of power and signal leads, bulk cable injection............................................61

Figure 5-21: CS of power leads, transients, calibration set-up...............................................63

Figure 5-22: CS of power leads, spike series injection test setup..........................................63

Figure 5-23: CS of power leads, spike parallel injection test setup........................................64

Figure 5-24: Measurement system check configuration of the radiating system ...................66

Figure 5-25: Basic test set-up ................................................................................................66

Figure 5-26: Test equipment configuration.............................................................................70

Figure 5-27: RS Electric field. Multiple test antenna positions ...............................................71

Figure 5-28: Receive antenna procedure...............................................................................71

Figure 5-29: Spacecraft charging ESD susceptibility test ......................................................76

Figure 5-30: Susceptibility to ESD: calibration configuration..................................................77

Figure 5-31: Susceptibility to ESD: test equipment configuration ..........................................77

Figure A-1 : Power leads, differential mode conducted emission limit...................................80

Figure A-2 : Common mode conducted emission limit...........................................................82

Figure A-3 : Radiated electric field limit..................................................................................85

Figure A-4 : Conducted susceptibility limit, frequency domain...............................................86

Figure A-5 : CS, voltage spike in percentage of test bus voltage...........................................88

Figure A-6 : Radiated susceptibility limit ................................................................................89

Tables

Table 5-1: Absorption at normal incidence.............................................................................27

Table 5-2: Bandwidth and measurement time........................................................................36

Table 5-3: Correspondence between test procedures and limits...........................................42

Table A-1 : Equipment: susceptibility to conducted interference, test signal .........................87



ECSS‐E‐ST‐20‐07CRev.1

7February2012

9

Introduction

Electromagnetic compatibility (EMC) of a space system or equipment is the

ability to function satisfactorily in its electromagnetic environment without

introducing intolerable electromagnetic disturbances to anything in that

environment.

The space system is designed to be compatible with its external natural,

induced,orman‐made electromagneticenvironment. Natural components are

lightning for la

unchers, the terrestrial magnetic field for space vehicles.

Spacecraft charging is defined as voltage building‐up of a space vehicle or

spacecraftunitswhenimmergedinplasma.Electrostaticdischargesresultfrom

spacecraft charging with possible detrimental effects. External man‐made

interference, intentional or not, are caused by radar or telecommunication

bea

msduringgroundoperationsandthelaunchingsequence.IntersystemEMC

alsoappliesbetweenthelauncheranditspayloadorbetweenspacevehicles.

Intrasystem EMC is defined betweenall electrical,electronic, electromagnetic,

andelectromechanicalequipmentwithinthespacevehicleandbythepresence

of its self‐induced electromagnetic environment. It comprises the int

entional

radiated electromagnetic fields and parasitic emission from on‐board

equipment. Both conducted and radiated emissions are concerned. An

electromagnetic interference safety margin is defined at system critical points

bycomparisonofnoiselevelandsusceptibilityatthesepoints.

ECSS‐E‐ST‐20‐07CRev.1

7February2012

10

Scope

EMCpolicyandgeneralsystemrequirementsarespecifiedinECSS‐E‐ST‐20.

This ECSS‐E‐ST‐20‐07 Standard addresses detailed system requirements

(Clause4), ge

neral test conditions, verification requirements at system level,

and test methods at subsystem and equipment level (Clause 5) as well as

inform

ativelimits(AnnexA).

Assoc

iated to this standard is ECSS‐E‐ST‐20‐06 “Spacecraft charging”, which

addressescharging controland risksarising fromenvironmentaland vehicle‐

inducedspacecraftchargingwhen ECSS‐E‐ST‐20‐07addresseselectromagnetic

effectsofelectrostaticdischarges.

Annexes A to C of ECSS‐E‐ST‐20 document EMC a

ctivities related to

ECSS‐E‐ST‐20‐07: the EMC Control Plan (AnnexA) defines the approach,

methods,procedures, resources,and organization, the ElectromagneticEffects

Verification Plan (AnnexB) defines and specifies the verification processes,

analyses and tests, and the Electromagnetic Effects Verification Report

(AnnexC)documentverification results.The EMEVPandtheEME

VRare the

vehiclesfortailoringthisstandard.

Thisstandardmaybetailoredforthespecificcharacteristicandconstrainsofa

spaceprojectinconformancewithECSS‐S‐ST‐00.



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Normative references

The following normative documents contain provisions which, through

reference in this text, constitute provisions of this ECSS Standard. For dated

references,subsequentamendmentsto,orrevisionofanyofthesepublications

donotapply,However,partiestoagreementsbasedonthisECSSStandardare

encouragedtoinvestigatethepossibilityofapplyingthemorere

centeditionsof

the normative documents indicated below. For undated references, the latest

editionofthepublicationreferredtoapplies.



ECSS‐S‐ST‐00‐01 ECSSsystem‐Glossaryofterms

ECSS‐E‐ST‐20 Spaceengineering‐Electricalandelectronic

ECSS‐E‐ST‐20‐06 Spaceengineering‐Spacecraftcharging

ECSS‐E‐ST‐33‐11 Spaceeng

ineering‐Explosivesystemsanddevices

ECSS‐E‐ST‐50‐14 Spaceengineering–Spacecraftdiscreteinterfaces

IEC61000‐4‐2

(Edition1.2)

Electromagneticcompatibility(EMC)‐Part4‐2:

Testingandmeasurementtechniques‐Electrostatic

dischargeimmunitytest

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Terms, definitions and abbreviated terms

3.1 Terms from other standards

For the purpose of this Standard, the terms and definitions from

ECSS‐S‐ST‐00‐01apply,inparticularforthefollowingterms:

criticalitem

customer

equipment

item

launcher,launchvehicle

mission

requirement

safetycriticalfunction

supplier

spacecraft,spacevehicle

subsystem

system

test

verification



ForthepurposesofthisStandard,thef

ollowingtermshaveaspecificdefinition

containedinECSS‐E‐ST‐20:

conductedemission

electromagneticcompatibility

electromagneticcompatibilitycontrol

electromagneticinterference

electromagneticinterferencesafetymargin

emission

high‐voltage

lightningindirecteffects

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radiatedemission

radiofrequency

susceptibility

susceptibilitythreshold



For the purposes of this document, the following terms have a specific

definitioncontainedinECSS‐E‐ST‐20‐06:

electrostaticdischarge(ESD)

secondaryarc



Forthepurposesofthisdocument,thefollowingtermhasaspecificdefinition

containedinECSS‐E‐ST‐33‐11

:

electro‐explosivedevice(EED)

3.2 Terms specific to the present standard

3.2.1 ambient level

levelofradiatedandconductedsignal,andnoisethatexistatthespecifiedtest

locationandtimewhentheequipmentundertestisnotoperating

NOTE E.g.atmospherics,interferencefromothersources,

and circuit noise or other interference generated

within the measuring set compose the “ambient

level”.

3.2.2 antenna factor

factorthat,whenproperlyappliedtothevoltageattheinputterminals of the

measuringinstrument,yieldstheelectricormagneticfieldstrength

NOTE1 Thisfactorincludestheeffectsofantennaeffective

length,mismatch,andtransmissionlosses.

NOTE2 Theelectricfieldstrengthisnormallyexpressedin

V/mandthema

gneticfieldstrengthinA/morT.

3.2.3 common mode voltage

voltagedifferencebetweensourceandreceivergroundreferences

3.2.4 contact discharge method

method of testing in which theelectrode of the high‐voltage test generator is

held in contact with the discharge circuit, and the discharge actuated by a

dischargeswitch

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3.2.5 electromagnetic environmental effects

impact of the electromagnetic environment upon equipment, systems, and

platforms

NOTE It encompasses all electromagnetic disciplines,

including electromagnetic compatibility;

electromagnetic interference, electromagnetic

vulnerability,hazardsofelectromagneticradiation

to personnel, electro‐explosive devices, volatile

materials,andnaturalphenomenaeffects.

3.2.6 field strength

resultantoftheradiation,inductionandquasi‐staticcomponentsoftheelectric

ormagneticfield

NOTE The term “electric field strength” or “magnetic

field strength” is used, according to whether the

resultant,electricormagneticfield,respectively,is

measured.

3.2.7 ground plane

metalsheet or plateusedas acommon reference pointforcircuit returnsand

electricalorsignalpotentials

3.2.8 improper response

subsystem or equipment response which can be either inadvertent or

unacceptable

3.2.9 inadvertent response

propersubsystemfunctionalresponse(withinnormalrangeoflimits)actuated

by electromagnetic interference, but occurring at other than the normal

operational cycle, which in turn causes improper response to the total space

system

3.2.10 line impedance stabilization network (LISN)

network inserted in the supply leads of an apparatus to be tested which

provides, in a given frequency range, a specified source impedance for the

measurement of disturbance currents and voltages and which can isolate the

apparatusfromthesupplymainsinthatfrequencyrange

3.2.11 not operating

conditionwhereinnopowerisappliedtotheequipment

3.2.12 overshield

shieldsurroundingabundleorashieldedcable

3.2.13 passive intermodulation product

generation of a signal at frequency f = n*f1 + m*f2 from two signals at

frequencies f

1 and f2, where n and m are positive or negative integers, by a

passivedevice,usuallyanelectricalcontact

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3.2.14 port

place of access to a device or network where energy can be supplied or

withdrawn, or where the device or network variables can be observed or

measured

3.2.15 power quality requirements

requirements which define the conducted voltage noise or impedance the

powerusercanexpect

NOTE Noisee.g.fromloadregulation,spikes,andsags.

3.2.16 soft magnetic material

ferromagneticmaterialwithacoercivitysmallerthan100A/m

3.2.17 spurious emission

electromagnetic emission from the intended output terminal of an electronic

device,butoutsideofthedesignedemissionbandwidth

3.2.18 test antenna

antenna of specified characteristics designated for use under specified

conditionsinconductingtests

3.2.19 unit

equipmentthatisviewedasanentityforpurposesofanalysis,manufacturing,

maintenance,orrecordkeeping

NOTE E.g. hydraulic actuators, valves, batteries, and

individual electronic boxes such as on‐board

computer, inertial measurement unit, reaction

wheel, star tracker, power conditioning unit,

transmitters,receivers,ormultiplexers.

3.3 Abbreviated terms

Forthepurposeofthisstandard,theabbreviatedtermsofECSS‐S‐ST‐00‐01and

thefollowingapply:

Abbreviation Meaning

AC

alternatingcurrent

ACS

attitudecontrolsystem

AM

amplitudemodulation

AWG

Americanwiregauge

BCI

bulkcableinjection

CE

conductedemission

CS

conductedsusceptibility

CW

continuouswave

DC

directcurrent

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EED

electro‐explosivedevice

EGSE

electricalgroundsupportequipment

EHF

extremelyhighfrequency(30GHz‐300GHz)

EMC

electromagneticcompatibility

EMCAB

electromagneticcompatibilityadvisoryboard

EMCCP

electromagneticcompatibilitycontrolplan

EMEVP

electromagneticeffectsverificationplan

EMEVR

electromagneticeffectsverificationreport

EMI

electromagneticinterference

EMISM

electromagneticinterferencesafetymargin

ESD

electrostaticdischarge

EUT

equipmentundertest

HV

highvolta

ge

ICD

interfacecontroldocument

LEO

lowEarthorbit

LF

lowfrequency

LISN

lineimpedancestabilizationnetwork

MGSE

mechanicalgroundsupportequipment

PAM

pulseamplitudemodulation

PCM

pulsecodedmodulation

RE

radiatedemission

RF

radiofrequency

r.m.s.

root‐mean‐square

RS

radiatedsusceptibility

SHF

super‐highfr

equency(3GHz‐30GHz)

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Requirements

4.1 General system requirements

EMC policy and general system requirements, and the spacecraft charging

protection program are specified in ECSS‐E‐ST‐20 Electromagnetic

CompatibilityclauseandEMCPlanDRD.

4.2 Detailed system requirements

4.2.1 Overview

This clause 4.2 defines the requirements for design and realization at system

level.They arethe basisfor definitionof activitiesof theEMC programmeto

ensurespace‐system‐levelcompatibilitywithminimumimpacttoprogramme,

cost,schedule,andoperationalcapabilities.

4.2.2 EMC with the launch system

4.2.2.1 Overview

Generalsystemrequirementsfor“EMCwiththelaunchsystem”aredefinedin

ECSS‐E‐ST‐20.

4.2.2.2 Detailed system requirements

a. OverloadcapabilityofthespacecraftRFreceiversduringthepre‐launch

andlaunchphaseswithorwithoutfairing,shallbedemonstratedbythe

spacecraftsupplier.

NOTE1 It is expected the electromagnetic environment

generated by companion payloads is assessed by

the launching company and addressed in the

User’sManual.

NOTE2 A conductivefai

ring is likely to causeresonances

andcavityeffects.

b. Spacecraft equipment shall not exhibitany malfunction, degradationof

performanceordeviationbeyondthetoleranceindicatedinitsindividual

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specification after being exposed, even not operating, to the

electromagneticenvironmentfromthelauncherandlaunchsite.

NOTE Most of spacecraft equipment is not operating

during launch. During the launching sequence

spacecrafttransmittersandreceivers(platformand

payload) can be either in OFF‐ or ON‐state

dependingonthelaunchvehicle.

c. Theelectrom

agneticinterferencesafetymargin(EMISM)ofsafetycritical

equipmentshall beapplied toequipment in ON ‐stateduring prelaunch

andlaunchphaseandtoEEDs

.

4.2.3 Lightning environment

4.2.3.1 Overview

Protection of the space system against both direct and indirect effects of

lightning can be a combination of operational avoidance of the lightning

environmentandelectricaloverstressdesigntechniques.

4.2.3.2 Requirements to the space system

a. Assessmentofrisk, onthelaunchpadinsidethe protectedarea,forthe

space system and its equipment against direct and indirect effects of

lightningbeforelift‐off,shallbeperformed.

b. The spacecraft supplier shall obtain from the launching company the

electromagneticenvironmentimposedonthelauncherpayloadsin case

oflightnin

g.

4.2.4 Spacecraft charging and effects

4.2.4.1 Overview

Mitigation of risks related to spacecraft charging results of a combination of

rules and methods preventing voltage build‐up and so minimizing the

occurrenceofESD,andtechniquesforcontrollingEMIfromresidualESD.

ECSS‐E‐ST‐20 addresses management of spacecraft charging protection and

system‐levelperformanceundereffectsofspacecr

aftchargingandrelatedESD

orsecondaryarcs.

ECSS‐E‐ST‐20‐06 addresses charging control and risks arising fromspacecraft

charging and other environmental effects on the spacecraft’s electrical

behaviour.

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4.2.4.2 EMI control requirements to system and equipment

in relation with ESD

a. Analysis or tests at system level shall be performed for assessing the

threatatsubsystemorequipmentlevel.

NOTE Analysis or tests can be defined in the time or

frequency domain. They are expected to evaluate

the couplinglevel fromthe ESDsource to critical

points.

b. EMIcontrol fromresid

ualESDshallbe performedby a combinationof

shieldingandpassiveoractivefilteringtechniques,implementedonthe

mainstructure,atsubsystemlevelorinsideequipment.

c. EMIcontrolefficiencyshallbeverifiedbytestatsubsystemorequipment

level.

4.2.5 Spacecraft DC magnetic emission

4.2.5.1 Spacecraft with susceptible payload

a. As part of the EMCCP, a magnetic cleanliness control plan shall

document:

1. magneticcontrolguidelines

2. emissionlimitstomagneticsources

3. amagneticbudget

4. specific test methods applied to equipments for emission

measurementandcharacterization

NOTE The test method described in 5.4.5

providing a

dipolemodelcanbeinadequateandreplacedbya

multiple dipole model or a spherical harmonics

model.

4.2.5.2 Attitude control system (ACS)

a. AspartoftheEMCCP,amagneticbudgetshallbemaintainedproviding:

1. Three‐axes components of the space vehicle magnetic dipole

(componentdecreasingwiththeinversecubelawwithdistance).

NOTE Typical values lie in the range 1Am

 or less for

small spacecraft to much more than 10Am

 for

largespacecraft.

2. If the solar array is rotating in the space vehicle axes, separate

evaluationforthemainbodyandthesolararray.

3. Whenthe space vehicle isusing amagnetic sensoras partof the

ACS,evaluationofthemagneticinductionatitslocation.

NOTE The ang

ular deviation is the basic requirement;

however,therequirementisgenerallyexpressedin

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termsofmodificationof thenatural fieldstrength

at the sensor location. For LEO spacecraft if the

error on each axis is less than 1μT, the

modification of the direction is kept less than

20milliradians.

b. The specified maximum magnetic field value shall comprise the

remanent magnetization (magnets, electro‐m

agnets in off‐state, or

residual perm‐up due to hysteresis of soft materials), the induced

magnetization of soft materials by the geomagnetic field, and the

momentumofcurrentloops.

4.2.6 Radiofrequency compatibility

a. Spuriousemissionsrequirements atantenna portsshall bespecifiedfor

RFcompatibilitypurposebythespacecraftsupplier.

b. Whenspecifyinglimitsandfrequencyranges,thefollowingissuesshall

beincluded:

1. sensitivityofpossiblevictimreceiversubsystemsincludingout‐of‐

bandresponse,

2. no limits apply to transmit frequencies and in

formation carrying

modulationbandwidths,

3. highest and lowest intentional frequency used by space system

receivers,

4. antennaportattachments,gain/losscharacteristics.

4.2.7 Hazards of electromagnetic radiation

Assessment of hazards to electromagnetic radiation is a part of the process

specified in ECSS‐Q‐ST‐40‐02 “Hazard analysis”, clause “Hazard analysis

requirements”.

4.2.8 Intrasystem EMC

a. IntrasystemEMCshallbeachievedby:

1. allocation of equipment‐level EMI requirements documented in

theEMCCP,including:

(a) limitsonconductedandradiatedemission,

(b) susceptibilitythresholds.

NOTE Recommended data is defined in Annex A fo

r

equipmentandsubsystems.

b. controlofconductedandradiatedpropagationpathsmethodsdefinedby

clauses4.2.10to4.2.13.

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4.2.9 EMC with ground equipment

a. TheEGSEandMGSEusedforspacecraftintegrationandgroundtesting

shall:

1. NotdegradetheEMCperformanceofthespacecraft;

2. Havenoimpactongroundingorisolation.

b. The EGSEshall be immune to signals usedfor spacecraftsusceptibility

tests.

4.2.10 Grounding

4.2.10.1 Overview

AsspecifiedinECSS‐E‐ST‐20,acontrolledgroundreferenceconceptisdefined

for thespace system. Structuralelements, antenna andRF reference grounds,

power and signal returns, shields and cable shields, safety grounds, EGSE

groundsareconsidered.

4.2.10.2 Requirements

a. A system‐level grounding diagram shall be established including the

EGSE.

b. A ground reference shall be identified for each power, signal, or RF

sourceorreceiver.

c. Anuppervalueofcommonmodevoltageshallbespecifiedconsidering:

1. power quality requirements defined in ECSS‐E‐ST‐20 for

“Sp

acecraftbus”,

2. typeofdetectorsandsensitivity,

3. characteristics of analogue signal monitor receiver circuit, in

accordancewithECSS‐E‐ST‐50‐14,Table5‐2d,

4. characteristics of bi‐level signal monitor receiver circuit, in

accordancewithECSS‐E‐ST‐50‐14,clauseTable6‐2e,

5. hazards du

e to fault currents internal to the space vehicle or

betweenthespacevehicleanditsEGSE.

d. When power and signal share common paths (wire or structure), the

magnitudeofgroundimpedanceshallbelimitedovertheaffectedsignal

spectrum.

NOTE Non‐exclusive techniques for reducing the

impedance are decre

ase of common path length,

decreaseofwireandgroundimpedance,filterson

commonpaths.

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4.2.11 Electrical bonding requirements

4.2.11.1 Overview

Bondingrequirementsareameanforfulfillinggroundingrequirements.

Normativeprovisionsarespecifiedinclause

4.2.11.2andillustratedinFigure4‐1.

NOTE Bonding requirements for charging control are

specified in ECSS‐E‐ST‐20‐06 “Electrical

continuity”,including surfacesandstructural and

mechanicalparts.

Mainframe

Vehiclestructure

Nearbystructure

grounding

Bondingstrap

<20m

Vehicle‐bonding

attachmentpoi nt

Groundreferencepoint

atsystemlevel

<2,5m

Equipment

housing

Connector

Equipment

bondin

stud

<10m

Figure4‐1:Bondingrequirements

4.2.11.2 Normative provisions

a. A vehicle bonding attachment point connected to the vehicle structure

shallbeprovidedasagroundreferencepointatsystemlevel.

b. An equipment bonding stud connected to the unit housing shall be

providedasagroundreferenceatequipmentlevel.

c. Each unit housing shall be bonded to the nearby spacecr

aft structure

fromtheequipmentbondingstud.

d. TheDCresistancebetweentheequipmentbondingstudandthenearby

spacecraftstructureshallbelessthan2,5m.

e. The inductance between the equipment bonding stud and the nearby

spacecraftstructureshallbelessthan30nH.

f. The DC resistance between the unit housing and the vehicle bonding

attachmentpointshallbelessthan20m

g. The DC resistance between the equipment bonding stud and each

connectorhousingshallbelessthan10mΩ.

h. Bondsshallbecapabletocarrythefaultcurrentsdeterminedbyanalysis

atsystemlevel,withoutfusing,burning,orarcing.

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i. If the structure is used as the return current path, bonding provisions

shallbesuchthatDCandACvoltagedropsalongpowerpathscomply

withclause4.2.10.2c.

4.2.11.3 External grounds

a. Thefunctionalityofconnectinggroundingcablesforchargeequalization

shallbeprovidedonspacesystems.

NOTE Charge equalization is needed prior to

implementingother procedures ortheapplication

ofpoweracrosstheinterface.

4.2.12 Shielding (excepted wires and cables)

4.2.12.1 Overview

When shielding is used to control EMC with the environment, it can be

providedbythebasicspacevehiclestructuredesignedasa“Faradaycage”,by

enclosuresofelectronicsboxes,orbycableorbundleovershields.

4.2.12.2 Requirement

a. Electronicsunitsandcablesexternaltothebasicspacevehiclestructure

shallhaveindividualshieldsprovidingattenuationtoEMI.

NOTE It is important to consider apertures used for

pressuredropduringascentandforoutgassing.

4.2.13 Wiring (including wires and cables

shielding)

4.2.13.1 Classification of cables

a. Categorisation of harness and separate routings for wires of different

categoriesshallbedefinedasfollows:

1. applicable to critical lines as defined in ECSS‐E‐ST‐20, Clause

“Electromagneticinterferencesafetymargin”.

2. madeonthebasisofthecharacteristicsofthesignalsonthewire

(andhencetheint

erferencegenerated),andonthesusceptibilityof

thecircuittoEMI.

b. Wiresfallingintoonecategoryshallbeassembledintoasamebundle.

c. Bundlesofdifferentcategoriesshallbeseparated eitherbya separation

distance of 5cm from the outer circumference or by a metallic screen

whentheyar

eroutedonparallelpaths.

NOTE Overshields or spacecraft walls can be used to

fulfiltherequirement.

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d. Wires andcables shall bemarked insuch amanner that personnelcan

visuallyidentifytheEMCcategoryforeachwireorcable.

4.2.13.2 Cable shields

a. Cable shields shall not be used as an intentional current carrying

conductor, except coaxial cables in radiofrequency circuits and high‐

speeddatalinksusingcoaxialcables.

b. Cable shields,other than overshields,shall have an insulated sheathto

preventuncontrolledgrounding.

c. Connectorsusedtocarryshieldedwiresshall

1. notuseanon

conductivefinish,

2. provide contact to the equipment housing with a resistance less

than10mthroughtheequipmentconnectorbodyasshown.

d. Bondingofcableshieldsshallbeasfollowing:

1. Bondingtochassisgroundisperformedatbothends:

(a) throughtheequipmentconnectorbody,

(b) usin

ga backshell thatprovidesforcircumferentialbonding

ofshields,orusingahalo‐ring.

NOTE No grounding inside the equipment through a

connector ground pin in order to prevent any

perturbationinsidetheequipment.

2. Connectiontoelectricalreferenceisperformedthroughdedicated

pins.

NOTE This case typi

cally appears in the design of

detectionchains.

e. Overshieldsshallbebondedtochassisground:

1. atbothends,

2. usinga360°directcontactorabondstrapoflessthan30nH

NOTE SeeNOTEofclause4.2.11.2e.

f. Overshie

ldsshouldbebondedtochassisgroundatintermediarypoints

withaseparationdistancelessthan1mbetweentwogroundingpoints.

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Verification

5.1 Overview

5.1.1 Introduction

This Clause specifies general conditions for EMC testing, requirements for

verification at system level and detailed procedures for unit and subsystem

leveltesting.

5.1.2 Electromagnetic effects verification plan

Theelectromagneticeffectsverificationplan(EMEVP)providestheinstruction

for conducting all activities needed to verify electromagnetic effects

requirements.Thisdocumentdefinesthe approach,methods,procedures,and

specific test conditions. The content is specified in the EMEVP DRD of

ECSS‐E‐ST‐20. The EMEVP is the vehicle for tailoring procedures and test

condit

ions.

5.1.3 Electromagnetic effects verification report

The electromagnetic effects verification report (EMEVR) documents activities

and report analysis or test results in relation with the verification of the

electromagnetic effects. It is established based on the electromagnetic effects

verificationplan(EMEVP).ThecontentoftheEMEVRisdefinedintheEMEVR

DRDofECSS‐E‐ST‐20supplementedbyspecificre

quirementsdefinedhereafter

in5.3and5.4.

5.2 Test conditions

5.2.1 Measurement tolerances

a. ThetoleranceforEMCtestingshallbeasfollows:

1. Distance:±5

%

2. Frequency:±2%

3. Amplitude,measurementreceiver:±2dB

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4. Amplitude, measurement system (includes measurement

receivers,transducers,cables,connectors):±3dB

5. Time(waveforms):±5

%

6. Resistors:±5%

7. Capacitors:±20%

5.2.2 Test site

5.2.2.1 Overview

Shieldedenclosuresorunshieldedsitesareusedfortesting.

Shieldedenclosurespreventexternal environment signalsfrom contaminating

emission measurements and susceptibility test signals from interfering with

electricalandelectronicitemsnearthetestfacility.

Inunshieldedsites,thetestsareperformedduringtimesandconditionswhen

theelectromagneticambientisatit

slowestlevel.

5.2.2.2 Shielded enclosures

a. The enclosures shall be large such that the EUT arrangement

requirementsof5.2.6andantennaposit

ioningrequirementsdescribedin

theindividualtestproceduresaresatisfied.

b. RF absorber material shall be used when performing electric field

radiatedemissionsorradiatedsusceptibilitytestingtoreducereflections

ofelectromagneticenergyandtoimproveaccuracyandrepeatability.

NOTE Example of RF absorber material are carbon

impregnatedfoampy

ramids,andferritetiles.

c. TheRFabsorbershallbeplacedabove,behind,andonbothsidesofthe

EUT,andbehindtheradiatingorreceivingantennaasshowninFigure

5‐1.

d. Minim

umperformanceofthematerialshallbeasspecifiedinTable5‐1.

NOTE The ma

nufacturer’s specification of their RF

absorber material (basic material only, not

installed)canbeused.

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> 1m

>30cm

> 50 cm>30cm

RFabsorberplaced

behindthetestantenna

fromceilingtofloor

Testantenna

EUT

RFabsorberplacedabove,

behindandonbothsidesof

EUTfromceilin

to

round

Figure5‐1:RFabsorberloadingdiagram

Table5‐1:Absorptionatnormalincidence

Frequency Minimumabsorption

80MHz–250MHz 6dB

above250MHz 10dB



5.2.2.3 Ambient electromagnetic level

a. The ambientelectromagnetic level  shallbe measured withthe EUTnot

operatingandallauxiliaryequipmentturnedon.

b. Duringtesting,atleastoneofthefollowingconditionsshallbemet:

1. theambientisatleast6dBbelowtheindividualtestlimits,

2. theEUTcomplieswiththeind

ividualtestlimits,

3. it is shown that recorded data exceeding the limits cannot be

generatedbytheEUT(emissiontests)orcannotsensitizetheEUT

(susceptibilitytests).

c. Backgroundplotsshallbereportedforeachtestconfigurationunlessall

recordeddataisatleast6dBbelowtheindividualtestlimit

s.

5.2.2.4 Ambient conducted level

a. Ambient conducted levels on power leads shall be measured with the

leadsdisconnectedfrom theEUTand connected toaresistive loadthat

drawsthesameratedcurrentastheEUT.

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5.2.3 Ground plane

5.2.3.1 General

a. Iftheactualinstallationisknown,theEUTshallbeinstalledonaground

planethatsimulatestheactualinstallation.

b. If the actual installation is unknown or multiple installations are

expected,thentheEUTshallbeinstalledonametallicgroundplane.

c. Groundplanesshallbe2m²orlar

gerinareawiththesmallersidenoless

than75cm.

d. When a ground plane is not present in the actual EUT installation, the

EUTshallbeplacedonanon‐conductivetable.

NOTE In such a case, test methods are specific and are

likely to differ from the ones in the present

stand

ard.

5.2.3.2 Metallic ground plane

a. WhentheEUTisinstalledonametallicgroundplane,thegroundplane

shallhaveaDCsurfaceresistancenotlargerthan0,1mpersquare.

b. The DC resistance between metallic ground planes and the shielded

enclosureshallbe2,5morless.

c. The metallic ground planes shall  be electrically bonded to the floor or

wallofthebasicshie

ldedroomstructureatleastonceevery1m.

d. Themetallicbondstrapsshallbesolidandmaintainafive‐to‐oneratioor

lessinlengthtowidth.

e. Metallicgroundplanesusedoutsideashieldedenclosuresh

allextendat

least1,5mbeyondthetestsetupboundaryineachdirection.

5.2.3.3 Composite ground plane

a. WhentheEUTisinstalledonaconductivecompositegroundplane,the

surfaceresistivityoftheactualinstallationshallbeused.

b. Composite ground planes shall be electrically bonded to the enclosure

withmeanssuitabletothematerial.

5.2.4 Power source impedance

a. TheimpedanceofpowersourcesprovidinginputpowertotheEUTshall

be controlled byLine ImpedanceStabilizationNetworks (LISNs

)for all

measurement.

b. LISNs

shallnotbeusedonoutputpowerleads.

c. TheLISNsshallbelocatedatthepowersourceendoftheexposedlength

ofpowerleadsspecifiedin5.2.6.6.

d. TheLISNcircuitshowninFigure5‐2sh

allbeused.

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NOTE1 The LISN can be split in several cases, one per

powerlead.

NOTE2 Theseriesinductancesrepresenttheinductancesof

the wiring; the series resistances represent the

resistances of the wiring and of the central

protections.

NOTE3 The 50resistors result in 100 at high

frequency, simi

lar to the characteristic impedance 

oftheline.

NOTE4 Thefeed‐throughcapacitorsprovideashort‐circuit

athighfrequencyandmaketheLISNsymmetrical

NOTE5 Connecting theregulation wires ofthe laboratory

supply at the LISN input in order to provide

sufficientlylowimpedanceatlowfrequencyisan

ppropriatemethod.Thesourceimpedanceisthen

dominated by the series resistances in the LISN.

Alternatively,alargecapacitor(between1mFand

10mF)willbeused.

─

x H

50 

To EUT

To Power

Source

─

y m

50 

y m

Bonding stud

470nF

to 10µF

470nF

to 10µF

Metal

enclosure

100 kΩ

Optional

1 to 10mF

Regulation wires

─

x H

50 

To EUT

To Power

Source

─

y m

50 

y m

Bonding stud

470nF

to 10µF

470nF

to 10µF

Metal

enclosure

100 kΩ

Optional

1 to 10mF

Regulation wires

Figure5‐2:Lineimpedancestabilizationnetworkschematic

e. Ifnovalueisspecifiedx=2μHandy=0,1shallbeused.

NOTE The x and y values,  respectively the inductance

and the resistance inserted in each lead are

expectedintheEMEVP.

f. Magneticcouplingbetweeninductorsshallbeavoided.

g. If the return line is gr

ounded at the power source in the actual

installation (star distribution), the return line of the LISN shall be

groundedonthepowersourceside.

h. Ifthereturnline(s)oftheactualinstallationislocallygrounded(chassis

return),the return lineofthe LISNneed notbepro

vided,andthetests

shallbeperformedwiththereturn(s)tiedtocase.

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i. The LISN impedance shall be measured at least annually under the

followingconditions:

1. the impedance,measured between the power output lead onthe

EUTsideoftheLISNandthemetalenclosureoftheLISN,

2. anunterminatedpowerinputterminalonthepowersourcesideof

theLISN.

5.2.5 General test precautions

5.2.5.1 Safety

a. Clause4.2.7shallapplyfortestsinvolvinghighelectromagneticpoweror

highvoltagetestequipment.

5.2.5.2 Excess personnel and equipment

a. Onlytheequipmentandthepersonnelusedtoperformthetestshallbe

presentinthetestareaorenclosure.

5.2.5.3 Overload precautions

a. Checksshallbeperformedtoassurethatanoverloadconditiondoesnot

exist.

NOTE Measurementreceiversandtransducersaresubject

to overload, especially receivers without

preselectorsandactivetransducers.

b. Overloadconditionshallbecorrected.

NOTE Thiscanbedonebyinstrumentationchanges.

5.2.6 EUT test configurations

5.2.6.1 General

a. TheEUTshallbeconfiguredasshowninthegeneraltestsetupofFigure

5‐3andmaintainedduringalltesting.

NOTE Forradiatedtests, itmaybedesirable tohave the

LISNoutsideoftheshieldedroom.

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5cm

10cm

1: EUT

2: LISN

3: Power source

4: Access panel

5: Interconnecting cable

6: Power lead

7: Bonding strap

8: Non conductive standof

9: Grounding plane

5cm

10cm

1: EUT

2: LISN

3: Power source

4: Access panel

5: Interconnecting cable

6: Power lead

7: Bonding strap

8: Non conductive standof

9: Grounding plane

Figure5‐3:Generaltestsetup

5.2.6.2 Bonding of EUT

a. Onlythe provisionsincluded inthe designof theEUTshall beusedto

bondunits.

5.2.6.3 Shock and vibration isolators

a. EUTs shall be secured to mounting bases having shock or vibration

isolatorsifsuchmountingbasesareusedintheactualinstallation

b. Thebondingstrapsfurnishedwiththemountingbaseshallbeconnected

tothegroundplane.

c. Whenmountingbasesdonothavebondingstraps,bondingstrapsshall

notbeusedinthetestsetup.

5.2.6.4 Safety grounds

a. When external terminals, connector pins, or equipment grounding

conductors areavailablefor safety ground connectionsand areused in

theactualinstallation,theyshallbeconnectedtothegroundplane.

NOTE Arrangementandlengtharespecifiedin5.2.6.6.

5.2.6.5 Orientation of EUTs

a. EUTs shall be oriented such that surfaces that produce maximum

radiatedemissionsandrespondmostreadilytoradiatedsignalsfacethe

measurementantennas.

b. BenchmountedEUTscomprisinginterconnectingcablesshallbelocated

(10±2)cmfromthefrontedgeofthegroundplane.

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5.2.6.6 Construction and arrangement of EUT cables

5.2.6.6.1 General

a. Electricalcableassembliesshallsimulateactualinstallationandusage.

NOTE1 Proper construction techniques such as use of

twisted pairs, shielding, and shield terminations

aredeterminantfeatures.

NOTE2 Details on the cable construction used for testing

are defined inthe EMEVP DRDof ECSS‐E‐ST‐20,

and maintained in the EME

VR DRD of

ECSS‐E‐ST‐20.

b. Shielded cables or shielded leads (including power leads and wire

grounds)withincablesshallbeusedonlyiftheyhavebeenspecifiedin

installationrequirements.

5.2.6.6.2 Interconnecting leads and cables

a. Individual leadsshall begroupedinto cablesinthe samemanner as in

theactualinstallation.

b. Upto10m,interconnectingcablelengthsinthesetupshallbethesame

asintheactualinstallation.

c. Ifacableislongerthan10mintheactualinstallation,theca

blelengthin

thesetupshallbebetween10mandtheactuallength.

d. The cable arrangement shall be such that it satisfies the following

conditions:

1. Atleastthefirst2m(exceptforcablesthatareshorterintheactual

installation) of each interconnecting cable associated with eac

h

enclosureoftheEUTarerunparalleltothefrontboundaryofthe

setup.

2. Remaining cable lengths are routed to the back of the setup and

placedinazigzaggedarrangement.

e. Whenthesetupincludesmorethanonecable,individualcablesshallbe

separatedby2cmmea

suredfromtheiroutercircumference.

f. Forbenchtopsetupsusinggroundplanes,thecableclosesttothefront

boundaryshallbeplaced10cmfromthefrontedgeofthegroundplane.

g. All cables shall be supported 5cm above the ground plane (except for

interconnectingcablesbetweenenclosuresoftheEUTtha

tarehigherin

theactualinstallation).

5.2.6.6.3 Input power leads

a. Twometres ofinput powerleads (includingneutrals andreturns)shall

berouted parallel tothe frontedge ofthesetup in thesame manner as

theinterconnectingleads.

b. Each input power lead, including neutrals and returns, shall be

connectedtoaLISN.

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c. Powerleadsthatarebundled,aspartofaninterconnectingcableinthe

actual installation, shall be configured in the same fashion for the 2m

exposedlengthandthenshallbeseparatedfromthebundleandrouted

totheLISNs

.

d. Afterthe2mexposedlength,thepowerleadsshallbeterminatedatthe

LISNs

insuchamannerthatthetotallengthofpowerleadfromtheEUT

electricalconnectortotheLISNsshallnotexceed2,5m.

e. Allpowerleadsshallbesupported5cmabovethegroundplane.

f. If the power leads are twisted in the actual installation, they shall be

twisteduptotheLISNs

.

5.2.6.7 Electrical and mechanical interfaces

a. Eitherthe actual equipmentfrom theplatforminstallationorloadsthat

simulate the electrical properties present in the actual installation shall

terminateelectricalinputoroutputinterfaces.

NOTE Example of these electrical properties are

impedance,groundingandbalance.

b. SignalinputsshallbeappliedtotheelectricalinterfacestoexerciseEU

T

circuitry.

c. EUTwithmechanicaloutputsshallbeloadedunderexpectedconditions.

d. When variable electrical or mechanical loading is present in the actual

installation, testing shall be performed under expected worst‐case

conditions.

e. Whenactiveelectricalloadingisused,itshallbeensuredthattheactive

load meet

s the ambient requirements of 5.2.2 when connected to the

setup,andthattheactiveloaddoesnotrespondtosusceptibilitysignals.

NOTE Exampleofactiveelectricalloadingisthetestset.

f. Antenna ports on the EUT shall be terminated with shielded, matched

loadsiftheRFlinkisnotusedduringthetest.

5.2.7 Operation of EUT

5.2.7.1 General

a. Duringemissionmeasurements,theEUTshallbeplacedintheoperating

mode,whichproducesmaximumemissions.

b. During susceptibility testing, the EUT shall be placed in its most

susceptibleoperatingmode.

c. When the EUT has several available modes (including software

controlled operational modes), the number of modes to be te

sted for

emissionandsusceptibilityshallbesuchthatallcircuitryisevaluated.

NOTE It is expected that the customer defines or agrees

operatingmodes.

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5.2.7.2 Operating frequencies for tuneable RF equipment

a. Measurements shall be performedwith the EUT tuned to not less than

threefrequencieswithineachtuningband,tuningunit,orrangeoffixed

channels,consistingofonemid‐bandfrequencyandafrequencywithin

±5%fromeachendofeachbandorrangeofchannels.

5.2.7.3 Operating frequencies for spread spectrum

equipment

a. Operating frequency requirements for two major types of spread

spectrumequipmentshallbeasfollows:

1. frequency hopping: measurements are performed with the EUT

utilizingahopsetwhichcontainsaminimumof30%ofthetotal

possiblefrequencies,andthehopsetisdividedequallyintothree

segments at the low, mi

d, and high end of the EUT operational

frequencyrange,

2. direct sequence: measurements are performed with the EUT

processingdataatthehighestpossibledatatransferrate.

5.2.7.4 Susceptibility monitoring

a. TheEUTshallbemonitoredduringsusceptibilitytestingforindications

ofdegradationormalfunction.

NOTE This monitoring is normally accomplished using

built‐in‐test, visual displays, aural outputs, and

other measurements of signal outputs and

interfaces.

b. IfEUTperformanceismonitoredthroughinstallationofspecialcircuitry

intheEUT,th

emodificationsshallnotinfluencetestresults.

5.2.8 Use of measurement equipment

5.2.8.1 Overview

Anyfrequencyselectivemeasurementreceivercanbeusedforperformingthe

testing described in this standard if the receiver characteristics (that is

sensitivity, selection of bandwidths, detector functions, dynamic range,  and

frequencyofoperation)meettheconstraintsspecifiedinthisstandardandare

sufficienttodemonstratecompliancewiththeapplicablelimits.

5.2.8.2 Detector

a. A peak detector shall be used for all frequency domain emission and

susceptibilitymeasurements.

NOTE This device detects the peak value of the

modulation envelope in the receiver pass  band.

Measurement receivers are calibrated in terms of

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an equivalent root mean square value of a sine

wavethatproducesthesamepeakvalue.

b. When measurement devices other than peak detector are used for

susceptibilitytesting,correctionfactorsshallbedeterminedandapplied

fortestsignalstoadjustthereadingtoequivalentr.m.s.valuesunderthe

peakofthemo

dulationenvelope.

NOTE Example of such measurement devices are

oscilloscopes, non‐selective voltmeters, and field

strengthsensors.

5.2.8.3 Calibration fixture (jig)

a. When current measurements are performed on the central line of a

coaxial transmission line a transmission line with 50 characteristic

impedance,coaxialconnectionsonbothends,andspaceforaninjection

probearoundthecentreconductorshallbeusedforcalibration.

NOTE Figure5‐4re

presentsanarrangementdescribedin

MIL‐STD‐461E.

Figure5‐4:Typicalcalibrationfixture

5.2.9 Emission testing

5.2.9.1 Bandwidths

a. Themeasurementreceiver bandwidthslistedin Table5‐2shallbe used

foremissiontesting.

NOTE These bandwidthsare specifiedat the6dB down

points for the overall selectivity curve of the

receivers.

b. Videofilteringshallnotbeusedtobandwidthlimitthereceiverresponse.

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c. Ifacontrolledvideobandwidthisavailableonthemeasurementreceiver,

itshallbesettoitsgreatestvalue.

d. If receiver bandwidths larger that those in Table 5 ‐2 are used, no

ndwidthcorrectionfactorsshallbeappliedtotestdataduetotheuse

oflargerbandwidths.

NOTE Larger bandwidths canresultin highermeasured

emissionlevels.

Table5‐2:Bandwidthandmeasurementtime

FrequencyRange 6dB

bandwidth

Dwelltime Minimummeasurementtime

(analoguemeasurementreceiver)

30Hz‐1kHz 10Hz 0,15s 0,015s/Hz

1kHz‐10kHz 100Hz 0,015s 0,15s/kHz

10kHz‐150kHz 1kHz 0,015s 0,015s/kHz

150kHz‐30MHz 10kHz 0,015s 1,5s/MHz

30MHz‐1GHz 100kHz 0,015s 0,15s/MHz

Above1GHz 1MHz 0,015s 15s/GHz



5.2.9.2 Emission identification

a. All emissions regardless of characteristics shall be measured with the

measurementreceiverbandwidthsspecifiedinTable5‐2.

5.2.9.3 Frequency scanning

a. Foremissionmeasurements,theentirefrequencyrangeforeachtestshall

bescanned.

b. Minimum measurement time for analogue measurement receivers

duringemissiontestingshallbeasspecifiedinTable5‐2.

c. Synthesized measurement receivers sh

all step in one‐half bandwidth

incrementsorless,andthemeasurementdwelltimeshallbeasspecified

inTable5‐2.

d. Forequipme

ntthatoperates,suchthatpotentialemissionsareproduced

at only infrequent intervals, times for frequency scanning shall be

increasedsuchthananyemissioniscaptured.

5.2.9.4 Emission data presentation

a. Amplitude versus frequency profiles of emission data shall be

automaticallygeneratedanddisplayedatthetimeofthetest.

b. Except for verification of the validity of the output, data shall not be

gatheredmanually.

c. Theinformationshallbedisplayedafterapplicationofcorrectionfactors,

includingtransducers,attenuators,andcablelos

s.

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d. DataoutputoftheEUTtestresultshallbeintheformofamplitudeover

time (for the time domain plots) and amplitude over frequency (for

frequencydomainplots),superimposedwiththeEMItestlimit.

e. Units of measurement for frequency domain emissions measurements

shall bereported inunits ofdB refer

encedto 1μV, 1μA, 1μV/m, 1pT

dependingontheunitdefinedinthetestlimit.

f. For time domain measurements, oscilloscope plots shall include the

amplitudephysicalunit(VorA)conversionfactorsVintoAifnotdone

automatically by the oscilloscope, and the oscilloscope sensit

ivity, time

basesettingsandmeasurementbandwidth.

g. For frequencydomain plots, emissiondatashall be reported ingraphic

formwithfrequencyresolutionof1%,ortwicethemeasurementreceiver

bandwidth,whicheverislessstringent.

h. Intheeventofanyemissionstestresultovertheemissiontestlimitab

ove

100MHz, greater accuracy of its frequency shall be reported with

resolutionbetterthanorequaltotwicethemeasurementbandwidth.

i. Eachplotofemissiondatashallbereportedwithaminimumamplitude

resolutionof1dB.

5.2.10 Susceptibility testing

5.2.10.1 Frequency stepping

a. For susceptibility measurements, the entire frequency range for each

applicabletestshallbescanned.

NOTE Stepped scans refer to signal sources that are

sequentiallytunedtodiscretefrequencies.

b. Stepped scans shall dwell at each tuned frequency for the greatest of

threesecondsortheEUTresponsetime.

NOTE Ten fre

quency steps per decade can be used as a

basis.

c. Stepsizesshallbedecreasedsuchtopermitobservationofaresponse.

NOTE For receivers, it can make use of the frequency

plantoadjustthenumberofpoints.

5.2.10.2 Modulation of susceptibility signals

a. Susceptibilitytestsignalsshallbepulsemodulated(on/offratioof40dB

minimum)ata1kHzratewitha50%dutycycleforsusceptibilitysignals

atafrequencylargerthan100kHz.

b. CW test signals shall be used for susceptibility signals at a frequency

smallerthan100kH

z.

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5.2.10.3 Thresholds of susceptibility

a. WhensusceptibilityindicationsarenotedinEUToperation,athreshold

levelshallbedeterminedasfollowswherethesusceptibleconditionisno

longerpresent:

1. Whenasusceptibilityconditionisdetected,reducetheinterference

signaluntiltheEUTrecovers.

2. Reducetheinterferencesignalbyanadditional6dB.

3. G

radually increase the interference signal until the susceptibility

condition reoccurs; the resulting level is the threshold of

susceptibility.

4. Record this level, frequency range of occurrence, frequency and

levelofgreatestsusceptibility,andtheothertestparameters.

5.2.10.4 Susceptibility data presentation

a. The susceptibility criteria defined in the EMI test procedure shall be

repeatedinthetestreport,orthe“asrun”EMItestprocedureshallbean

annextotheEMItestreport.

b. Data showing the frequencies and amplitudes at which the test was

conductedshallbeprovidedingraphicalorta

bularform.

c. Indicationsofcompliancewiththerequirementsshallbeprovided.

NOTE Such indications can be provision of oscilloscope

plotsofinjectedwaveformswithtestdata.

d. Information shall be displayed after application of correction factors,

includingtransducers,attenuators,andcableloss.

e. Datashallbereportedwithfre

quencyresolutionof1%.

f. Datashallbeprovidedwithaminimumamplituderesolutionof1dBfor

eachplot.

g. Ifsusceptibility is observed, determined levels of susceptibility shallbe

recordedinthetestreport.

5.2.11 Calibration of measuring equipment

5.2.11.1 General

a. Measurementantennas,current probes,fieldsensors, and otherdevices

usedinthemeasurementloopshallbecalibratedatleasteverytwoyears

orwhendamaged.

5.2.11.2 Measurement system test

a. At the start of each emission test, the complete test system (including

measurementreceivers,cables, attenuators,couplers,andsoforth)shall

be verifiedbyinjecting aknown signal (asstated inthe individualtest

procedure),whilemonitoringsystemoutputfortheproperindication.

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b. When the emission test involves an uninterrupted set of repeated

measurements using the same measurement equipment, the

measurementsystemtestmaybeaccomplishedonlyonetime.

NOTE Example of such repeated measurements is the

evaluation of different operating modes of the

EUT.

5.3 System level

5.3.1 General

a. Each item of equipment and subsystem shall have successfully passed

functionalacceptancetestprocedures asinstalledontheplatform, prior

tosystemlevelEMCtest.

5.3.2 Safety margin demonstration for critical or

EED circuits

a. A test performed to demonstrate compliance with the safety margin

requirementshalluseoneormoreofthefollowingtestapproaches:

1. InjectinterferenceatcriticalsystempointsatxdBhigherlevelthan

exists, while monitoring other system points for improper

responses,wherex=EMISM.

2. Measure the susceptibility of crit

ical system circuits for

comparison to existing interference levels, to determine the

margin.

3. Sensitize the system to render it xdB more susceptible to

interference, while monitoring for improper response, where x =

EMISM.

b. Safetymargindemonstrationforsomethingthatissusceptibletoatime

domaincircuit(inc

ludingEEDs)shallusetimedomainmethods.

5.3.3 EMC with the launch system

a. If the spacecraft is not powered during launch, EMC testing with the

launchsystemneednotbeperformed.

b. If the spacecraft is powered during launch, the electric field radiated

emission requirements specified in the Launcher User’s manual,

includingintentionaltransmission,shallbeverified.

c. In case a spacecraft RF transmitter is operating under fairing, the

followingEMISMsshallbeverified:

1. EMISMwithrespecttothesusceptibilitythresholdoftheEEDs.

2. EMISM withrespect to the spacecraft RFreceivers’ susceptibility

threshold(ifoperational)ordamagethreshold(otherwise).

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NOTE This requirement c. applies also to transmitters

which are switched off during launch and ascent

but can,for example, beswitched on temporarily

onthelaunchpad,forafinalhealthcheck.

d. TheEMISMbetweenthelaunchsystemRFemissionsandthespacecraft

RFreceivers’damagethresholdshallbeverified.

5.3.4 Lightning

a. Lightning protection specifiedin ECSS‐E‐ST‐20 (in clause “Inter‐system

EMC and EMC with environment”

), shall be verified by analysis from

equipmentdemonstration.

NOTE1 Testatsystemlevelneednotbeperformed.

NOTE2 deleted

.

5.3.5 Spacecraft and static charging

a. Material use, bonding of discharge elements, thermal blankets, or

metallic items using a bond for static potential equalization shall be

verifiedbyinspectionormeasurementatassemblyintostructure.

b. Ifthebondisonlyusedforchargingcontrol,thebondingresistanceshall

bemeasuredwitha dc‐currentintherang

e10to100μA,underonlyone

polarity,witha2‐wiresohmmeter.

NOTE If the bond is only used for charging control the

clauses5.3.10aand5.3.10bdonota

pply.

5.3.6 Spacecraft DC magnetic field emission

a. SpacecraftDCmagneticfieldemissionrequirementsshallbeverifiedbya

combinationofanalysisandtests.

5.3.7 Intra–system electromagnetic compatibility

a. For intra‐system EMC tests, the support equipment shall  provide the

functionalityofexercisingculpritsandvictims,andinclude thesupport

equipmentinstructions.

b. Wherever 0dB EMISM is a requirement, functional tests at spacecraft

levelmaybeacceptedasaverificationofEMC.

5.3.8 Radiofrequency compatibility

a. Except for passive intermodulation products, radiofrequency

compatibilityshallbeverifiedbyatestatsystemlevel.

b. Absence of passive intermodulation products shall be verified in

accordance with the requirements for “Passive intermodulation”

specifiedinECSS‐E‐ST‐20.

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5.3.9 Grounding

a. The system‐level electrical grounding andisolation shall be verified by

isolationandcontinuitytestsatsystemassembly.

NOTE Thegroundingandisolationdesignisdocumented

by thesystem‐level grounding diagramincluding

EGSE.

5.3.10 Electrical bonding

a. Except for bonding used only for charging control, the bonding

resistancesshallbemeasuredusinga4‐wiresmethod,underapulsedDC

currentof1A.

b. Except for bonding used only for charging control, the probes shall be

reversed and re‐measured to detect possible non linearities across the

bondedjunction.

NOTE Seecl

ause5.3.5b.

5.3.11 Wiring and shielding

a. Wiringcategory andcable shieldsshall beverified byreviewof design

andinspection.

5.4 Equipment and subsystem level test procedures

5.4.1 Overview

Test procedures are specified in clauses 5.4.2 through 5.4.12 for verifying

emission and susceptibility requirements at subsystem or equipment level.

Table 5‐3 give

s the correspondence between procedures and recommended

limitsdefinedinAnnexA.

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Table5‐3:Correspondencebetweentestproceduresandlimits

Informativelimit

AnnexA

Titleoftestprocedure

Verification

Clause5

A.2 CEonpowerleads,differentialmode,30Hzto100kHz(1stpart) 5.4.2

A.2 CEonpowerleads,differentialmode,100kHzto100MHz(2ndpart) 5.4.3

A.3 CEonpowerleads,in‐rushcurrents 5.4.4

A.4 CEonpowerandsignalleads,commonmode,100kHzto100MHz 5.4.3

A.5 CEonantennaports Specific

A.6 DCmagneticfieldemission 5.4.5

A.7 RE,low‐frequencymagneticfield Specific

A.8 RE,low‐frequencyelectricfield Specific

A.9 RE,electricfield,30MHzto18GHz 5.4.6

A.10 CS,powerleads,differentialmode,30Hzto100kHz 5.4.7

A.11 CS,powerandsignalleads,commonmode,50kHzto100MHz 5.4.8

A.12 CS,powerleads,shortspiketransients 5.4.9

A.13 RS,magneticfield,30Hzto100kHz 5.4.10

A.14 RS,electricfield,30MHzto18GHz 5.4.11

A.15 Susceptibilitytoelectrostaticdischarge 5.4.12



5.4.2 CE, power leads, differential mode, 30 Hz to

100 kHz

5.4.2.1 Purpose

Thismethodisusedformeasuringconductedemissionsinthefrequencyrange

30Hzto100kHzonallinputpowerleadsincludingreturns.

5.4.2.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Measurementreceiver,

2. Currentprobe,

3. Signalgeneratorwithamplifier,

4. DC‐currentsupply,

5. Datarecordingdevice,

6. Oscilloscope,

7. Coaxial“T”connectorandcoaxialtobifilartransition,

8. 1 and 10 power metal film resistors with inductance lower

tha

n100nH,

9. LISNdefinedin5.2.4.

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5.4.2.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintain a basic test setup for the EUT as specified in 5.2.6 an

d

Figure5‐3.

2. Formeasure

mentsystemcheck,configurethetestsetupasshown

inFigure5‐5.

3. For equipme

nt testing, configure the test setup as shown Figure

5‐6.

5.4.2.4 Procedure

a. Thetestproceduresshallbeasfollows:

1. Turnonthemeasurementequipmentandwaituntilitisstabilized.

2. IftheEMEVPspecifiestocheckthemeasurementsystem,checkit

by evaluating the overall measurement system from the current

probetothedataoutputdevice,asfollows:

(a) Applyaca

libratedsignallevel,at1kHzand100kHz,which

isatleast6dBbelowtheemissionlimittothecurrentprobe.

NOTE Apoweramplifiercanbenecessaryat1kHz.

(b) ApplythroughthecurrentprobeaDC‐currentequivalentto

theEUTsupplycurrent.

NOTE1 A DC curren

t is applied for verifying that the

currentprobewillnotbesaturatedbytheEUT

DCsupplycurrent.

NOTE2 This DC current is applied through the LISN

for applying the same impedance through the

probeaswiththeEUT.

comparisonwithvolta

geacrossthe1resistorat1kHzand

the 10 resistor at 100kHz; also, verify that the current

waveformissinusoidal.

(d) Scan the measurement receiver for each frequency in the

same manner as a normal data scan. Verify tha

t the data‐

recording device indicates a level within ±3dB of the

injectedlevel.

(e) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,

locatethesourceoftheerrorandcorrectthedeficiencyprior

toproceedingwiththetesting.

3. Test the EUT by determining the conducted emissions from the

EUT input po

wer leads, hot line and return, and measure the

conductedemissionseparatelyoneachpowerlead,asfollows:

(a) TurnontheEUTandwaitforitsstabilization.

(b) Select a lead for testing and clamp the current probe into

position.

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using the bandwidths and minimum measurement times

specifiedinTable5‐2,cl

ause5.2.9.1.

(d) Repeat5.4.2.4a.3(b)an

d5.4.2.4a.3(c)foreachpowerlead.

Signal

generator

with

amplifier

Data

recorder

Measurement

receiver

Current

probe

LISN

To power source

Oscilloscope

Coax “T” and

bifilar

transition

Resistor

Signal

generator

with

amplifier

Data

recorder

Measurement

receiver

Current

probe

LISN

To power source

Oscilloscope

Coax “T” and

bifilar

transition

Resistor

Figure5‐5:Conductedemission,30Hzto100kHz,measurementsystemcheck

EUT

Data recorder

Measurement

receiver

Current

probe

LISN

To power source

EUT

Data recorder

Measurement

receiver

Current

probe

LISN

To power source

Figure5‐6:Conductedemission,30Hzto100kHz,measurementsetup

5.4.3 CE, power and signal leads, 100 kHz to

100 MHz

5.4.3.1 Purpose

This test procedure is used to verify that electromagnetic emissions from the

EUTdonotexceedthespecifiedrequirementsforpowerinputleadsincluding

returns,andforcommonmodeemission.

5.4.3.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Measurementreceiver,

2. Currentprobe,

3. Signalgenerator,

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4. Datarecordingdevice,

5. Oscilloscopewith50input,

6. 50powerdivider(6dB“T”connector),

7. 50coaxialload,

8. Calibrationfixturedefinedin5.2.8.3,

9. LISNs

definedin5.2.4.

5.4.3.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintain a basic test setup for the EUT as specified in 5.2.6 an

d

Figure5‐3.

2. Configure the test setup for the measurement syst

em check as

showninFigure5‐7.

3. Forcomplian

cetestingoftheEUT:

(a) Configure the test setup as shown in Figure 5‐8 fo

r

differentialmode testingand Figure 5‐9for common mode

testing.

(b) Positionthecurrentprobe10cmfromtheLISN.

Signal

generator

Oscilloscope

50 input

6dB

T-connector

Data

recorder

Measurement

receiver

Current probe

inside jig

LISN

To power source

50 coaxial

load

Signal

generator

Oscilloscope

50 input

6dB

T-connector

Data

recorder

Measurement

receiver

Current probe

inside jig

LISN

To power source

50 coaxial

load

Figure5‐7:Conductedemission,measurementsystemcheck

EUT

Data recorder

Measurement

receiver

Current

probe

LISN

To power source

EUT

Data recorder

Measurement

receiver

Current

probe

LISN

To power source

Figure5‐8:Conductedemission,measurementsetupindifferentialmode

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EUT

Data recorder

Measurement

receiver

Current probe

LISN

or EGSE

To power source

EGSE

Power lines

Signal lines

EUT

Data recorder

Measurement

receiver

Current probe

LISN

or EGSE

To power source

EGSE

Power lines

Signal lines

Figure5‐9:Conductedemission,measurementsetupincommonmode

5.4.3.4 Procedures

a. Thetestproceduresshallbeasfollows:

1. Turnonthemeasurementequipmentandwaituntilitisstabilized.

2. IftheEMEVPspecifiestocheckthemeasurementsystem,checkit

by evaluating the overall measurement system from the current

probetothedataoutputdevice,asfollows:

(a) Applyaca

libratedsignallevelthatisatleast6dBbelowthe

applicablelimitat1MHzand10MHzoratalevelallowing

out of the noise reading on the oscilloscope, whatever is

greater,tothecurrentprobeinthejig.

(b) Applythroughthecurrentprobeusingasecond wi

re,aDC

currentequivalenttotheEUTnominalsupplycurrent.

NOTE1 A DC current is applied for verifying that the

currentprobewillnotbesaturatedbytheEUT

DCsupplycurrent.

NOTE2 This DC current is applied through the LISN

for applying the same impedance through the

probeaswiththeEUT.

fytheACcurrentlevel,asmeasuredwiththeprobeby

comparisonwiththevoltageontheTderivation.

(d) Scan the measurement receiver for each frequency in the

samemannerasanormaldatascan,andverifythatthedata‐

recording device ind

icates a level within ±3dB of the

injectedlevel.

(e) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,

locatethesourceoftheerrorandcorrectthedeficiencyprior

toproceedingwiththetesting.

3. Test the EUT by determining the conducted emission from the

inputpowerlea

ds,hotlinesandreturnsseparately,andfromeach

interconnecting bundle(common mode), includingthe ones with

powerleads,asfollows:

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(a) TurnontheEUTandwaituntilitisstabilized.

(b) Selecta leador abundle fortesting and clamp thecurrent

probeintoposition.

using the bandwidths and minimum measurement times

specifiedinTable5‐2,cl

ause5.2.9.1.

(d) Repeat5.4.3.4a.3(b)and5.4.3.4a.3(c)foreach power lea

dor

foreachbundle.

5.4.4 CE, power leads, inrush current

5.4.4.1 Purpose

ThistestprocedureisusedtoverifythattheinrushcurrentoftheEUTdoesnot

exceedthespecifiedrequirementsforpowerinputleads.

5.4.4.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Two‐channelsoscilloscope,

2. Currentprobe,

3. Spikegenerator,

4. Datarecordingdevice,

5. Coaxial“T”connector,

6. Coaxialtobifilartransition,

7. 1 power metal film resistor with inductance lower 30nH and

peakpowercapability,

8. LISNdefinedin5.2.4,

9. Swit

ching device, fast bounce‐free power switch, or an actual

power‐controllerexcept ifthe ON/OFFcommandis implemented

intheEUT.

5.4.4.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintain a basic test setup for the EUT as specified in 5.2.6 an

d

Figure5‐3.

2. Configure the test setup for the measurement syst

em check as

showninFigure5‐10

.

3. Configure the test setup for compliance testing of the EUT as

showninFigure5‐11

.

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Spike

generator

Data

recorder

Current

probe

LISN

To power source

Oscilloscope

Coax “T”

and bifilar

transition

Resistor

Spike

generator

Data

recorder

Current

probe

LISN

To power source

Oscilloscope

Coax “T”

and bifilar

transition

Resistor

Figure5‐10:Inrushcurrent:measurementsystemchecksetup

EUT

Data recorder

Current probe

LISN

To power source

Oscilloscope

Power

controller

ON/OFF command

Fast bounce-free

power switch

EUT

Data recorder

Current probe

LISN

To power source

Oscilloscope

Power

controller

ON/OFF command

Fast bounce-free

power switch

Figure5‐11:Inrushcurrent:measurementsetup

5.4.4.4 Procedures

a. Thetestproceduresshallbeasfollows:

1. Turn on the measurementequipment and allow asufficient time

forstabilization.

2. If specified by the EMEVP, check the measurement system by

evaluatingtheoverallmeasurementsystemfromthecurrentprobe

tothedataoutputdevice:

(a) Apply a calibrated spike tha

t is at least 6dB below the

applicablelimittothecurrentprobe.

(b) ApplythroughthecurrentprobeaDCcurrentequivalentto

theEUTsupplycurrent.

NOTE1 A DC current is applied for verifying that the

currentprobewillnotbesaturatedbytheEUT

DCsupplycurrent.

NOTE2 This DC c

urrent is applied through the LISN

for applying the same impedance through the

probeaswiththeEUT.

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comparisonwiththevoltageacrosstheresistor.

(d) Perform the measurement with the current probe on an

oscilloscope in the same manner as for EUT testing and

verifythatthedata‐recordingdeviceindicatesalevelwithin

±3dBoftheinjectedleve

l.

(e) Ifreadingsareobtainedwhichdeviatebymorethan±3dB,

locatethesourceoftheerrorandcorrectthedeficiencyprior

toproceedingwiththetesting.

3. Test the EUT by determining the conducted emission from the

EUTinputpowerleads,asfollows:

(a) Select the positive le

ad for testing and clamp the current

probeintoposition.

(b) Performmeasurementby applicationof poweron theEUT

using a mercury relay (Figure 5‐11

.a), the internal EUT

switch (Figure 5‐11

.b), or the power controller (Figure

5‐11.c).

NOTE Themethodforapplicationofpowerisdefined

intheEMEVR

5.4.4.5 Data presentation

a. In addition to 5.2.9.4, data presentation shall be a graphic output of

current versus time displaying the transient characteristics with

followingconditions:

1. amplituderesolutionwithin3%oftheapplicablelimit,

2. timebase resolutionwithin 10%ofrise timefor measurement of

riseandfallslopes.

NOTE Risetimeisthedurat

ionbetween10%and90%of

peak‐to‐peakamplitude

b. Twoseparatedisplaysshallbeprovidedshowingrespectivelytheinitial

risetimeandthefullinrushresponse.

NOTE Typical

timebasesare10μsfullscalefortheinitial

rise time and 1ms full scale for the full inrush

response.

5.4.5 DC Magnetic field emission, magnetic

moment

5.4.5.1 Overview

The described test method allows obtaininga rough estimateof themagnetic

momentofthe EUT (centreddipoleapproximation).Itinvolvesthe constraint

ofmeasuringthemagneticfieldatdistancestypicallymorethanthreetimesthe

sizeoftheEUT.

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If a better model is needed, making it possible to predict the field at closer

distancesormorepreciselythanthecentreddipoleapproximationallows,then

eithermultipledipolemodellingtechniquesorsphericalharmonicstechniques

canbeused.

NOTE ItistheroleoftheEMCAB to assessthe need for

usin

g such techniques, based on mission

requirements.

5.4.5.2 Set-Up

a. The EUT should be set in an earth field compensated area providing

zero‐fieldconditionsfortheintrinsicmomentdetermination.

NOTE1 This is necessary in case the EUT contains a

significant amount of soft magnetic material, as

without earth field compensation an induced

magneticmomentwouldappear.

NOTE2 Earth field co

mpensation is usually ensured by

2or3setsofHelmholtzcoils.

b. A right‐handed orthogonalcoordinate systemXYZ shall beassignedto

theEUTgeometriccentre.

c. The magnetic sensor (single‐axis magnetometer) shall be installed

successivelyonthe6semi‐axesattwodifferentreferencedistancesr

1and

2 from the geometric centre of the EUT and shall measure the field

projectionalongtheselines.

NOTE The reference distances are typically more than

threetimesthesizeoftheEUT

d. Alternatively the EUT may be installed on a  turntable and rotated in

front of a fixed magnetometer, presenting ea

ch XYZ axis (positive and

negative)successivelyalignedwiththesensoraxis.

e. Themagnetic fieldshall bepositive whenorientated fromthecentre of

theEUTtowardsthemagnetometer.

5.4.5.3 Test sequence

a. Thetestsequenceshallbeasfollows:

1. EUT not operating, initial measurements on the six semi‐axes at

thereferencedistances.

2. Deperm:

(a) EUT not operating, application of a deperming field in

accordance with Figure 5‐12 fre

quency 3Hz, maximum

amplitude between 4000μT and 5000μT, successively on

eachXYZaxisoftheEUT.

NOTE1 ThisisusuallydoneusingHelmholtzcoils.

NOTE2 A sequence of symmetrical sine periods of

increasing and decreasing amplitude gives

better results than a sine wave modula

ted by

exponentialsorrampfunctions.

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(b) Measurement after deperm on the six semi‐axes at the

referencedistances.

3. Perm:

(a) EUTnotoperating,applicationofapermfieldof300μTon

eachXYZaxis.

(b) Measurement after perm on the six semi‐axes at the

referencedistances.

4. Stray field: EUT operating, measurement on the six semi‐axes at

thereferen

cedistances.

5. Finaldeperm:repeat5.4.5.3a.2.

5.4.5.4 Data presentation

a. For DC magnetic field emission, data shall be presented as follows,

supersedingclauses5.2.9.4athrough5.2.9.4i:

1. For ea

ch measurement distance, for each of the 6 semi‐axes, the

following induction measurements inμT are plotted in tabular

form:

B(+X),B(‐X),B(+Y),B(‐Y),B(+Z),B(‐Z)

2. Foreachmeasurementdistance,meaninductions,foreachaxis,are

computed in units ofμT and plotted in tabular form, using

followingequations:

 







,

 







,

 









3. For each measurement distance r, 3‐axes magnetic moment

components in units of Am² are calculated using the following

equationsandreported:

Mx=5r3BX MinunitsofAm²,rinmeters,BinμT

My=5r3BY

Mz=5r3BZ

4. Usingva

luesofMx,MyandMzatbothdistancesr1andr2,values

1 and M2 of the magnetic moment are calculated using the

followingequationsandreported:

= M

)

+ M

)

+ M

)

= M

)

+ M

)

+ M

)

NOTE If the EUT is a centred dipolar source, then

1=M2.

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deperm field

time

B (µT)

Increase : t > 200 s Decrease : t > 400 s

5000

- 5000

< 0.03 µT

at switch off

Increase : 2 %

Decrease : 1 %

Figure5‐12:Smoothdepermprocedure

5.4.6 RE, electric field, 30 MHz to 18 GHz

5.4.6.1 Purpose

ThistestprocedureisusedtoverifythatelectricfieldemissionsfromtheEUT

anditsassociatedcablingdonotexceedspecifiedrequirements.

5.4.6.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Measurementreceiver,

2. Datarecordingdevice,

3. Linearlypolarizedantennas,

NOTE Thefollowingantennasarecommonlyused:

 30MHzto200MHz,biconical,137cmtiptotip,

 200MHzto1GHz,doubleridgehorn,69,0cmby

94,5cmopening,orlog‐periodic,

 1GHzto18GHz

,doubleridgehorn,24,2cmby

13,6cmopening.

4. Signalgenerators,

5. Stubradiator,

6. LISNdefinedin5.2.4,optional.

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5.4.6.3 Test setup

a. AbasictestsetupfortheEUTasshownanddescribedinFigure5‐3and

5.2.6sh

allbemaintainedtoensurethattheEUTisorientedsuchthatthe

surface that produces the maximum radiated emissions is toward the

frontedgeofthetestsetupboundary.

NOTE TheLISNshouldbeused.

b. The measurement system shall be checked by configuring the test

equipmentasshowninFigure5‐13

.

c. TotesttheEUTantennapositioning,thetestsetupboundaryoftheEUT

and associated cabling for use in positioning of antennas shall be

determined.

d. TotesttheEUTantennapositioning,thephysicalreferencepointsonthe

antennasshowninFigure5‐14formea

suringheightsoftheantennasand

distancesoftheantennasfromthetestsetupboundaryshallbeusedas

follows:

1. Position antennas 1m from the front edge of the test setup

boundaryforallsetups.

2. Positionantennasabovethefloorgroundplane.

3. Ensure tha

t no part of any antenna is closer than 1m from the

wallsand0,5mfromtheceilingoftheshieldedenclosure.

e. Theantennapositionsshallbedeterminedasfollows:

1. Fortestingbelow200MHz:

(a) Forsetupswiththesideedgesoftheboundary3morle

ss,

one position, with the antenna centred with respect to the

sideedgesoftheboundary.

(b) Forsetupswiththesideedgesoftheboundarygreaterthan

3m,NantennapositionsatspacingasshowninFigure5‐15,

whereNis theedge‐to‐ed

geboundarydistance (inmetres)

dividedby3androundinguptoaninteger.

2. Fortestingfrom200MHzupto1GHz,placetheantennainsucha

number of positions that the entire width of eachEUT enclosure

and the fi

rst 35cm of cables and leads interfacing with the EUT

enclosurearewithinthe3dBbeamwidthoftheantenna.

3. For testing at 1GHz and above, place the antenna in such a

number of positions that the entire width of eachEUT enclosure

and the first 7cm of ca

bles and leads interfacing with the EUT

enclosurearewithinthe3dB‐beamwidthoftheantenna.

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Testsetupboundary

Shielded

enclosure

Antenna

Signal

generator

Measurement

receiver

Datarecording

device

Connectedfor

measurement

Connectedfor

systemcheck

Figure5‐13:Electricfieldradiatedemission.Basictestsetup

Floor

Groundplane

Testsetup

boundary

Antenna

0,9m

1 m

2 m

Figure5‐14:Electricfieldradiatedemission.Antennapositioning

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Testsetupboundary

Lengthx(m);Npositions=x/3(roundedupnearest

integer)

Shieldedenclosure

Antenna

Antenna

x/N(m)

x/2N (m) x/2N (m)

1m

Figure5‐15:Electricfieldradiatedemission.Multipleantennapositions

5.4.6.4 Test procedures

a. The measurement equipment shall be turned on and waited until it is

stabilized.

b. It shall be verify that the ambient requirements specified in 5.2.2.3 ar

e

metandplotsoftheambienttaken.

c. Themeasurementsystemshallbecheckedasfollows:

1. UsingthesystemcheckpathofFigure5‐13

,performthefollowing

evaluationoftheoverall measurementsystemfromeach antenna

tothedataoutputdeviceatthehighestmeasurementfrequencyof

theantenna:

(a) Applyacalibratedsignallevelthatisatleast6dBbelowthe

limit(limitminusantennafactor)tothecoaxialcableatthe

antennaconn

ectionpoint.

(b) Scan the measurement receiver in the same manner as a

normaldatascan,andverifythatthedata‐recordingdevice

indicatesalevelwithin±3dBoftheinjectedsignallevel.

locatetheso

urceoftheerrorandcorrectthedeficiencyprior

toproceedingwiththetesting.

2. UsingthemeasurementpathofFigure5‐13

,performthefollowing

evaluationforeachantennatodemonstratethatthereiselectrical

continuitythroughtheantenna:

(a) Radiate a signal using an antenna or stub radiator at the

highestmeasurementfrequencyofeachantenna.

(b) Tune the measurement receiver to the frequency of the

applied signal and verify tha

t a received signal of

appropriateamplitudeispresent.

NOTE This evaluation is intended to provide a coarse

indicationthattheantennaisfunctioningproperly.

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Thereisnorequirementtomeasureaccuratelythe

signallevel.

d. The EUTshall betested byusing themeasurement pathof Figure 5 ‐13

and by det

ermining the radiated emissions from the EUT and its

associatedcablingasfollows:

1. TurnontheEUTandwaituntilitisstabilized.

2. Scan the measurement receiver for each applicable frequency

range,usingthebandwidthsandminimummeasurementtimesin

5.2.9.1

3. Orienttheantennasforbothhorizontallyandvert

icallypolarized

fields.

4. Repeat steps 5.4.6.4d.2 and 5.4.6.4d.3 for each an

tenna position

determinedunder5.4.6.3c,5.4.6.3d,and5.4.6.3e.

5.4.6.5 Data Presentation

a. In addition to 5.2.9.4, data presentation shall provide a statement

verifying the electrical continuity of the measurement antennas as

determinedin5.4.6.4c.1(c).

5.4.7 CS, power leads, 30 Hz to 100 kHz

5.4.7.1 Purpose

ThistestprocedureisusedtoverifytheabilityoftheEUTtowithstandsignals

coupledoninputpowerleads.

5.4.7.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Signalgenerator,

2. Poweramplifier,

3. 1,5 to 2,7 power metal film resistor with inductance lower

1000nHandpeakpowercapability,

4. Oscilloscopes,

5. Currentprobe,

6. Differentialhighvoltage‐probe,

7. injectiontransformer,

8. LISNdefinedin5.2.4optio

nal.

5.4.7.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintain a basic test setup for the EUT as specified in 5.2.6 an

d

Figure5‐3.

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2. Checkmeasurement systemby configuringthe testequipment in

accordance with Figure 5‐16

, and setting up the oscilloscope to

monitorthevoltageacrosstheresistor.

3. TesttheEUTbyconfiguringthetestequipmentasshowninFigure

5‐17

.

Oscilloscope

differentialprobe

Signal

generator

Power

amplifier

Current

probe

In jection 

tran sform e r

Data

record er

Oscilloscope

Resistor

1,5to 2,7

Figure5‐16:CS,powerleads,measurementsystemcheckset‐up

EUT

Stimu latio nand

monitoringof

EUT

LISN

Current

probe

Power

in p uts 

In jection 

tran sfo rm er

Data

rec ord er

Oscilloscope

O s cillosc op e 

differentialprobe

Signal

generator

Power

amp lifier

1,5to2,7



Figure5‐17:CS,powerleads,signalinjection

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5.4.7.4 Procedures

a. The measurement equipment shall be turned on and waited until it is

stabilized.

b. The measurement system shall be checked using the measurement

systemchecksetupforwaveformverificationasfollows:

1. Setthesignalgeneratortothelowesttestfrequency.

2. Increase the applied signal until the oscilloscope indicates the

volta

gelevelspecifiedbyapplicationofclause4.2.8,ve

rifythatthe

outputwaveformissinusoidal,andverifythattheindicationgiven

by thecurrentprobe iswithin 3dBof theexpected levelderived

fromthe1resistorvoltage.

3. Repeat5.4.7.4b.2bysetti

ngthesignalgeneratortothehighesttest

frequency.

c. TheEUTshallbetestedasfollows:

1. TurnontheEUTandwaituntilitisstabilized.

2. Setthesignalgeneratortothelowesttestfrequency,andincrease

thesignal leveluntil thetesting voltageor currentli

mit specified

byapplicationofclause4.2.8,isre

achedonthepowerlead.

3. Repeat 5.4.7.4c.2 at al

l frequency steps through the testing

frequencyrange.

4. Evaluatethesusceptibilityasfollows.

(a) MonitortheEUTfordegradationofperformance.

(b) If susceptibility is noted, determine the threshold level in

accordancewith5.2.10.3.

5. Repe

at5.4.7.4c.2to5.4.7.4c.4forea

chpowerlead.

5.4.8 CS, bulk cable injection, 50 kHz to 100 MHz

5.4.8.1 Purpose

This test procedure is used to verify the ability of the EUT to withstand

sinusoidalwavescoupledontheEUTassociatedcablesandpowerleads.

5.4.8.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Signalgeneratorwithamplitudeorpulsemodulationcapability,

2. pulsegenerator,1kHz–100kHz,adjustabledutycycle,

3. poweramplifier,50kHz–100MHz,

4. currentinjectionprobe,50kHz–100MHz,

5. currentmeasurementprobe,50kHz–100MH

z,

6. oneortwocalibrationfixture(s)(jigs)definedin5.2.8.3,

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7. onetwo‐channelsoscilloscope,50inputimpedance,

8. waveformrecordingdevice,

9. 50coaxialload,

10. LISNdefinedin5.2.4,

. spectrumanalyzer(optional).

5.4.8.3 Setup

a. Thetestsetupshallbeasfollows:

1. MaintainabasictestsetupfortheEUTasshownanddescribedin

5.2.6andFigure5‐3.

2. Forca

libration:

(a) Configure the test equipment in accordance with Figure

5‐18

.

(b) Placetheinjectionprobeandthemonitorprobearoundthe

centralconductoroftheirrespectivejigs.

NOTE The monitor probe and associated jig are

optional.

connecttheotherendtoa50‐inputoscilloscope.

(d) Ifacur

rentmonitorprobeisused,connectittoanother50

oscilloscopeinput.

3. FortestingtheEUT:

(a) ConfigurethetestequipmentasshownFigure5‐20

.

(b) Place the injection and monitor probes around a cable

bundleinterfacinganEUTconnector.

 5cmfromtheconnectoriftheoveralllengthofthe

connectorandbackshelldoesnotexceed5cm,

 attheoveralllengthoftheconnectoran

dbackshell,

otherwise.

(d) Positiontheinjectionprobe5cmfromthemonitorprobe.

5.4.8.4 Test procedures

a. The measurement equipment shall be turned on and waited until it is

stabilized.

b. Themeasurementsystemshallbecalibratedbyperformingthefollowing

proceduresusingthecalibrationsetup:

1. Setthefrequency ofthegenerator to50kHz andapply thepulse

modulation,Figure5‐19

.

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2. Increase the applied signal until the oscilloscope indicates the

voltagespecifiedbyapplicationofclause4.2.8.

3. Veri

fy that both inputs of the oscilloscope, voltagemonitored on

50 and current monitored by the current probe, are consistent

within 3dB. This is applicable only if a current probe is used

duringcalibration

4. Recordthegeneratorsettings.

5. Repeat 5.4.8.4b.2 through 5.4.8.4b.4 for each measurement

freq

uency.

c. The EUT shall be tested by performing the following procedures and

usingtheEUTtestsetup:

1. TurnontheEUTandwaituntilitisstabilized.

2. Select a bundle for testing and clamp the current probes into

position.

(a) Setthemodulatedsinegene

ratortoatestfrequency,atlow

outputlevel.

(b) Adjustthemodulationindutycycleandfrequency.

calibration,withoutexceedingthecurrentlimitspecifiedby

application of clause 4.2.8 and recor

d the peak current

obtained.

(d) MonitortheEUTfordegradationofperformance.

(e) If susceptibility is noted, determine the threshold level as

measuredbythecurrentmonitorprobeinaccordancewith

5.2.10.3.

) Repeat 5.4.8.4c.2(a) through 5.4.8.4c.2(e) for ea

ch test

frequency.

3. Repeat 5.4.8.4c.2. a

pplying the test signals to each bundle

interfacingwitheachconnectororallbundlestakentogether.

d. The calibration need not be re‐performed before testing each EUT

bundle.

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Signal

generator

50

Power

amplifier

50coaxial load

Oscilloscope 50 input

or spectrum analyser

Injection probeMonitor probe

External

modulation

source

Ext mod

Jig

Signal

generator

50

Power

amplifier

50coaxial load

Oscilloscope 50 input

or spectrum analyser

Injection probeMonitor probe

External

modulation

source

Ext mod

Jig



Figure5‐18:Bulkcableinjection,measurementsystemcheckset‐up

Time

Volt

Burst length

Period

Time

Volt

Burst length

Period

Figure5‐19:Signaltestwaveform

EUT

LISN

(o rEUT,or

EGSE)

Monitor

probe

Data

reco rde r

Inje ction probe

Osc illo s co pe/ 

Spectrumanalyser

Signal

generator

50 

Power

a mp lif ier

External

modulation

sou rce

Extmod

IN

Figure5‐20:CSofpowerandsignalleads,bulkcableinjection

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5.4.9 CS, power leads, transients

5.4.9.1 Purpose

Thistestprocedureisusedtoverifythe abilityof theEUTtowithstandshort

spikescoupledonEUTpowerleads,includinggroundsandreturnsthatarenot

groundedinternallytotheequipmentorsubsystem.

5.4.9.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Spikegeneratorwithfollowingcharacteristics:

(a) Pulsewidthof10μsand0,15μs,

(b) Pulserepetitionratecapabilityupto10pulsespersecond,

(d) Outputcontrol,

(e) Adequatetransformer currentcapacity commensuratewith

linebeingtested,

) Outputimpedance5orlessfor0,15μsand1orlessfor

10μstransient,

(g) Externalsynchronizationandtriggeringcapability.

2. Oscilloscopewith50

MHzbandwidthorgreater.

3. Differentialhigh‐voltageprobe.

4. Isolationtransformer.

5. 5 resistor power metal film resistor with inductance lower

100nHandpeakpowercapability.

6. LISNdefinedin5.2.4,wit

hadded inductor for atotal inductance

notlessthan20μHforparallelinjection.

5.4.9.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintain a basic test setup for the EUT as specified in 5.2.6 an

d

Figure5‐3.

2. Forca

libration:

(a) ConfigurethetestequipmentinaccordancewithFigure5‐21

forverifica

tionofthewaveform.

(b) Set up the oscilloscope to monitor the voltage across the

5resistor.

Figure5‐22 (serie

stestmethod)orFigure5‐23(paralleltest

method).

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NOTE1 Withseriesinjection,theinternalLISNcapacitorat

theinputpowersideisprotectingthesource.

NOTE2 With parallel injection, the internal inductance is

protecting the source, so a minimum value is

neededasspecifiedin5.4.9.2a.6.

5 re s istor 

Data

recor der

Oscilloscope

Differentialprobe

Spikegenera tor

Seriesorparallel

output

Figure5‐21:CSofpowerleads,transients,calibrationset‐up

EUT

Oscillosco pe

Differentialprobe

Stimulationand

monitoringof

EUT

LISN

Spikegenerator

Seriesoutput

Power

inputs

Data

recorder

Figure5‐22:CSofpowerleads,spikeseriesinjectiontestsetup

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EUT

Osc illo s c o p e 

Differentialprobe

S timulation and

monitoringofEUT

LISN

Spikegenerator

P a ra lleloutput

Power

in p u ts

Datarecorder

Ind u cto rs

Figure5‐23:CSofpowerleads,spikeparallelinjectiontestsetup

5.4.9.4 Procedures

a. Thetestproceduresshallbeasfollows:

1. Turnonthemeasurementequipmentandwaituntilitisstabilized.

2. Performthefollowingprocedureusingthecalibrationsetup:

(a) Adjust the pulse generator for the pulse width, and pulse

repetitionrate.

(b) Adjust theamplitude ofthe signal to the leve

l specifiedin

associatedlimit.

not,correctaccordingly.

(d) Recordthepulsegeneratoramplitudesetting.

3. TesttheEUTbyperformingthefollowingprocedureusingthetest

setup:

(a) TurnontheEUTandwaituntilitisstabilized.

(b) Adjustthesp

ikegeneratortoapulseduration.

generator output level to provide the specified voltage

without exceeding the pulsed amplitude setting recorded

duringcalibration.

(d) Applyrepetitive(6to10pulsespersecond)positivespikes

totheEUTun

groundedinputlinesforaperiodnotlessthan

2 minutes induration, andif the equipment employ gated

circuitry,triggerthespiketooccurwithinthetimeframeof

thegate.

(e) Repeat5.4.9.4a.3(d)wi

thnegativespikes.

(f) MonitortheEUTfordegradationofperformance.

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(g) If susceptibility is noted, determine the threshold level in

accordance with 5.2.10.3 and verify tha

t it is above the

specifiedrequirements.

(h) Recordthepeakcurrentasindicatedontheoscilloscope.

(i) Repeat 5.4.9.4a.3(b) through 5.4.9.4a.3(h) on each power

lea

d.

5.4.10 RS, magnetic field, 30 Hz to 100 kHz

5.4.10.1 Purpose

ThistestprocedureisusedtoverifytheabilityoftheEUTtowithstandradiated

magneticfields.

5.4.10.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Signalsource,

2. Poweramplifier,

3. Radiatingloophavingthefollowingspecifications:

(a) Diameter: 12cm

(b) Numberofturns: 20

(d) Magneticfluxdensity: 9,510

pT/A of applied current at a

distanceof5cmfromtheplaneoftheloop.

4. Loopsensorhavingthefollowingspecifications:

(a) Diameter: 4cm

(b) Numberofturns: 51

(d) Shielding: electrostatic

(e) CorrectionFactor: manufacturer’s data for fact

ors to

convert measurement receiver readings to decibels above

onepicotesla(dBpT)

5. Measurementreceiver,

6. Calibration fixture: coaxial transmission line with 50

characteristic impedance, coaxial connections on both ends, and

spaceforacurrentprobearoundthecentre,

7. Currentprobe,

8. LISN.

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5.4.10.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintaina basictestsetup forthe EUTas specifiedin Figure5‐3

and5.2.6.

2. Check the measurement sy

stem by configuring the measurement

equipment, the radiating loop, and the loop sensor as shown in

Figure5‐24

.

3. TesttheEUTbyconfiguringthetestsetupasshowninFigure5‐25

.

Measurement

receiverA

Signal source

and power

amplifier

Measurement

receiverB

5cm 

Radiatingloop

Fieldmonitoringloop

Currentprobe

insidejig

Figure5‐24:Measurementsystemcheckconfigurationoftheradiatingsystem

Signalsourceand

poweramplifier

5cm

Radiating

loop

EUT

Figure5‐25:Basictestset‐up

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5.4.10.4 Test procedures

a. The measurement equipment shall be turned on and waited until it is

stabilized.

b. Thefollowingprocedureshallbe performed usingthecalibrationsetup

forverificationoflevels.

1. Setthesignalsourcetoafrequencyof1kHzandadjusttheoutput

toprovideamagneticfluxdensityof11

0dBpTasdeterminedby

the reading obtained on measurement receiver A and the

relationshipgivenin5.4.10.2a.3(d).

2. Measure the volta

ge output from the loop sensor using

measurementreceiverB.

3. Verifythat theoutputonmeasurementreceiverBiswithin±3dB

oftheexpectedvaluebasedontheantennafactorandrecordthis

value.

c. The EUT shall be tested by performing the following procedures for

det

erminationoflocationandlevelofsusceptibility.

1. TurnontheEUTandwaituntilitisstabilized.

2. Selecttestfrequenciesasfollows:

(a) Locatetheloopsensor 5cmfromtheEUTfaceorelectrical

interfaceconnectorbeingprobedandorienttheplaneofthe

loopsensorparalleltotheEUTface

sandparalleltotheaxis

ofconnectors.

(b) Supply the loop with such a current to produce magnetic

fieldstrengthsatleast10dBgreaterthanthelimitspecified

by application of clause 4.2.8 but not to exceed 15A

(

183dBpT).

(d) If susceptibility is noted, select no less than three test

frequencies per octave at those frequencies where the

maximumindicationsofsusceptibilityarepresent.

(e) Repositiontheloopsuccessivelytoalocationineach30by

30cm are

a on each face of the EUT and at each electrical

interface connector, and repeat 5.4.10.4c.2(c) and

5.4.10.4c.2(d)to determine locat

ions and frequencies of

susceptibility.

(f) From the total frequency data where susceptibility was

noted in 5.4.10.4c.2(c) through 5.4.10.4c.2(e), selec

t three

frequenciesperoctaveoverthefrequencyrange.

3. At each frequency determined in 5.4.10.4c.2(f) a

pply a current to

theradiatingloopthatcorrespondstothespecifiedlimit,movethe

loop to search for possible locations of susceptibility without

omitting the locations determined in 5.4.10.4c.2(e) wh

ile

maintainingtheloop5cmfromtheEUTsurfaceorconnector,and

verifythatsusceptibilityisnotpresent.

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5.4.10.5 Data Presentation

a. Inadditionto5.2.10.4,datapresentationshallprovide:

1. Tabulardatashowingverificationoftheradiatingloopin.5.4.10.4b.

2. Tabularda

ta,diagrams,orphotographsshowingthelocationsand

testfrequenciesdeterminedin.5.4.10.4c.2(e)and5.4.10.4c.2(f).

5.4.11 RS, electric field, 30 MHz to 18 GHz

5.4.11.1 Purpose

This test procedure is used to verify the ability of the EUT and associated

cablingtowithstandelectricfields.

NOTE Additional requirements can apply beyond

18GHzifSHForEHFpayloadsarepresent.These

arebeyondthescopeofthepresentstandard.

5.4.11.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. Signalgenerators,

2. Poweramplifiers,

3. Receiveantennas,

(a) under1GHz,notapplicable.

(b) 1GHz to 18GHz, double ridge horn, 24.2 by 13.6cm

opening.

NOTE Above 1GHz receive antennas may be not used,

see5.4.11.3b.2.

4. Line

arlypolarizedtransmitantennas

NOTE Thefollowingantennasarecommonlyused:

 30MHzto200MHz,biconical,137cmtiptotip,

 200MHzto1GHz,doubleridgehorn,69,0cmby

94,5cmopening,orlog‐periodic,

 1GHzto18GHz,doubleridgehorn,24

,2cmby

13,6cmopening.

5. Electricfieldsensors(physicallysmall‐electricallyshort),

6. Measurementreceiver,

7. Powermeter,

8. Directionalcoupler,

9. Attenuator,

10. Datarecordingdevice,

11. LISNdefinedin5.2.4,optional.

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5.4.11.3 Test setup

a. A basic test setup shall be maintained for the EUT as shown and

specifiedin5.2.6.andFigure5‐3.

NOTE TheLISNcanbeused.

b. Forme

asurementsystemcheck,followingsensorsshallbeused:

1. electricfieldsensorsfrom30MHzto1GHz.

2. eitherreceiveantennasorelectricfieldsensorsabove1GHz.

NOTE For the electric sensors and receiving antennas to

beuse

d,see5.4.11.2a.3and5.4.11.2a.5.

c. TestequipmentshallbeconfiguredasspecifiedinFigure5‐26

.

d. Themeasurementsystemshallbecheckedasfollows:

1. Placetheelectricfieldsensors1mfrom,anddirectlyopposite,the

transmit antennaas shownFigure 5‐27and aminimum of30cm

ovethegroundplane,notdirectlyatcornersoredgesofEUT.

2. PlacethereceiveantennaspriortoplacementoftheEUT,asshown

Figure5‐28

,onadielectricstandatthepositionandheightabove

thegroundplanewherethecentreoftheEUTwillbelocated.

e. FortestingEUT,thetransmitantennasshallbeplaced1mfromthetest

setupboundaryasfollows:

1. 30MHzto200MHz

(a) Fortestsetupbounda

ries3m(includingallenclosuresof

theEUTandthe2mofexposedinterconnectingandpower

leads specified in 5.2.6.6.), centre the antenna between the

edges of the test setup bounda

ry, ensuring that the

interconnecting leads represent the actual platform

installationandareshorterthan2m.

(b) For test setup boundaries >3m, use multiple antenna

positions(N)atspacingsas specifiedin Figure5‐27,where

the number of antenna positions (N) is deter

mined by

dividingtheedge‐to‐edgeboundarydistance(inmetres)by

3androundinguptoaninteger.

2. 200MHzandabove,usemultipleantennapositions(N)asshown

Figure 5‐27,

 where the number of antenna positions (N) is

determinedasfollows:

(a) Fortestingfrom200MHzupto1GHz,placetheantennain

anumberofpositionssuchthattheentirewidthofeachEUT

enclosureandthefirst35cmofcablesandleadsinterfacing

with the EUT enclosure are within the 3dB beamwidth of

theantenna

(b) For testi

ng at 1GHz and above, place the antenna in a

numberofpositionssuchthattheentirewidthofeachEUT

enclosureand thefirst 7cmof cablesand leadsinterfacing

with the EUT enclosure are within the 3dB beamwidth of

theantenna.

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f. For testing EUT, the placement of electric field sensors shall be

maintainedasspecifiedin5.4.11.3d.1.

Shieldeden closure

Antenna

Signal

generator

LISN

EUT

Electricfield

sen sor

display

Testsetu p boundary

Electricfi el d 

sen sor

RFa mplif ier

3m

1,5m

EGSE

Figure5‐26:Testequipmentconfiguration

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Shieldedenclosure

Antenna

Antenna

Anten na

x/N(m) x/N(m)

x/2N(m)

1m

Electric field

sensor

Electric field

sensor

Electric field

sensor

Testsetupboundary



Nele ctricfieldsensorpositions

Nantenna po sitions

x(m)=edge‐to‐edgebo u ndarydistance

Electricfield

sensor

Electricfield

sensor

Electricfield

sensor

Figure5‐27:RSElectricfield.Multipletestantennapositions

Signalso u rce

RFamp lifie r

Pow ermeter

Testsetupbounda ry

Directional

cou p ler

Signal

so u rce

Shieldedenc losure

Measurement

receiver

Connectedfo r

systemcheck

Connectedfo r

measurement

Transmit

antenna

Receive

antenna

Figure5‐28:Receiveantennaprocedure

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5.4.11.4 Test procedures

a. The measurement equipment and EUT shall be turned on and waited

untiltheyarestabilized.

NOTE Itis importantat thispointto assessthe testarea

for potential RF hazards and take precautionary

steps to assure safety of test personnel and fire

avoidance.

b. Themeasurementsystemshallbecheck

edandcalibratedasfollows:

1. Procedurewhenusingelectricfieldsensors:

(a) Record the amplitude shown on the electric field sensor

displayunitduetoEUTambient.

(b) Repositionthesensoruntilthelevelmeasuredin(a)aboveis

<10%ofthefieldstrengthtobeusedfo

rtesting.

2. Procedurewhencalibratingwiththereceiveantenna:

(a) Connectasignalgeneratortothecoaxialcableatthereceive

antennaconnectionpoint(antenna removed),setthesignal

sourcetoanoutputlevelof0dBmatthehighestfrequency

to be used in the present test setup and tune the

measurementreceive

rtothefrequencyofthesignalsource.

(b) Verify that the output indication is within ±3dB of the

applied signal, considering alllosses from the generator to

themeasurementreceiverand,ifdeviationslargerthan3dB

are found, locate the source of the error and co

rrect the

deficiencybeforeproceeding.

in Figure 5‐28

, set the signal source to 1kHz pulse

modulation,50%dutycycle,establishanelectricfieldatthe

test frequency by using a transmitting antenna and

amplifier,andgraduallyincreasetheelectricfieldleveluntil

itreachesthelimitspecifiedbyapplicationofclause4.2.8.

(d) Scan the test fre

quency range and record the input power

levelstothetransmitantennatomaintaintherequiredfield.

(e) Repeat procedures 5.4.11.4b.2(a) through 5.4.11.4b.2(d)

whenever the test setup is modified or an antenna is

changed

.

NOTE The ground plane tends to short‐circuit

horizontally polarized fields, so that more

powerisneededtoachievethesamefieldvalue

in horizontal polarization as in vertical

polarization.

c. TheEUTshallbetestedasfollows:

1. Procedurewh

enusingelectricfieldsensors:

(a) Establish an unmodulated electric field at the test start

frequencybyusinganamplifierandtransmit antenna,and

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graduallyincreasetheelectricfieldleveluntilitreachesthe

limitspecifiedbyapplicationofclause4.2.8.

(b) Setthesignalsourceto1kH

zpulsemodulation,50%duty

cycleandapplythemodulation.

strengthlevels in accordancewiththe associated limit,and

monitorEUTperformanceforsusceptibilityeffects.

2. Procedurewhencalibratingwiththere

ceiveantenna:

(a) Remove the receive antenna and reposition the EUT in

conformancewith5.4.11.3e.

(b) Setthesignalsourceto1kH

zpulsemodulation,50%duty

cycle,establishanelectricfieldattheteststartfrequencyby

using an amplifier and transmit antenna, and gradually

increase the input power level  until it corresponds to the

levelrecordedduringthecalibrationroutine.

l test frequencies while assuring the

transmitter inputpower isadjusted inaccordance withthe

calibration data collected, and constantly monitor the EUT

forsusceptibilityconditions.

3. If susceptibility is noted, determine the threshold level in

accordancewith5.2.10.3.

4. Perform test

ing over the frequency range with the transmit

antenna vertically polarized, and repeat the testing with the

transmitantennahorizontallypolarized.

NOTE The settings needed to achieve the specified

fieldlevelinverticalpolarizationarereusedas

isforthetestinhorizontalpolarization.

5. Repeat5.4.11.4c.4foreachtr

ansmitantennapositiondeterminedin

5.4.11.3e.

5.4.11.5 Data presentation

a. Inadditionto5.2.10.4,datapresentationshallprovide:

1. graphicalortabular data listing(receiveantennaprocedureonly)

allcalibrationdatacollectedtoincludeinputpowerrequirements

usedversusfrequency,andresultsofsystemcheckin5.4.11.4b.2(c)

and5.4.11.4b.2(d).

2. the correctio

n factors used to adjust sensor output readings for

equivalentpeakdetectionofmodulatedwaveforms.

3. diagramsorphotographsshowingactualequipmentsetupandthe

associateddimensions.

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5.4.12 Susceptibility to electrostatic discharges

5.4.12.1 Overview

The purpose of this test is to determine the existence of susceptibility to

electromagneticeffectsofelectrostaticdischarges.

5.4.12.2 Test equipment

a. Thetestequipmentshallbeasfollows:

1. DC high voltage supply or an ESD generator as specified in

IEC61000‐4‐2(Edition1.2).

NOTE UseoftheESDgeneratorislesshazardousthan

use of the DC high voltage supply for test

operators.

2. Thedischargeprimarycircuitisconsti

tutedof:

(a) 6kVsparkgap,

NOTE1 Anairsparkgaporanovervoltagesuppressor

inasealedpressurizedenvelopcanbeused.

NOTE2 An air spark gap is less stable and has longer

risetime.

(b) 50pF capacitance, high‐voltage capacitor with inductance

lesstha

n20nH,

NOTE The value can be adjusted at critical damping

dependingonvalue ofcapacitance Cand self‐

inductanceofthedischargecircuit;

(d) 10kresistors(highvoltagespecification).

NOTE Choke resistors prevent high‐frequency

components of discharge from flo

wing in

uncontrolledpathssothedischargeparameters

are not dependent on length and position of

high‐voltagesourcewires.

3. Monitoringdevices:

(a) Two current probes, 100A peak capability and more than

100MHzbandwidth,

(b) Onehigh‐voltageprobe,10kVrange,1MHzbandwidth,

NOTE If the probe input impe

dance is not high

enough,itcan preventgap arcingbylowering

theavailablevoltage.

capability.

NOTE Typical values are 100ns pretrigger time,

displaywindowintherange1μsto10μsand

resolutionbetterthan4ns.

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5.4.12.3 Setup

a. Thetestsetupshallbeasfollows:

1. Maintaina basic testsetup for the EUT as specified in5.2.6. an

d

Figure5‐3.

NOTE It is import

ant at this point to assess the test

area for potential high‐voltage hazards and

take necessary precautionary steps to assure

safetyoftestpersonnel.

2. WhenusinganESDgeneratorasahigh‐voltagepowersupplyas

shownFigure5‐30orFigure5‐31

,itissetinthecontactdischarge

mode.

3. Connect thehigh‐voltageelectrode to the discharge circuitat the

nodebetweenthesparkgapandthecapacitor.

4. Thedischargecircuitlengthisnotlargerthanwhatisnecessaryto

placeinseriesthe20cmlongcoup

lingwire,thedampingresistor,

thedischargecapacitor,thesparkgapandthecurrentprobe.

NOTE Itisimportanttoensurethatthedischargeloop

is as small as possible for achieving the

transient pulse duration objective defined in

5.4.12.4a.2(d).

5. For ca

librationthe test equipmentis configured asshown Figure

5‐30

,andmeetingfollowingprovisions:

(a) thedischargecircuitisnotcoupledtotheEUT,

(b) chokeresistorsarenearthecapacitor,

ESD source is near the damping resistor, at the capacitor

side,

(d) the high voltage probe is mea

suring the voltageacross the

capacitor,groundedatthedampingresistorside.

NOTE Thehigh‐voltageprobeisnotmeanttomeasure

thevoltageduringthedischargebutthevoltage

reachedbeforedischarge

6. Test the EUT by configuring the test equipment as specified in

Figure5‐31andmeetingthefo

llowingprovisions:

(a) thehighvoltageprobeusedforcalibrationisremoved,

(b) theEUTismountedonaconductivegroundplaneusingthe

spacevehiclemount andattach points,and operatedusing

the actual electrical harness, or an EMC test harness of

identicalconstructiontotheact

ualharness.

NOTE It is preferable to use the actual electrical

harness.

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plane by a non‐conductive standoff with high‐voltage

insulationcapability,

(d) fromcalibration,thedischargecircuitis kept unchanged in

size and shape, and tightly electromagnetically coupled

20cmalonganEUTbundle,heldbydielectricbonds

NOTE A ma

ximum separation distance of 1cm

between the injection wire and the outer

circumference of the bundle under test is a

conditionfor achievinga tightelectromagnetic

coupling.

(e) acurrentprobeismonitoringtheprimarycurrentfromthe

ESDsourcenearthedampingresistor,

(f) a current probe is monitoring the c

urrent in the EUT

harness,5cmfromtheEUTconnector.

1

3

4

5 cm

5

6

3

1:EUT

2:EUTorEGSE

3:Accesspan el

4:Interconnectingcable

5:Non‐conductive

standoff

6:Groundingplane

7:HVsource

Figure5‐29:SpacecraftchargingESDsusceptibilitytest



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Damping

resistor

Choke

resistor

Choke

resistor

ESDsparker

orhigh‐voltagedcpowersupply

Sparkgap

Current

probe

High‐voltage

capacitor

High‐voltage

robe

Injectionwire

Figure5‐30:SusceptibilitytoESD:calibrationconfiguration

Damping

resistor

Choke

resistor

Choke

resistor

Current

probe

High‐voltage

capacitor

Bundleunder

test

20cm

coupling

Current

probe

Injectionwire

tightlycoupled

tothebundle

undertest

ESDsparker

orhigh‐voltagedcpowersupply

Sparkgap

Figure5‐31:SusceptibilitytoESD:testequipmentconfiguration

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5.4.12.4 Procedure

a. Thetestproceduresshallbeasfollows:

1. Turnonthemeasurementequipmentandwaituntilitisstabilized.

2. Performacalibrationusingthecalibrationsetup:

(a) Selectthesparkgapdeviceoradjustthesparklengthatthe

voltagebreakdowntobeusedforthetest,

(b) Turnonthehi

ghvoltagegenerator,

valueisstableandwithin30%fromthevaluetobeused

forthetest.

(d) Monitorthetransientcurrentpulse.

NOTE A goal is 30A, 30ns duration at mid‐height,

rise ti

me as short as possible. Means for

minimizing the rise time are adjusting the

damping resistor, reducing the size loop,

checking that both choke resistors are as close

as possibletothe capacitor,and technology of

the spark gap (nature of gas and shape of

electrodes).

(e) Recordthelastcurrentan

dvoltagecouple,displayedwitha

commontimereference,

(f) Repeat 5.4.12.4a.2(d) an

d 5.4.12.4a.2(e) with opposite

polarity.

3. TesttheEUTasfollows:

(a) FullypowertheunitduringthecompleteESDtest,

(b) Turnonthehighvoltagegenerator,

pulsedirectionofatleast15positiveand15negative,

(d) Record the la

st primary and secondary current couple,

displayedwithacommontimereference,

(e) Repeat 5.4.12.4a.3(c) and 5.4.12.4a.3(d) on ea

ch bundle

interfacingwitheachelectricalconnector.

5.4.12.5 Data presentation

a. Supersedingclause5.2.10.4,datapresentationshallbeasfollows:

1. Provide tables showing statements of compliance with the

requirement and the induced current level for each interface

connector.

2. Provide oscilloscope records taken during calibration and EUT

testingprocedures.

3. Therequirementof5.2.10.3doesnotap

ply.

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Annex A (informative)

Subsystem and equipment limits

A.1 Overview

ThereisnosinglemethodforachievingEMC.

 Lowsusceptibleequipmentisfortelecommunicationspacecraftflyingin

a severe EMI environment due to on board large power and possible

residualESD.

 Low emissionequipment is for scientific spacecraft for preserving high

sensitivityofdetectors.

Therefore,itisnotpossibletodefineasamesetofli

mitsforallequipmentsof

allspacecraftandlaunchers.TheEMCCPisthevehiclefortailoringlimitsand

testmethods.

However,itisalegitimatedemandofequipmentsuppliertoaskforEMIlimits

outsidetheframeofa specificproject.Conductedandradiatedemissionlimit

s

andsusceptibilitylimitsdefinedhereafterarerecommendedforspaceprojects.

A.2 CE on power leads, differential mode,

30 Hz to 100 MHz

Indifferentialmode,oneachindependentpowerbus,conductedemissionson

powerleads,inducedbyloads,canbelimitedinthefrequencydomainunder

followingconditions:

 limitsareintherangeextendingfrom30Hzto100MHz,

 a maximum I

NB in units of dB referenced to 1μA is a function of

frequencydefinedinFigureA‐1,

 inthelowfreq

uencyrangethelimitI

CEinunitsofdBreferencedto1μA

(dBμA)isfunctionoftheconsumptionIdc(inamperes)oftheequipment

ontheline,seeFigureA‐1:



Idc<1A  ICE=80

1A<I

dc<100A I=80+20log10(Idc)

dc>100A  I=120

The mode is called “differential” because measurements

 are done

separatelyonhotandreturnwires,howeveritcomprisescommonmode

components.

“Independent”meansconnectedtoseparatepowersources.

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100 Adc

30 Adc

10 Adc

3 Adc

1 Adc

100

110

120

130

10 100 1 000 10 000 100 000 1 000 000 10 000 000 100 000 000

Frequency (Hz)

Current limit (dBµA)

FigureA‐1:Powerleads,differentialmodeconductedemissionlimit

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A.3 CE on power leads, in-rush currents

The inrushcurrent of anequipment on the powerlines can be limited inthe

time domain with following characteristics in order to limit the voltage

transientsonthepowerbus:

 During any nominal change of configuration, the rate of change of

currentislimitedto5×10

A/s.

 At switching ON the rateof change of current is lower than 2×10

A/s,

absolutevalueofriseandfallslopes.

Specific requirements are usually defined for pulsed radars, plasma

thrusterspowerunits.

Limitscanalsobespecifiedforthefollowingcharacteristicsinordertoachieve

compatibilitywiththeupstreamprotectionsofthespacecraftpowersubsystem.

 inrushcurrentduration(inms);

 totalch

arge(inmC);

 inrushcurrentslope(inA/μs).

A.4 CE on power and signal leads, common mode,

100 kHz to 100 MHz

The conducted emissions on bundles in common mode can be limited with

followingcharacteristics:

 limitsareintherangeextendingfrom100kHzto100MHz,

 I

CEin unitsof dBreferencedto 1μA(dBμA) islowerthan thecurve of

FigureA‐2,



 the same limit is defined for all cables taken together or bundle per

bundle.

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100,000 1,000,000 10,000,000 100,000,000

Frequency (Hz)

Current limit (dBµA)

FigureA‐2:Commonmodeconductedemissionlimit

A.5 CE on antenna ports

Spurious conducted emissions on antenna ports can be limited to following

values:

 receivers34dBμV,

 transmitters(stand‐bymode):34dBμV,

 transmitters(transmitmode):

 harmonics, except the second and third, and all spurious

emissions:80dBdownthelevelatthefundamental,

 thesecondandthirdharmonics50+10logP(wherePisthepeak

poweroutput)or80dBwhicheverisless.

Equipment with antennas permanently mounted are not in the

scopeofthisclause.

A.6 DC magnetic field emission

A.6.1 General

The DC magnetic field emission generated by subsystems, equipment and

elementarycomponentsislimitedorcharacterizedforfollowingpurposes:

 forestablishingthemagneticmomentumofthewholespacevehicle,

 forestablishingthecompositeDCmagneticfieldatcriticallocations.

The components of the magnetic emission are DC current loops,

soleno

ids,thepermanentfieldofhardmagneticmaterials(magnets)and

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the induced magnetic moment by the Earth‐field on soft magnetic

materials,includinghysteresis.

A.6.2 Characterization

Following parameters of magnetic properties can be determined or

characterized:

 permanent induction parameters of operatingEUT bydetermination of

magneticinductionBinunitsofμTundermagneticzero‐fieldcondition,

 inducedparametersofnotoperatingEUTbydeterminationofmagnetic

inductionBinunitsofμTwhenimmergedinaun

iformcontrolledfield

of30μT(calibratedinabsenceofEUT)ineachof3rectangularsemi‐axes,

inbothdirections,

 determinationoftheDCmagneticfieldemissionisperformedbyeither

measurementorsimilarity,

 determination by similarity is applied to equipment or subsystems

coming from other progra

ms, where re‐use as it is or re‐use with only

littlemodification.

 assessmentofthedipolemodelbymeasurementofmagneticinductionB

at least at two different distances r and comparing respective products

(m)B(μT),

NOTE Distancesintherange0,5mto1,5mcanbeused.

 magnitudeofthemagneticdipole,(whentheequipmentisassimilatedto

adipole)either:

 byitsmagneticmoment,or

 bythemagneticinductionatsomedistanceofreference.

When the unit is assimilated to a dipole, the inverse cube law

dependence with distance applies, the following relation (worst

case) is used for the equivalence between the magnetic moment

andtheinductionatthedistanced:









mdAmM102TB 





 characterizationofthemagneticsourcewhenthedipoleapproximationis

inadequate,eitherby:

 amultiplemomentmodel,or

 asphericalharmonicsmodel,or

 themagneticinductionatthedistanceofmeasurement.

ThedistanceofreferenceisspecifiedbytheEMCABinfunctionof

the size of the space vehicle or of the actual distance between

magneticsourcesandsusceptibleequipment.

Themagneticinductionisaroughindicationthatcanbesufficient

forsomeapplications.

Themult

iple‐momentmodelorthesphericalharmonicsmodelisa

precisedeterminationsometimesneededforsensitivepayloads.

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84

Specific characterization methods are implemented for the

multiple‐momentmodelorthesphericalharmonicsidentification.

A.6.3 Limit

The DC magnetic emission of subsystems or equipments can be limited at a

levelof0,2μTatadistanceof1mfromanyfaceoftheequipment.

This limit corresponds to dipole‐like equipment with a magnetic moment of

1Am

.

The limitation is achieved through a combination of techniques: current loop

areaminimizationandcoaxialortwistedcablesuse,non‐magneticmaterialuse,

magneticshieldsuse,compensationtechniqueswithmagnets.

A.7 RE, low-frequency magnetic field

From a few hertz to 50kHz, the magnetic‐field radiated emissions can be

measured.

Measurement can be performed at several distances for characterizing the

accuracyofadipolemodel.

If the EUT can be assimilated to a magnetic dipole, emission limits are

expressedbyitsmagneticdipolemomentum.

Nolimitisde

finedatequipmentlevel.

Themeasurementisonlyforcharacterizationandusefultoverifycomplianceat

systemlevelthroughanalysis.

Techniquesfor fulfillingEMC requirement atsystem levelarean appropriate

groundingnetwork,magneticshields,anoptimizedlocationofequipmentson

thespacevehicle.

A.8 RE, low-frequency electric field

From a few hertz to 30MHz frequency range the electric‐field radiated

emissionsofunitscanbemeasured.

The frequency limits are determined by the EMCAB from payload

specifications.

TheelectricfieldemissionfromtheequipmentisexpressedinunitsofdBabove

1μV/matadistanceof1m.

Measurement

satseveraldistances areperformedforcharacterizingthe decay

law.

Nolimitisdefinedatequipmentlevel.

Themeasurementis onlyfor characterizationand usefultoverifycompliance

withsystemlevelrequirementsthroughanalysis.

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Techniques for fulfilling EMC requirement at system level are reduction of

common mode conducted emission from bundles, and electric shields or

appropriatelocationofequipmentsonthespacevehicle.

A.9 RE, electric field, 30 MHz to 18 GHz

In the 30MHz to 18GHz frequency range, electric‐field radiated‐emissions

fromequipmentandsubsystemincludinginterconnectingcablescanbelimited

underfollowingconditions:

 thelimitappliesto:

 non‐RFequipment,

 RF equipment connected to passive loads or EGSE, in nominal

mode,atnominalpower,

 thelimitisdefinedbythecurveinFigureA‐3,



 thelimitisforbothhorizontallyandverticallypolarizedfields,

 the limit comprises notching lines for launchers or spacecraft receiving

bandsnotrepresentedinFigureA‐3

.

Additional requirements can apply beyond 18GHz if SHF or EHF

payloads are present. These are beyond the scope of the present

standard.

For equipment having all internal rise times longer than 35ns, the

specifiedupperfrequencylimitcanbereducedto1GHz.

For non‐RF equipment if the emissio

n is lower than 20dB below the

requirementbetween500MHzand1GHzthespecifiedupperlimitcan

bereducedto1GHz,withtheexceptionofnotchesabove1GHz,stillto

betested.

100

1.E+07 1.E+08 1.E+09 1.E+10 1.E+11

Frequency (Hz)

E-field (dBµV/m)

FigureA‐3:Radiatedelectricfieldlimit

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A.10 CS, power leads, differential mode, 30 Hz to 100 kHz

The following levels, known to be achievable and already specified in other

standards or project specifications, are proposed for the susceptibility test on

thepowerleadsspecifiedinclause5.4.7.



 theinjectedvoltagelevelisequalorlargerthanthelevelshowninFigure

A‐4,

 alimitationoftheinjectedcurrentbeforethespecifiedvoltageisreached

isapplied:

 thelimitofcurrentis1Arms

 thevoltagelevelwhenthecurrentlimitisreachedismeasuredand

reported.

Thecurrentappliedisreported.

Independentpowerlinesaretestedseparately.

NOTE Independentmeans“connectedtoseparatepower

sources”.

Exceptinthecaseofstructurereturn,foreachpowerline,hotandreturnwires

aretestedseparately.

NOTE Incaseofstructurereturn

,thetestisonlyapplied

tohotwires.

Thetestsignalcoversthe[30Hz‐100kHz]frequencyrange.

0,2

0,4

0,6

0,8

1,2

10 100 1 000 10 000 100 000 1 000 000

Frequency (Hz)

Voltage (Vrms)

FigureA‐4:Conductedsusceptibilitylimit,frequencydomain

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A.11 CS, power and signal leads, common mode, 50 kHz to

100 MHz

The following levels, known to be achievable and already specified in other

standards or project specifications, are proposed for the susceptibility test on

thepowerandsignalleadsspecifiedinclause5.4.8:



 thecommonmodelevelof3voltspeaktopeakorlargerisapplied,

 thelimitofthecurrentinducedonthebundleis3Apeak‐to‐peak,

 thetestsignalispulsemodulated,

NOTE Square wave modulation is a particular case of

pulsemodulation.

 thedutycyc

leisdependingonthecarrierfrequency,accordingtoTable

A‐1.

Thesamelevelisappliedtoallcablestogetherortobundlestakenseparately.

Thecommonmodeinducedcurrentonthebundleisreported.

Thetestsignalcoversthe[50kHz‐100MHz]frequencyrange.

TableA‐1:Equipment:susceptibilitytoconductedinterference,testsignal

Frequencyrange Pulserepetitionfrequency Dutycycle

50kHz‐1MHz 1kHz 50%(squarewave)

1MHz‐10MHz 100kHz 20%

10MHz‐100MHz 100kHz 5%



A.12 CS, power leads, short spike transients

The following levels, known to be achievable and already specified in other

standardsorprojectspecifications,areproposedforthetransientsusceptibility

testonthepowerlinesspecifiedinclause5.4.9:

 aser

iesofpositivespikes,thenaseriesofoppositespikessuperposedon

thepowervoltageshallbeapplied,

 atanytimestep,thevoltagespikeamplitudeis:

 +100% or‐100% of the actual line volta ge if the nominal bus

voltageislowerthan100V,FigureA‐5.

 +50% or‐100% of the actual line voltage if the nominal bus

voltageisequalorlargerthan100V

Level0inFigureA‐5repr

esentstheDCbusvoltage.

OnlythepositivespikeisrepresentedinFigureA‐5.

When a negative spik

e is applied, the absolute instantaneous

transientvoltagegoesdownto0,nevernegative.

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 testsareperformedwithtwospikedurations,thefirstzero‐crossingisat

T=150nsandatT=10μs.

Independentpowerlinesaretestedseparately.

Independentmeans“connectedtoseparatepowersources”.

-60

-40

-20

100

120

0 0,5 1 1,5 2 2,5 3 3,5 4 4,5

Normalized time (in units of T=150ns or T=10µs)

Percentage of line voltage

FigureA‐5:CS,voltagespikeinpercentageoftestbusvoltage

A.13 RS, magnetic field, 30 Hz to 100 kHz

The following levels, known to be achievable and already specified in other

standardsorprojectspecifications,areproposedfortheradiatedsusceptibility

test,magneticfield,specifiedinclause5.4.10:



 the amplitude of the test signal is equal to or larger than the level in

FigureA‐6,

 thesourceisloca

tedat5cmofanyfaceoftheEUT.

Thesignaltestcoversthe[30Hz‐100kHz]frequencyrange.

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100

110

120

130

140

150

160

170

180

190

10 100 1 000 10 000 100 000

Frequency (Hz)

Limit level (dBpT)

FigureA‐6:Radiatedsusceptibilitylimit

A.14 RS, electric field, 30 MHz to 18 GHz

The following levels, known to be achievable and already specified in other

standardsorprojectspecifications,areproposedforradiatedsusceptibilitytest,

electricfield,specifiedinclause5.4.11:



 theamplitudeofthetestsignalis:

 equipment in the vicinity of beams, outside of the main frame

consideredasaFaradaycage:10V/m,

 An electric field of more than 10V/m is applied if RF analysis

demonstrates thatthe expected electric fieldseen inflight by the

equipmentislarger,

 equipmentfarfrommainlobesandsecondarylobes,outsideofthe

mainframe:1V/m,

 equipmentinsidethemainframe:1V/m.

AtRFtransmitfrequencies,theRSlevelshouldbetailoredup;at

RF receive frequencies, the RS level should be tailored down for

receivers.

 anAMorPAMtestsignalisused,

 bothhorizontallyandverticallypolarizedfieldsareused,

 circular‐pola

rizedfieldsarenotused.

Thesignaltestcoversthe[30MHz‐18GHz]frequencyrange.

Additionalrequirementscana pplybeyond18GHzifSHForEHFpayloadsare

present.Thesearebeyondthescopeofthepresentstandard.

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A.15 Susceptibility to electrostatic discharge

The following dispositions, known to be achievable and already specified in

otherstandardsorprojectspecifications,areproposedfortheESDtestspecified

inclause5.4.12.



Thetestisperformedonfollowingequipment,includingornotdigitalcircuits:

 unitscomprisinghigh‐voltagepowersources,

 unitsman‐handledduringnormaloperation,

Thisconditionappliestomanned‐flight,

For man‐handled equipment, an ESD test by the contact discharge

methodasdefinedinIEC‐61000‐4‐2,ismorea

ppropriated,

 unitsoutsidethemainframeofthespacevehicledesignedasaFaraday

cage,

 units connectedto sensors,actuators, orother units located outsidethe

main framedesigned asa Faraday cagewith the exception ofthe solar

arraypowerbus.

SpecifictestsdefinedinECSS‐E‐ST‐33‐11area

ppliedtoEEDs.

Testofmodelsexpectedtobeortobecomeflightmodelsisnotperformed.

ESDtestingcancauselatentfailuresoftestarticle.

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Bibliography

ECSS‐S‐ST‐00 ECSSsystem–Description,implementationandgeneral

requirements

MIL‐STD‐461E Requirementsforthecontrolofelectromagneticinterference,

characteristicsofsubsystemsandequipment,20August

1999;DepartmentofDefence,USA.

